A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σ.sub.I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σ.sub.B at the first primary surface in tension, σ.sub.I+σ.sub.B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.

A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.

An edge trim for pieces of furniture, including a meltable layer, is described. The molecular structure of the meltable layer contains both polar and non-polar parts. By way of a non-limiting example, an edge trim for pieces of furniture having an exposed edge of wooden or wood substitute material is described, comprising a molten layer and a structural layer, wherein the structural layer and the molten layer are connected in an adhesive bond, wherein the molten layer is made of a material that is chemically modified such that polar and non-polar components are found in a single molecular structure, wherein the molten layer contains energy absorbing additives, wherein the energy absorbing additives of the molten layer are selected from the group consisting of metal oxides, metal phosphates, metal salts of organic anions and combinations thereof.

A glass element having a thickness from 25 m to 125 m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

A glass-polymer laminate structure includes a flexible glass substrate having a thickness of no more than about 0.3 mm. A polymer layer is laminated to a surface of the flexible glass substrate having a coefficient of thermal expansion (CTE) that is at least about 2 times a CTE of the flexible glass substrate. The polymer layer is laminated to the surface of the flexible glass substrate after thermally expanding the polymer layer to provide the flexible glass substrate with an in-plane compressive stress of at least about 30 MPa along a thickness of the flexible glass substrate.

A compact camera module that contains a generally planar base on which is mounted a lens barrel is provided. The base, barrel, or both are molded from a polymer composition that includes a thermotropic liquid crystalline polymer and a plurality of mineral fibers (also known as whisker). The mineral fibers have a median width of from about 1 to about 35 micrometers and constitute from about 5 wt. % to about 60 wt. % of the polymer composition.

A clad material includes a first layer made of stainless steel and a second layer made of Cu or a Cu alloy and roll-bonded to the first layer. In the clad material, a grain size of the second layer measured by a comparison method of JIS H 0501 is 0.150 mm or less.

A glass element having a thickness from 25 m to 125 m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress GI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

An edge trim for pieces of furniture, including a meltable layer, is described. The molecular structure of the meltable layer contains both polar and non-polar parts. By way of a non-limiting example, an edge trim for pieces of furniture having an exposed edge of wooden or wood substitute material is described, comprising a molten layer and a structural layer, wherein the structural layer and the molten layer are connected in an adhesive bond, wherein the molten layer is made of a material that is chemically modified such that polar and non-polar components are found in a single molecular structure, wherein the molten layer contains energy absorbing additives, wherein the energy absorbing additives of the molten layer are selected from the group consisting of metal oxides, metal phosphates, metal salts of organic anions and combinations thereof.

A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress .sub.I of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress .sub.B at the first primary surface in tension, .sub.I+.sub.B<400 MPa (in tension). Further, the cover element can withstand a pen drop height of at least 1.5 times that of a control pen drop height of the cover element without the layer according to a Drop Test 1.