Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

A plastic sheet for manufacturing of a plurality of smart cards which respectively include a plurality of electronic units, includes a first sheet formed of a first material having a first hardness or a first Vicat softening temperature, the first sheet including a plurality of apertures and/or cavities. The plastic sheet includes a second material having, when the first material has the first hardness, a second hardness lower than the first hardness, and when the first material has the first Vicat softening temperature, a second Vicat softening temperature lower than the first Vicat softening temperature, the second material being located inside the apertures and/or cavities in the first sheet. The apertures and/or cavities with the second material located inside the apertures and/or cavities are configured to respectively receive said electronic units via an at least partial penetration from the electronic units into the second material.

A method for making a variable-density carbon nanotube film is provided. A drawn carbon nanotube film, including a number of carbon nanotubes aligned along an aligned direction, is prepared. A number of thin regions are formed in the drawn carbon nanotube film along the aligned direction by reducing density of carbon nanotubes in each of the plurality of thin regions. A variable-density carbon nanotube film is provided and includes a number of thin regions and at least one normal region having a density of carbon nanotubes greater than that of the thin regions. The at least one normal region includes a number of carbon nanotubes substantially aligned along an aligned direction. The thin regions are arranged in the form of at least one row extending along the aligned direction.

The disclosure relates to a nanotube film structure. The nanotube film structure includes at least one nanotube film. The at least one nanotube film includes a plurality of nanotubes orderly arranged and combined with each other by ionic bonds. The nanotube film is fabricated by using the template of carbon nanotube film. The carbon nanotube film is drawn from supper aligned carbon nanotube array and includes a plurality of carbon nanotubes joined end to end.

A light extraction substrate for an organic light-emitting device (OLED) which can improve the brightness of a display or an illumination system to which an OLED is applied by improving light extraction efficiency and a method of manufacturing the same. The light extraction substrate for an OLED includes an oxide or nitride thin film formed on a substrate body. The oxide or nitride thin film includes a base layer formed on the substrate body, a first texture formed on the base layer, the first texture having a plurality of first protrusions which protrude continuously or discontinuously from the base layer, and a second texture having a plurality of second protrusions which protrude continuously or discontinuously from each outer surface of the first protrusions.

A nonwoven for use in a thermal liner for protective apparel includes 1-45 wt % of a first inherently heat resistant fiber excluding an aramid, and a balance of a second heat resistant fiber. The nonwoven excludes wool and has a thickness less than 3 mm and a basis weight of less than 2.9 osy (100 gsm). In another embodiment, the insulating layer for protective apparel includes a nonwoven including an inherently flame resistant fiber and fibers being inherently resistant to moisture absorption. The inherently flame resistant fiber is different from said inherently resistant to moisture absorption fiber. The nonwoven has an equivalent or better thermal protective performance (TPP) and a lower basis weight than an industry standard nonwoven consisting of a nonwoven of para-aramids or meta-aramids or a blend of both.

An article of apparel includes a base layer defined by a Poisson's ratio, and a polymer structure coupled to the base layer. The polymer structure is configured to lower the Poisson's ratio of the base layer. The polymer structure includes a plurality of interconnected members forming an array of cell units. The plurality of interconnected members form cell walls with interior recesses defined within the cell walls.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Described is a micro-lattice damping material and a method for repeatable energy absorption. The micro-lattice damping material is a cellular material formed of a three-dimensional interconnected network of hollow tubes. This material is operable to provide high damping, specifically acoustic, vibration or shock damping, by utilizing the energy absorption mechanism of hollow tube buckling, which is rendered repeatable by the micro-lattice architecture.

A stretch laminate and a method for reducing and/or preventing tearing in a stretch laminate, when the stretch laminate is stretched in a stretching direction, is disclosed. The stretch laminate has a perforation pattern. The perforation pattern has at least two columns. A first column has a plurality of pairs of perforations stacked one pair above the other pair. The perforations in each pair sloping in a first direction, and a first space separating one pair from the other pair. A second column has a plurality of pairs of perforations stacked one pair above the other pair. The perforations in each pair sloping in a second direction, and a second space separating one pair from the other pair. The first direction and the second direction may be different. A third space between the columns is no greater than the first or second space between perforation in the pair.