Provided is a facial patch including a support, a pressure-sensitive adhesive layer, and a release layer in this order, in which (a) the pressure-sensitive adhesive layer satisfies the following conditions (a-1) to (a-3): (a-1) the pressure-sensitive adhesive layer contains a styrene-isoprene-styrene block copolymer, a tackifier resin, and a softening agent; (a-2) the ratio (mass ratio) of the styrene-isoprene-styrene block copolymer and the tackifier resin is 1:2 to 1:4; and (a-3) the content of the softening agent is 40% to 60% by mass; and (b) the support has elastic moduli with a Young's modulus of 0.01 GPa to 0.5 GPa, and also provided is a method for producing the facial patch, the method including a step of forming a pressure-sensitive adhesive layer on the upper surface of the release layer.

An ultra violet stable polyester membrane with a polyacrylic coating on one side and a coated pressure sensitive adhesive coating on its other side capable of allowing water vapor to pass through it. The pressure sensitive adhesive is formed of a copolymer comprising a backbone of n-butyl acrylate, 2-ethylhexyl acrylate, and vinyl acetate which is mixed with at least one surfactant and emulsified to produce air bubbles which form pores when the copolymer is set with about 80% to about 90% of the pore sizes ranging from about 200 microns to about 300 microns and being uniformly distributed to form a flow path through the pressure sensitive adhesive.

A label as shown and described herein. The label may include a label substrate, an adhesive adjacent the substrate, and a liner adjacent the adhesive, such that the adhesive is disposed between the label substrate and the liner, and wherein the label substrate is embossed or debossed, and the liner is not embossed or debossed.

Provided is a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance Therefore, the multi-layered anisotropic conductive adhesive has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. Also provided is a method of producing the multi-layered anisotropic conductive adhesive.

A breathable multilayer spun bonded polypropylene membrane having a coated pressure sensitive adhesive capable of allowing air and moisture vapor to pass through it. The adhesive is formed of a copolymer comprising a backbone of n-butyl acrylate, 2-ethylhexyl acrylate, and vinyl acetate which is mixed with a surfactant and emulsified to produce bubbles which form pores when the copolymer is set with about 80% to about 90% of the pore sizes ranging from about 200 microns to about 300 microns and a pore density in the cured pressure sensitive adhesive ranging from about 4200 per inch.sup.2 to about 4600 per inch.sup.2, said pores being uniformly distributed to form a flow path through adhesive.

The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 45 to 100 m. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.

A resealable package assembly is described. The package assembly includes a selectively positionable flap that covers an aperture or enables access through the aperture into the package. The flap and package include provisions for releasably engaging the flap to the package to seal the interior of the package. Provisions for grasping the tab and indicating whether tampering has occurred are also described.

A label as shown and described herein. The label may include a label substrate, an adhesive adjacent the substrate, and a liner adjacent the adhesive, such that the adhesive is disposed between the label substrate and the liner, and wherein the label substrate is embossed or debossed, and the liner is not embossed or debossed.

A method includes placing a first end of a twist tie in a mold, placing a piece of adhesive material in the mold, and extruding a material into the mold to bond the extruded material, the piece of adhesive material, and the first end of the twist tie together. The piece of adhesive material may include an adhesive surface covered with a removable cover on a first side and a non-tacky surface on a second side. The extruded material may be extruded onto the second side of the adhesive material and around the first end of the twist tie. The method may include molding an object in the mold from the extruded material. The second side of the adhesive material and the first end of the twist tie may be molded to the object.

A low-melting adhesive film may include a first adhesive layer made of a material comprising thermoplastic polyurethane, a second adhesive layer made of a material comprising aromatic-based hot-melt thermoplastic polyurethane capable of being applied to low temperature adhesion at a temperature of 60 C. or higher, and a polyethylene (PE)-based protective film layer. The low-melting adhesive film may be used to adhere a carpet fabric to a sound absorbing material and thus produce an integrated sound absorbing and proofing composite carpet.