A method of reducing label waste that employs a stand-alone or printer attached apparatus for cleanly and efficiently cutting a web of media or tag stock into individual units. The apparatus used by the method may cut vinyl, plastic, or RFID stock material in both back and forth directions without sacrificing cut quality, and preferably comprises a housing, a carriage assembly and a movable cutter assembly. The cutter assembly comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The method involves using the cutting apparatus to make a series of cuts as the label material is incrementally advanced through the cutting apparatus.

A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.

A method of recycling a solar cell module includes an enclosing layer that encloses a solar cell therein, a light-receiving surface layer laminated on one surface of the enclosing layer, and a back sheet laminated on the other surface of the enclosing layer, the method including: a first removing step of mechanically removing the back sheet; a second removing step of mechanically removing from a side on which the back sheet is removed the entire solar cell and the enclosing layer to such a depth that a part of the enclosing layer having a predetermined thickness remains on the light-receiving surface layer, after the first removing step; and a third removing step of removing the part of the enclosing layer remaining on the light-receiving surface layer by immersion in a solution that causes swelling of the enclosing layer, after the second removing step, thereby improving an overall efficiency.

In accordance with these and embodiments of the present disclosure, an information handling system may include a circuit board, an information handling resource electrically coupled to the circuit board, and a mechanical mechanism configured to receive a user interaction at a mechanical mechanism, and, in response to the user interaction, separate a mechanical bond between the information handling resource and a component by applying a controlled force of the mechanical mechanism to the information handling resource at a controlled location of the information handling resource.

A feeder includes a discharge guide member which is provided on a feeder main body to communicate with a tape discharging section and guides such that a carrier tape which is discharged from the tape discharging section heads downward, a peeling member which is provided on the feeder main body and peels a cover tape from the carrier tape before the carrier tape which is conveyed by a front side sprocket reaches the tape discharging section, and a contacting and positioning member which is provided on the feeder main body, causes the cover tape which covers the carrier tape which is conveyed by the front side sprocket to contact the peeling member, and positions the carrier tape from which the cover tape is peeled and which is discharged from the tape discharging section at a regular position inside the discharge guide member.

Methods of preparing laminate test samples for subsequent testing, including positioning the test sample within a fixture body, securing the test sample within the fixture body, applying a separating force to urge a first layer portion of the test sample away from a second layer portion of the test sample, and separating the first layer portion from the second layer portion to create a predetermined separation length along the test sample, provided that the predetermined separation length is established by an interaction between the fixture body and the test sample as the first layer portion is separating from the second layer portion.

The subject invention is directed to a device and method for removing an article attached to a mounting surface by an adhesive mounting. Preferably, the device comprises a first grip, a second grip and a filament having a first end attached to the first grip and a second end attached to the second grip. The filament operates such that when placed between the mounting surface and the adhesive mounting and pulled by the first and second grip in a direction along a bonding plane, it operates to separate the adhesive mounting from the mounting surface.

Methods, systems and devices to divide a layer of a first material from another material, to which is attached, are provided. Particularly, for the separation of the PVC from a modular carpet. By the use of a parallel blades mechanism that through an opposite counterpart apply at least a shear stress over the material of the modular carpet to tear the PVC layer and divide it. The carpet is preheated to facilitate the process of division and reuse of said PVC.

A wafer de-bonding device comprises a stage (1) for holding a device wafer and a carrier wafer bonded together, and a tool (2) with a gas outlet (2.2) disposed in proximity to the stage (1) through an adjustment device for control the tool (2) to move towards or away from the stage (1), the tool (2) being provided with a bit (2.1) to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet (2.2) being provided on the tool bit (2.1), the tool (2) being further provided with a gas inlet (2.3) in communication with the gas outlet (2.2), the gas inlet (2.3) being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage (2). The wafer de-bonding device has a high degree of automation and simple operations.

In accordance with these and embodiments of the present disclosure, an information handling system may include a circuit board, an information handling resource electrically coupled to the circuit board, and a mechanical mechanism configured to receive a user interaction at a mechanical mechanism, and, in response to the user interaction, separate a mechanical bond between the information handling resource and a component by applying a controlled force of the mechanical mechanism to the information handling resource at a controlled location of the information handling resource.