A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

A disassembling method of a display module includes attaching an auxiliary sheet to a display module by using an adhesive tape, the display module including a display panel attached to a window by an adhesive layer, and the auxiliary sheet attached to the display module including an external force applying portion exposed outside an outer edge of the display module; cooling the display module and the auxiliary sheet attached thereto by the adhesive tape; and after the cooling of the display module and the auxiliary sheet attached thereto, separating the display panel and the window from each other by applying force to the external force applying portion of the auxiliary sheet attached to the display module.

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

The present application provides a separation apparatus for a flexible display panel, includes a support post, a power unit and a vacuum suction block; wherein the supporting post is used to support the separation apparatus on the relatively upper side of the rigid substrate to be separated; the vacuum suction block is in communication with the support post, and is used to suck and connect the rigid substrate to be separated; and one end of the power unit is connected to the support post, the other end is rotatably connected with the vacuum suction block, and is used for controlling the vacuum suction block and the rigid substrate to be separated together to be separated from the flexible display panel. The present application also provides a method for separating a flexible display panel.

A cuff-blade attachment bushing removal tool system includes an alignment plate comprising alignment holes defined through the alignment plate in a pattern of a plurality of bushing holes of a blade root, a bladder plate connected to the alignment plate, and a bladder positioned on the bladder plate such that a gap is formed between the bladder and the alignment plate to receive a blade root to align the alignment holes and the bushing holes of the blade root, wherein the bladder is transitionable between an uninflated position where the blade root can be inserted into the gap and an inflated position where the blade root is clamped between the bladder and the alignment plate.

Method and device for delamination/dismantling of multi-layer systems SM comprising several layers including at least one organic layer, wherein the layers are separated by interfaces, characterized in that it comprises at least the following steps: Mixing the multilayer system with a fluid composed of at least one gas having the particularity of causing the swelling of at least one of the layers and one or more non-reactive liquids having the particularity of allowing the separation of each layer unitarily or of subsets of layers composing the multilayer system without degradation of the constituents of the layers, the gas/liquid fluid being raised in temperature and pressure, Recovering separately at least one or more layers or a subset of undegraded layers.

The present disclosure provides a method for separation of an organic film from a solar cell module, the separation method including the following steps: treating the solar cell module by a heat treatment in combination with a ultrasonic treatment; and performing separation of the treated solar cell module by buoyancy, thereby achieving the separation of the organic film from the module. The present disclosure uses the heat treatment in combination with the ultrasonic treatment to separate the organic film of the solar cell module, so that a stripping rate of the solar cell module reaches 97% or more, and the organic film after detachment does not adhere to the active material, the active material layer remains intact, the surface is clean and has no gelatin spots, and a loss rate is 1% or less, and thus the method is efficient, convenient, and easy to industrialize.

A unit for automatically removing labels from a pharmacy container operates by heating the labels to soften the pressure sensitive adhesive thereon. After the adhesive is softened, the containers are rotated and brought into contact with a scrapper which peels off the label. The removed label falls into a container or directly into a shredding mechanism that is integral with the label remover. One embodiment of the device uses a chilled mandril inserted into the container to keep the container from softening when heat is applied to facilitate label removal.

A system and method for removing a backing from a ply of composite material is disclosed. The system includes a roller having a roller axis and a roller surface that circumscribes the roller axis. The system also includes an adhesion feature disposed on the roller surface. The system further includes a roller drive to move the roller along a travel path that is perpendicular to the roller axis and to rotate the roller about the roller axis.