A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.

A transfer and dispensing apparatus is disclosed for the conveying and separation of packaging material, cushions or pillows when needed by the operator. When a packer working over a conveyor receives a box that requires void fill, an operating switch such as a foot pedal is depressed to dispense pillows from the apparatus and into the box in a connected strip. When the operating switch is released, the apparatus stops dispensing pillows, separates the continuous strip of pillows along a transverse perforation in the strip, and ejects the end of the separated segment. The packer can then complete packing the box by placing the severed end of the pillows into the box, advance to the next box, and repeat the process. The transfer and dispensing apparatus may be positioned in any convenient location including adjacent to, above or attached to the inflation device.

A cutting method and cutting stage of toughened glass with which a piece of toughened glass is divided into unit pieces of toughened glass. The cutting method cuts a piece of toughened glass which is strengthened by forming a compressive stress in the surface of a raw glass plate. The method includes the steps of reducing the central tension inside a cutting portion of the piece of toughened glass that is to be cut by concavely bending the cutting portion; and cutting the piece of toughened glass by forming a median crack in the cutting portion.

A method for manufacturing an acoustic wave device includes: forming an altered domain in a supporting substrate by irradiating the supporting substrate with a laser light, a piezoelectric substrate being joined to an upper surface of the supporting substrate; forming a groove on an upper surface of the piezoelectric substrate so as to overlap with the altered domain; and cutting the supporting substrate at the groove.

A dividing device divides a wafer from an ingot by slicing the ingot by using a dividing layer which is formed by relatively moving a laser beam to a predetermined depth of the ingot from one of both end faces of the ingot. The dividing device for a wafer includes: first fixing part that fixes the other of the both end faces of the ingot; second fixing part that is arranged on a first central axis line of the ingot so as to face the first fixing part and fixes the one of the both end faces of the ingot; and tension part that apply a tensile force to the ingot via the first and second fixing parts. The tension part rotates one end of the dividing layer with another end as a fulcrum so as to generate moments for slicing the ingot with the dividing layer as a boundary.

A transfer and dispensing apparatus is disclosed for the conveying and separation of packaging material, cushions or pillows when needed by the operator. When a packer working over a conveyor receives a box that requires void fill, an operating switch such as a foot pedal is depressed to dispense pillows from the apparatus and into the box in a connected strip. When the operating switch is released, the apparatus stops dispensing pillows, separates the continuous strip of pillows along a transverse perforation in the strip, and ejects the end of the separated segment. The packer can then complete packing the box by placing the severed end of the pillows into the box, advance to the next box, and repeat the process. The transfer and dispensing apparatus may be positioned in any convenient location including adjacent to, above or attached to the inflation device.

A method for laser processing of Silicon includes placing a Kerr material into engagement with the Silicon forming an interface therebetween. A laser beam is applied having at least one subpulse in a burst envelope operating at a first wavelength. The laser beam passes through a distributive lens focusing assembly and to the Kerr material. The first wavelength is modified to a plurality of second wavelengths, some of which are effective for processing Silicon. Photoacoustic compression processing is produced by the laser pulse energy by a portion of second wavelengths delivered through the interface and to the Silicon which initiates Kerr Effect self focusing which is propagated in the Silicon by additional energy input to the Silicon thus producing a filament within the Silicon.

A label picking arrangement, and a method therefore,comprising at least one anvil (1) having at least one cavity (2) and at least one picking element (3) having a picking surface(4), the label picking arrangement is connectable to an under pressure source in use, wherein the at least one cavity(2)being surrounded at least partially with at least one support surface (5) being provided, at least intermittently, with under pressureand each picking element (3) is provided, at least intermittently, with under pressure, wherein each picking element (3) is movable into corresponding cavity (2).

A device and method for cleaving a sample includes: creating an indentation on a top surface of the sample by applying a downward force along a vertical axis, the axis arranging perpendicularly to the top surface of the sample; providing a breaking pin and arranging the breaking pin under the sample to touch the bottom surface of the sample at a position that is directly opposite from the indentation; and, applying a downward force on the sample by providing a left side and right side breaker pin wherein the downward force comprises a left-side downward force extended through the left-side breaker pin and right-side downward force through the right side breaker pin, further the pins that provide the left-side and right-side downward force are disposed on a breaker bar and arranged to be on opposite sides of a vertical axis that extends through the indentation on the top surface.

Methods of manufacturing a glass pane comprise the steps of providing a glass sheet with a thickness of less than about 1.6 mm between a first major surface and a second major surface of the glass sheet. The methods include scoring the first major surface of the glass sheet to provide a boundary score line and a relief score line. In some examples, the method provides a relief score depth that is greater than a boundary score depth. In another example, the method includes the step of placing the glass sheet on a conveyor belt including a Shore A hardness of greater than or equal to 70. In further examples, methods of breaking a glass sheet with an oversized template are provided.