A method for forming a hole in a glass or glass-ceramic sheets includes scoring a major surface of a glass or glass-ceramic sheet to define the hole, placing the sheet on receiving surface of a mount where a cavity is formed in the receiving surface such that a peripheral edge of the cavity is positioned external to the area bounded by the first score, and fracturing the sheet along the first score to break away the portion of the sheet defined by the first score, wherein the broken away portion of the sheet is contained within the cavity.

Process for removing peripheral portions such as bead regions of a glass sheet including a step of pushing the glass sheet in the peripheral portion using a pushing mechanism such as a pushing bar, and corresponding apparatus. As a result of the use of the pushing mechanism, the engagement completion time for suction cups, if used, are reduced significantly. A process without using suction cups is enabled with enhanced yield. The increased process stability and enlarged process window are particularly advantageous for processing glass sheets having high flexibility.

A method for cleaving one or more optical fiber(s) at an angle to the optic axis is provided and includes clamping the optical fiber(s) with its coating stripped to expose its distal end. An axial force and/or a bending force is applied to the optical fiber to create internal stresses in the fiber. A sharp blade is provided in an orientation such the blade edge is perpendicular to the optical fiber. The blade is further orientated such that a plane bisecting the blade angle formed between two polished surfaces of the blade is slanted relative to the longitudinal axis of the fiber. The at least one optical fiber is scratched with the sharp blade to create a non-perpendicular cleave having a controlled shape in the region of the scratch. A method of splicing the fibers and a tool for cleaving the fibers are also provided.

Apparatus and methods for mechanically cleaving a bonded wafer structure are disclosed. The apparatus and methods involve clamps that grip the bonded wafer structure and are actuated to cause the bonded structure to cleave.

A method and a device for fracture splitting a connecting rod and a connecting rod formed therefrom are provided, in which a force exerted on an outer rim of an eye of the connecting rod by a separating tool is generated by an electromagnetic force. The separating tool includes at least two separating members inserted into the eye, and the electromagnetic force is generated by displacing the at least two separating members away from each other inside the eye in response to application of the electromagnetic force. The electromagnetic force may be generated by passing current through coils positioned between the at least two separating members in a manner that causes the coils to repel one another, preferably with a pulse duration of less than 100 microseconds, in order to minimize plastic deformation at the fracture locations.

The disclosure provides a method for forming a hole in a glass or glass-ceramic sheets. The method includes scoring a major surface of a glass or glass-ceramic sheet to define the hole, placing the sheet on a cavity-containing receiving surface such that a peripheral edge of the cavity is positioned external to the area bounded by the first score, and fracturing the sheet along the score to break away the portion of the sheet defined by the first score. The method allows for the formation of large openings in thin glass sheets where the mother sheet is not broken or damaged by the formation of the opening.

Process for removing peripheral portions such as bead regions of a glass sheet including a step of pushing the glass sheet in the peripheral portion using a pushing mechanism such as a pushing bar, and corresponding apparatus. As a result of the use of the pushing mechanism, the engagement completion time for suction cups, if used, are reduced significantly. A process without using suction cups is enabled with enhanced yield. The increased process stability and enlarged process window are particularly advantageous for processing glass sheets having high flexibility.

Methods for the recycling of carpet are disclosed that produce clean face fiber suitable for industrial use. The methods allow the recovery of face fiber material, for example a polyester or a polyamide, from carpets that includes a face fiber material and a backing material, and include the steps of heating the carpet to a temperature lower than the melting point of the face fiber material, but higher than the initial thermal decomposition temperature of the backing material, for a time and at a temperature sufficient to thermally decompose, pyrolyze, or oxidize at least a portion of the backing material, rendering the backing material friable, that is more friable than the untreated backing; and applying mechanical force to the carpet so as to liberate the friable backing material from the face fiber material.

The present disclosure provides a method for manufacturing a liquid crystal panel motherboard, comprising providing materials that can form projections on a margin area of at least one of two substrates of the liquid crystal panel motherboard, and then fitting said two substrates to each other, so that the margin area of said at least one of the two substrates cannot be fit to a corresponding margin area of the other substrate seamlessly. The present disclosure also provides a method for cutting a liquid crystal panel motherboard, and a liquid crystal panel obtained from the liquid crystal motherboard.

A cutter edge is caused to slide to generate a plastic deformation on a first surface of a brittle substrate, thus forming a trench line. The trench line is formed so as to obtain a crack-free state in which the brittle substrate seamlessly continues in a direction intersecting the trench line directly below the trench line. The crack-free state is then maintained. A crack of the brittle substrate in its thickness direction is extended along the trench line to form a crack line. The brittle substrate is divided along the crack line.