A device comprising: a substrate; a first coating deposited on the substrate; an intermediate coating deposited on the first coating, wherein the first coating is interposed between the substrate and the intermediate coating; and a second coating deposited on the intermediate coating, wherein the intermediate coating is interposed between the first coating and the second coating, and the second coating is outermost and black. The substrate, the first coating, the intermediate coating and the second coating define at least one of a jewelry item and a component of a jewelry item.

Techniques, processes and structures are disclosed for providing markings on products, such as electronic devices. For example, the markings can be formed using physical vapor deposition (PVD) processes to deposit a layer of material. The markings or labels may be textual and/or graphic. The markings are deposited on a compliant layer that is disposed on a surface to be marked. The compliant layer is arranged to isolate the surface to be marked from the layer of material deposited using the PVD process.

Coated articles and methods and systems for coating the articles are described herein. The methods and systems described herein include, but are not limited to, steps for actively or passively controlling the temperature during the coating process, steps for providing intimate contact between the substrate and the support holding the substrate in order to maximize energy transfer, and/or steps for preparing gradient coatings. Methods for depositing high molecular weight polymeric coatings, end-capped polymer coatings, coatings covalently bonded to the substrate or one another, metallic coatings, and/or multilayer coatings are also disclosed. Deposition of coatings can be accelerated and/or improved by applying an electrical potential and/or through the use of inert gases.

The present invention relates to filled polymeric materials including a polymer and a mass of metallic fibers distributed within the polymer, and to light weight composites which comprise at least a pair of metallic layers and a polymeric layer interposed between the pair of metallic layers, the polymeric layer containing the filled polymeric material. The composite materials of the present invention may be formed using conventional stamping equipment at ambient temperatures. Composite materials of the present invention may also be capable of being welded to other metal materials using a resistance welding process such as resistance spot welding. Preferred composite materials include one or any combination of the following features: metallic fibers that are ribbon fibers; a polymer selected from a polyolefin, a polyamide, or a combination thereof; or a metallic layer (e.g., one or both of the pair of metallic layers) having a surface facing the filled polymeric material that is untreated.

Disclosed herein is a method of forming a multilayer thin film by depositing target particles, detached from a target by plasma discharge of inert gas, on a metal object using a multilayer thin film deposition apparatus and a multilayer thin film formed by the method. More specifically, a sputtering deposition apparatus is used as the multilayer thin film deposition apparatus. The method includes coating a metal object with a coating layer, depositing at least one hardness-enhancing layer on the coating layer, and depositing a color layer on the at least one hardness-enhancing layer.

Embodiments of the present disclosure, in one aspect, relate to polymer compositions, methods of making polymer compositions, structures having the polymer composition covalently bonded to the surface of the structure, methods of attaching the polymer to the surface of the structure, methods of decreasing the amount of microorganisms formed on a structure, materials, methods of attaching materials, and the like.

Disclosed in this specification is a method for coating a substrate to prevent dewetting. A suspension of nanoparticles is deposited onto the substrate to produce a nanoparticle layer. The nanoparticle layer is then coated with a monomer. The monomer polymerizes on the nanoparticle layer to produce a polymeric layer.

The invention is directed at sputter targets including 50 atomic % or more molybdenum, a second metal element of titanium, and a third metal element of chromium or tantalum, and deposited films prepared by the sputter targets. In a preferred aspect of the invention, the sputter target includes a phase that is rich in molybdenum, a phase that is rich in titanium, and a phase that is rich in the third metal element.

A water-based, carbon filler-dispersed coating formulation for forming a conductive coating film contains (1) a hydroxyalkyl chitosan as a resin binder, (2) a conductive carbon filler, and (3) a polybasic acid or its derivative in a water-based medium containing at least water as a polar solvent. In 100 parts by mass of the coating formulation, the hydroxyalkyl chitosan (1) is contained in a range of from 0.1 to 20 parts by mass, and the conductive carbon filler (2) is contained in a range of from 1 to 30 parts by mass. An electricity-imparting material, an electrode plate for an electricity storage device, a process for producing the electrode plate, and the electricity storage device are also disclosed.

[Problems] To provide a method of preventing the polysilicon from being contaminated with metals by providing a resin cover on the surface of a metal substrate that comes in contact with the polysilicon, wherein the metal surfaces are reliably prevented from being exposed that is caused by the wear of the cover. [Means for Solution] A method of preventing the polysilicon from being contaminated with metals caused by the contact of the polysilicon with a metal substrate by providing a resin cover on the surface of the metal substrate, wherein the resin cover 3 comprises two kinds of resin sheets 3a and 3b overlapped one upon the other.