A device body comprises: a winding roller that is provided so as to contact with a flooring material sheet bonded to a floor and on which is wound the sheet that is stripped from the floor starting from a contact portion with the sheet; a driving means that, by rotationally driving the winding roller, winds the sheet onto the winding roller and strips the same from the floor, and that advances the device body by the winding roller being pushed toward the floor by the reactive force of the removal and rolling on the sheet; and a guiding means that discharges the sheet being stripped from the floor in front of or to the side of the direction of advancement of the device body.

Described methods and apparatus provide a controlled perturbation to an adhesive bond between a device wafer and a carrier wafer. The controlled perturbation, which can be mechanical, chemical, thermal, or radiative, facilitates the separation of the two wafers without damaging the device wafer. The controlled perturbation initiates a crack either within the adhesive joining the two wafers, at an interface within the adhesive layer (such as between a release layer and the adhesive), or at a wafer/adhesive interface. The crack can then be propagated using any of the foregoing methods, or combinations thereof, used to initiate the crack.

A component supplying apparatus comprises an inclined straight path P2 which is for the carrier tape and which extends obliquely upward, a horizontal straight path P3 which is for the carrier tape and which extends in the horizontal direction from a front end of the inclined path P2 and runs through the component supply position Q, a first sprocket wheel engaging with the feed holes of the carrier tape within the inclined path P2, a guide member locating the carrier tape in the width direction within the horizontal path, a top tape removing device disposed above the inclined path P2 between the first sprocket wheel and the horizontal path P3 and partially removing the top tape from the base tape so as to expose the components, and a sprocket wheel drive device rotating the first sprocket wheel.

Provided is a peeling apparatus configured to suppress damage to a substrate, by forming a peeling start point. The peeling apparatus separates a superimposed substrate made by joining first and second substrates into the first and second substrates, and includes a blade configured to form a notch as a peeling start point between the first and second substrates, and an inspection unit configured to inspect a state of a cutting edge of the blade. The inspection unit includes an imaging unit configured to image the cutting edge of the blade, and an image processing unit configured to process an image of the imaging unit.

A first surface of a debonder defines a recess that holds an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface. The second surface includes suction openings that deliver suction to the recess. A third surface of the debonder substantially connects the first and the second surfaces and includes an opening dimensioned to limit a pressure differential between the recess and outside the recess during application of the suction.

A first surface of a debonder defines a recess to hold an assembly that includes a wafer bonded to a carrier plate having a first diameter that is larger than a second diameter of the wafer. The carrier plate includes a peripheral area not covered by the wafer, and when the wafer of the assembly is placed within the recess, a portion of the peripheral area of the carrier plate engages a portion of the first surface. A second surface of the debonder is disposed in the recess and is separated from the first surface, where the second surface includes suction openings that deliver a suction force to the recess, and a portion of the second surface is in contact with a heat source.

A method for manufacturing a display device includes a stage; a first guide unit positioned on one side of the stage in a first direction and extending in a second direction crossing the first direction; and a first peeling unit disposed on the first guide unit, wherein the first peeling unit includes a first moving part configured to move along the first guide unit, a first rotating part coupled to the other side of the first moving part in the first direction and configured to rotate about an axis extending in the first direction, and a first gripping part coupled to the other side of the first rotating part in the first direction and disposed to overlap the stage.

A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.