The present invention aims to provide a curable resin composition capable of providing a cured product that has a high glass transition temperature after curing and is excellent in thermal decomposition resistance, adhesiveness, and long-term heat resistance. The present invention also aims to provide a cured product of the curable resin composition, an adhesive containing the curable resin composition, and an adhesive film, a coverlay film, a flexible copper clad laminate, and a circuit board each formed using the curable resin composition. Provided is a curable resin composition containing: a curable resin; an imide oligomer having an imide skeleton in a main chain and a crosslinkable functional group at an end and having a number average molecular weight of 4,000 or less; and a curing accelerator, a cured product of the curable resin composition having an initial adhesive force to polyimide of 3.4 N/cm or more, the cured product after storage at 200° C. for 100 hours having an adhesive force to polyimide of at least 0.8 times the initial adhesive force.

A method for producing an aqueous polyimide precursor solution includes forming a polyamic acid by the reaction of a tetracarboxylic acid component and a diamine component in water without organic solvent together with an imidazole in an amount of 1.6 mole or more per mole of the tetracarboxylic acid component of the polyamic acid.

A plastic laminated film comprising a first layer comprising a polyamideimide copolymer and a second layer provided on at least one surface of the first layer and comprising a polyimide copolymer. The plastic laminated film has both excellent mechanical properties and UV weathering resistance while being colorless and transparent, and can be suitably used as cover films for various flexible or foldable devices.

A method for surfacing a polymeric composite article and/or for joining (for example, by bonding or by co-curing) the article and an adherend (for example, a second polymeric composite article) comprises (a) providing a cured or curable polymeric composite article; (b) providing a curable composition comprising (1) at least one thermosetting resin, and (2) at least one preformed, substantially non-functional, particulate modifier comprising at least one elastomer; and (c) directly or indirectly applying the composition to at least a portion of at least one surface of the article.

A barrier film including a first layer formed of a semicovalent inorganic material and a second layer formed of an ionic inorganic material is provided. Here, the first layer and the second layer are alternately disposed. The barrier film having an improved moisture barrier property compared to a gas-barrier plastic composite film of the prior art manufactured using only a metal oxide or nitride may be provided.

A substrate comprising a crosslinked polymer primer layer, and grafted thereto a ligand-functionalized polymer is provided. The grafted polymer has the requisite affinity for binding neutral or negatively charged biomaterials, such as cells, cell debris, bacteria, spores, viruses, nucleic acids, and proteins, at pH's near or below the pI's of the biomaterials.

In a first aspect, a multilayer polymer film includes a first transparent, colorless polymer layer comprising a polyimide, a polyamide imide, or a block copolymer of a polyimide and a second transparent, colorless polymer layer comprising a polyimide, a polyamide imide, or a block copolymer of a polyimide. An elastic modulus of the first transparent, colorless polymer layer is different than an elastic modulus of the second transparent, colorless polymer layer. The first and second transparent, colorless polymer layers are bonded by consolidation. In a second aspect, a cover window for a display includes the multilayer polymer film of the first aspect. The first transparent, colorless layer of the multilayer polymer film is the layer farthest from the display.

An optical device having a first optical member, a second optical member, and an antistatic layer disposed between the first optical member and the second optical member wherein the antistatic layer contains the reaction product of a mixture comprising at least one polymerizable onium salt having an anion and at least one non-onium polymerizable monomer, oligomer, or polymer.

A class of solvent resistant, flexible copolyimide substrates having high optical transparency (>80% from 400 to 750 nm) that is retained after brief exposure to 300° C., near-zero birefringence (<0.001) and a maximum CTE of approximately 60 ppm/° C. is disclosed. The copolyimides are prepared from alicyclic dianhydrides, aromatic cardo diamines, and aromatic diamines containing free carboxyl groups. The substrates are manufactured from solutions of the copolyimides containing multifunctional epoxides in the form of single layer films, multilayer laminates and glass fiber reinforced composite films. The substrates can be used in the construction of flexible optical displays, and other microelectronic and photovoltaic devices that require their unique combination of properties.

Disclosed is a polyimide cover substrate, which is configured such that a device protection layer is formed of a urethane acrylate compound on at least one side of a polyimide film, thereby exhibiting not only high flexural properties and impact resistance but also superior solvent resistance, optical properties and scratch resistance and low water vapor transmission rate, and thus can be effectively utilized as a cover substrate for a flexible electronic device.