A component feeder for feeding components to a component feeding position using a component feeding tape including a carrier tape holding the components at equal intervals and a covering tape attached to the upper surface of the carrier tape. The component feeder includes a driving sprocket and a tape guide. The driving sprocket is configured to feed the component feeding tape to the component feeding portions. The tape guide includes a pressing surface to press an upper surface of the component feeding tape fed to the component feeding position. The tape guide includes a component exposing portion and an adjustment portion. The component exposing portion includes an inserting portion to be inserted between the carrier tape and the covering tape. The adjustment portion is configured to adjust a projection amount of the inserting portion from the pressing surface.

A carbon fiber recovery method for recovering carbon fibers from a fiber reinforced plastic member having a carbon fiber reinforced plastic (CFRP) layer on which a glass fiber reinforced plastic (GFRP) layer is formed is provided. This method includes: forming a cut that penetrates through the GFRP layer and reaches the CFRP layer in the fiber reinforced plastic member; causing a heated phosphorus-containing solution to penetrate from the cut and separating the CFRP layer from the GFRP layer in the vicinity of an interface between the CFRP layer and the GFRP layer; and dissolving, by a resin solution, a resin part of the CFRP layer from which the GFRP layer has been removed and then recovering the remaining carbon fibers.

A stand-alone apparatus for cutting a web of media or tag stock into individual units for use downstream of a printer. The apparatus may cut vinyl, plastic, or RFID stock material in both back and forth directions. The apparatus comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly is easily interchangeable and comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The apparatus may be powered by and or in hardline or wireless communication with a printer, or may further comprise a computer microprocessor, memory and user interface to function wholly independent from a printer.

A method for manufacturing a display device includes a stage; a first guide unit positioned on one side of the stage in a first direction and extending in a second direction crossing the first direction; and a first peeling unit disposed on the first guide unit, wherein the first peeling unit includes a first moving part configured to move along the first guide unit, a first rotating part coupled to the other side of the first moving part in the first direction and configured to rotate about an axis extending in the first direction, and a first gripping part coupled to the other side of the first rotating part in the first direction and disposed to overlap the stage.

A wafer de-bonding device comprises a stage (1) for holding a device wafer and a carrier wafer bonded together, and a tool (2) with a gas outlet (2.2) disposed in proximity to the stage (1) through an adjustment device for control the tool (2) to move towards or away from the stage (1), the tool (2) being provided with a bit (2.1) to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet (2.2) being provided on the tool bit (2.1), the tool (2) being further provided with a gas inlet (2.3) in communication with the gas outlet (2.2), the gas inlet (2.3) being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage (2). The wafer de-bonding device has a high degree of automation and simple operations.

In a peeling starting portion preparing method of a laminate, for the laminate including a first substrate and a second substrate peelably attached via an adsorption layer, a knife is inserted with a predetermined amount from an end surface of the laminate into an interface between the first substrate and the adsorption layer so as to prepare the peeling starting portion at the interface. The knife includes a main body portion, a cutting edge portion continuous with the main body portion and tapered in a side view, and a ridge line which is a boundary between the main body portion and the cutting edge portion, and at least a part of the adsorption layer is scraped off by a ridge line portion including the ridge line.

Methods of processing a first substrate bonded to a second substrate include moving a wire along an interface to propagate a debonding front and debond the first substrate from the second substrate. In some embodiments, the first substrate includes a thickness less than or equal to about 300 m. In further embodiments, the wire includes a tensile strength less than a critical failure stress of the first substrate. In still further embodiments, the wire is configured to conform to a shape of the debonding front during the step of moving the wire such that one or more edges of the first substrate are debonded from the second substrate prior to a debonding of a corresponding interior portion of the first substrate from the second substrate.

The present invention provides method and apparatus for removing a sealant from a surface. More specifically the present invention provides methods an apparatus for efficiently and consistently removing polysulfide sealant from a surface on an aluminum airplane wing without damaging the wing.

A stand-alone apparatus for cutting a web of media or tag stock into individual units for use downstream of a printer. The apparatus may cut vinyl, plastic, or RFID stock material in both back and forth directions. The apparatus comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly is easily interchangeable and comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The apparatus may be powered by and or in hardline or wireless communication with a printer, or may further comprise a computer microprocessor, memory and user interface to function wholly independent from a printer.

A combination printer and cutting device for printing upon and cutting a web of media or tag stock into individual units. The device may cut vinyl, plastic, or RFID stock material as it moves through the printer in both back and forth directions. The device comprises a printer and a cutting apparatus that is further comprised of a carriage assembly and a movable cutter assembly. The cutter assembly is easily interchangeable and comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The cutting apparatus is adaptable for use with both new and existing printers.