A self-adhering tape is described comprising a substrate layer having a first major surface and opposing major surface; an adhesive layer disposed on the first major surface of the polyolefin substrate, the adhesive layer comprising a polyolefin polymer and optionally further comprising a tackifying resin; an outer layer disposed on the opposing major surface of the polyolefin substrate, the outer layer comprising a polymer comprising at least 50 wt-% C.sub.2-C.sub.3 alkylene and at least 20 wt-% C.sub.4-C.sub.20 -olefin. The self-adhering tape is suitable for use as a grip tape or an electrical tape. Methods of making and using the tape are also described.

A thermosettable adhesive taped article comprising at least first and second adhesive layers bonded together. Each of the adhesive layers comprises a thermosettable adhesive, which is the photo-polymerization reaction product of starting materials. The starting materials for each adhesive layer comprises at least a photo-polymerizable acrylic component and a thermosettable epoxy component. The thermosettable adhesive, used for either of the two adhesive layers, is not black when fully cured without the presence of a black coloring pigment. The first adhesive layer is made from a layer of starting materials that is thin enough to allow substantial photo-polymerization of the starting materials, even with the starting materials containing a sufficient amount of a black coloring pigment to cause the first adhesive to have a black color after the first adhesive is substantially cured. The second adhesive layer is made from a layer of starting materials which has a thickness that would be sufficiently thick to prevent substantial photo-polymerization (e.g., with UV light) of the starting materials, if the starting materials contained enough of a black coloring pigment to cause the second adhesive to have a black color after the second adhesive is cured.

A process includes forming a transfer film without a release layer in which the transfer film includes a substrate layer to be peeled off during a transfer process, and a transfer layer to be transferred to an article to be decorated. The transfer layer has a protective layer, a printed or vapor-deposited decorative layer, and an adhering layer, which are laminated in this order. The substrate layer is a base film of a synthetic resin formed by extruding a molten synthetic resin. The substrate layer is so laminated and thermally compressed in direct contact with the protective layer such that the substrate layer does not peel off the protective layer before the transfer process and peels off the protective layer from a peeled end portion of the substrate layer as a trigger during the transfer process, by thermally pressing the substrate layer and the protective layer between rolls.

A flexible sheet of aligned carbon nanotubes includes an array of aligned nanotubes held in a polymer matrix material. The carbon nanotubes have an average length of between about 50 microns and about 500 microns. The polymer matrix has an average thickness of between about 10 microns and about 500 microns. The flexible sheet has a density of about 0.2 to about 1.0 g/cc and includes between about 98 to about 60 weight percent aligned carbon nanotubes and between about 2 and about 40 weight percent polymer. A tape of aligned carbon nanotubes, a method for producing a tape of aligned carbon nanotubes, a method of producing the flexible aligned carbon nanotube sheet material and a method of increasing unidirectional heat conduction from a work piece are also disclosed.

The present subject matter provides a shrink film free of silicon-containing material, fluorine-containing material, and solvent-formed seams. The shrink film utilizes a water soluble layer covering an adhesive layer. The water soluble layer is in dry form and non-tacky, allowing processing of the shrink film subsequent to adhesive application to the shrink film. When the water soluble layer is dissolved, the adhesive layer is exposed and is capable of forming a permanent bond. The adhesive can be used to form a seam in the film and/or can be used to form a bond between the film and a substrate. The water soluble layer facilitates removal of an optional release liner from the adhesive. A substrate with the shrink film attached thereto and a related method of attaching a heat shrinkable film to a substrate are also disclosed.

A connector or adhesive assembly for joining adjacent ends of insulation tubing, comprising a layer of pressure-sensitive transfer adhesive material, said layer of pressure-sensitive transfer adhesive material capable of bonding to insulation tubing, whereby when said layer of pressure-sensitive transfer adhesive material is positioned between a first section of insulation tubing and a second section of insulation tubing, said layer of pressure-sensitive transfer adhesive material bonds to both the first section of insulation tubing and the second section of insulation tubing; and a disposable release liner member adapted to hold said layer of pressure-sensitive transfer adhesive material prior to positioning said layer of pressure-sensitive transfer adhesive material between the first section of insulation tubing and the second section of insulation tubing. Generally, the seam created when the first section of insulation tubing and the second section of insulation tubing are joined is covered with tape.

A molding film is high in both windability during film production and also excellent in appearance quality and moldability. The molding film includes cyclic olefin based resin, has roughened regions in side edge parts of the molding film, is non-oriented, and satisfies (1) to (3): (1) one of the surfaces has a surface roughness SRa of 2 nm or more and 30 nm or less in the central region, which is defined as the region outside the roughened regions, whereas the other surface has a surface roughness SRa of 100 nm or more and 800 nm or less, (2) the ratio h/t where h represents the height (in m) of the roughened regions while t represents the thickness (in m) of the central region is 5/100 or more and 30/100 or less, and (3) the width of the roughened regions is 5 mm or more and 20 mm or less.

A process is disclosed for using two polymeric bonding material layers to bond a device wafer and carrier wafer in a way that allows debonding to occur between the two layers under low-force conditions at room temperature. Optionally, a third layer is included at the interface between the two layers of polymeric bonding material to facilitate the debonding at this interface. This process can potentially improve bond line stability during backside processing of temporarily bonded wafers, simplify the preparation of bonded wafers by eliminating the need for specialized release layers, and reduce wafer cleaning time and chemical consumption after debonding.

The present disclosure provides a multi-layered anisotropic conductive adhesive including an upper conductive adhesive layer, a conductive fabric layer with two sides and a lower conductive adhesive layer, wherein one side of the conductive fabric layer is plated with metal, and the total thickness of the multi-layered anisotropic conductive adhesive is 40 to 60 m. In the application of a flexible printed circuit, reinforced parts, formed by laminating multi-layered anisotropic conductive adhesive with steel or polyimide-type stiffener, can effectively prevent the deformation of installed parts due to warping, and ensure the good hole filling, good direct grounding effect, and good shielding performance. Therefore, the multi-layered anisotropic conductive adhesive of the present disclosure has good electrical properties, good adhesive strength, better tin soldering, reliability and flame resistant. The disclosure further provides a method of producing the multi-layered anisotropic conductive adhesive.

Compositions and films are described comprising a polylactic (PLA) polymer and a copolymer comprising a first moiety comprising a C12-C30 alkyl group and a second moiety that is miscible in the composition. Suitable first moieties include a C12-C30 alkyl (meth)acrylate or a polyvinyl alcohol comprising pendent C12-C30 alkyl groups. Suitable second moieties include C1-C10 (meth)acrylic acid or ester thereof, vinyl acetate and ethylene vinyl acetate. The aforementioned composition may be used to form a release layer of an adhesive article such as a pressure sensitive adhesive tape. The films may be a monolithic film or a film layer of a multilayer film. The release layer may be disposed upon a substrate layer that may also comprise PLA. The films are produced by melt extrusion of the aforementioned composition and may be oriented.