A rectangular parallelepiped ingot defined by a height H, a width W and a length L, having longitudinal faces extending between two end faces, having a volume between 0.15 m.sup.3 and 0.80 m.sup.3 and a surface area to volume ratio between 10 m.sup.?1 and 18 m.sup.?1, made of at least one metal, including at least one notch and a notch tip along the ingot length, wherein the at least one notch is configured such that: MaxD<H/2, MaxD<W/2 and MaxD being the maximum distance between any point of the ingot and the closest surface of the ingot.

An ingot, having a volume between 0.15 m.sup.3 and 0.80 m.sup.3 and a surface area to volume ratio between 10 m.sup.?1 and 18 m.sup.?1, made of at least one metal, having longitudinal faces extending between two end faces and including at least one hole extending from one of the longitudinal faces, the maximum distance between any point of the hole periphery, to its closest longitudinal face, noted MaxL, the at least one hole being configured such that said maximum distance MaxL is smaller than the minimal distance, noted MinE, between any point of the hole periphery and its closest end face.

An aluminum alloy brazing sheet having high corrosion resistance is provided, which develops the sacrificial anticorrosion effect in both surfaces of the sheet, which has the brazing function in one of both the surfaces, and which prevents the occurrence of preferential corrosion. A channel forming component for a vehicular heat exchanger is also provided by utilizing the aluminum alloy brazing sheet. An aluminum alloy brazing sheet having high corrosion resistance includes an aluminum alloy core, a filler material clad on one surface of the core, and a sacrificial anode material clad on the other surface of the core, wherein the filler material, the sacrificial anode material, and the core have respective predetermined alloy compositions. A channel forming component for a vehicular heat exchanger is manufactured using the aluminum alloy brazing sheet having high corrosion resistance.

The present invention accurately distinguishes a soldering material less likely to oxidize. A Cu core ball has a Cu ball having a predetermined size, and a solder layer coating the Cu ball. The Cu ball provides a space between a semiconductor package and a printed circuit board. The Cu core ball has the soldering material having lightness greater than or equal to 62.5 in L*a*b* color space subsequent to a heating storage test performed for 72 hours in a temperature-controlled bath at 150 C. with a temperature of 25 C. and 40% humidity, and the soldering material, prior to the heating storage test, having lightness greater than or equal to 65 in the L*a*b* color space and yellowness less than or equal to 7.0 in the L*a*b* color space.

Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melting temperature of the AgX, CuX or NiX alloy is greater than the melting temperature of the basic solder. The invention also relates to a method for forming a laminated composite (10) and to a circuit arrangement containing a laminated composite (10) according to the invention.

Systems and methods are provided for improved brazing. A system includes a gap filling compound (GFC). The GFC includes a brazing alloy. The system also includes a GFC retention screen. The GFC retention screen configured to be disposed over the GFC to retain the GFC within the gap during brazing. The GFC retention screen is also configured to enable gas to escape from the GFC during brazing.

Billets and methods for manufacturing them are disclosed. The billets include a cladding member including an alloy selected from the group including stainless steel, nickel-chrome, nickel-copper, and copper-nickel alloys, and a steel body that is positioned so that it has an interface with the cladding member, the steel body having a formation in which the scavenging metal is located and elements being provided for separating the scavenging metal from the cladding member at the interface.

The use of Atomic Layer Deposition (ALD) and Molecular Layer Deposition (MLD) applied to powders and intermediates of the MLCC fabrication process can provide significant advantages. Coating metal particles within a defined range of ALD cycles is shown to provide enhanced oxidation resistance. Surprisingly, a very thin ALD layer was found to substantially increase sintering temperature.