An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.

The subject invention includes methods and apparatus for joining treads. Such methods include the step of providing a first tread portion and a second tread portion for forming a joined tread, each tread portion comprising a section of tire tread extending lengthwise from a terminal end. Additional steps include providing a first fixture configured to retain the first tread portion and a second fixture configured to retain the second tread portion and securing the first tread portion into the first fixture and securing the second tread portion into the second fixture, each of the first and second fixtures being arranged within the first and second fixtures such that the terminal end of each tread portion is in communication with a joining side of each fixture. The methods further include directing the terminal ends towards each other and into forceful engagement with an elastomeric joining material arranged between the terminal ends.

An apparatus and a method for the processing of semi-finished sacks and a gluing station for semi-finished sacks include a feed element and a guide element. Semi-finished sacks having more complicated shapes, such as tubular pieces having open bottom squares with valve patches inserted therein, tend to be subjected to a partial gluing process or even suffer damage during the process of glue application in the nozzle clearance. Therefore, at least one feed element is provided, which is disposed upstream of a glue-application gap in the transport direction of the semi-finished sacks, and which together with the guide element defines a feed region of the semi-finished sacks to the application head. Components of the semi-finished sacks are guided through the feed region, which tapers in the transport direction of the semi-finished sacks.

An overlay applicator tray can include a cradle including a device slot. The device slot can be configured to securely hold an electronic device in the cradle. The overlay applicator tray also can include an overlay applicator. The overlay applicator can include an overlay layer and an adhesive release liner. The overlay layer can include a top side and a bottom side. The bottom side can be configured to be adhered to a screen of the electronic device. The adhesive release liner can be removably attached to the bottom side of the overlay layer. The overlay applicator tray additionally can include an alignment piece coupling the cradle to the overlay applicator. The alignment piece can align the overlay layer of the overlay applicator with the screen as the overlay layer is applied to the screen when the electronic device is securely held in the device slot. Other embodiments are provided.

A machine including a cradle configured to hold an electronic device. The machine also can include an alignment base comprising pins configured to engage with an alignment mechanism of an overlay applicator. The overlay applicator can include an overlay configured to be applied to a screen of the electronic device. The alignment base can include a first side and a second side adjacent to the first side. The pins can be located on the first side and the second side. Other embodiments are described.

A machine including a base. The machine also can include a cradle configured to hold an electronic device. The machine further can include an alignment base configured to engage with an alignment mechanism of an overlay applicator. The overlay applicator can include an overlay configured to be applied to a screen of the electronic device. The machine also can include a lid hingedly attached to the base. The machine can be configured such that the lid can be rotated with respect to the base between an open configuration and a closed configuration. The machine can be configured in the closed configuration to facilitate applying the overlay of the overlay applicator to the screen of the electronic device. Other embodiments are described.

An overlay applicator tray including a cradle including a device slot configured to hold an electronic device. The overlay applicator tray also can include an overlay applicator. The overlay applicator can include an overlay layer and an adhesive release liner. The overlay layer can include an adhesive side configured to be adhered to a screen of the electronic device. The adhesive release liner can be removably attached to the adhesive side of the overlay layer. The overlay applicator tray additionally can include an alignment piece coupling the cradle to the overlay applicator. The alignment piece can be configured to align the overlay layer of the overlay applicator with the screen as the overlay layer is applied to the screen when the electronic device is held in the device slot. The overlay applicator can be pre-aligned and attached during manufacturing with the device slot of the cradle using the alignment piece. The overlay applicator tray further can include a pull tab configured to be pulled to remove the adhesive release liner from the adhesive side of the overlay layer and expose the adhesive side of the overlay layer. Other embodiments are described.