An example assembly includes, among other things, a position indicator configured to be engaged with a service disconnect when the service disconnect is in a seated position, and to be disengaged from the service disconnect when the service disconnect is in an unseated position.

De-embedding apparatus and methods of de-embedding are disclosed. A de-embedding apparatus includes a test structure including a device-under-test (DUT) embedded in the test structure, and a plurality of dummy test structures including an open dummy structure, a distributed open dummy structure, and a short dummy structure. The distributed open dummy structure may include a first signal transmission line coupled to a left signal test pad and a second signal transmission line coupled to a right signal test pad, the first and second signal transmission lines having a smaller total length than a total length of signal transmission lines of the open dummy structure, and intrinsic transmission characteristics of the DUT can be derived from transmission parameters of the dummy test structures and the test structure.

An electronic device having a housing structure that is configured to receive at least one glass cover is disclosed. The glass cover serves to cover a display assembly provided within the electronic device. The glass cover can be secured to the housing structure so as to facilitate providing a narrow border between an active display area and an outer edge of the housing structure. The enclosure for the electronic device can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

A method for producing a wired circuit board includes the steps of preparing a metal supporting layer; forming an insulating layer on the metal supporting layer; roughening the surface of the insulating layer; forming a conductive pattern on the insulating layer; and inspecting the presence or absence of a defect of the conductive pattern by using an inspection device provided with a light emitting portion emitting incident light that enters the insulating layer and the conductive pattern and a light receiving portion receiving reflected light that is reflected from the incident light. The incident light has a wavelength in the range of 435 to 500 nm and includes inclined light that inclines so as to form an angle of more than 0° to not more than 30° with respect to the optical axis thereof.

The invention provides a method and apparatus for scanning a read/write head of a hard disk drive during manufacture. The method comprises: providing a magnetic sensor; moving the magnetic sensor relative to and in close proximity to the read/write head under test; obtaining measurements from the head under test or the sensor, representing a two-dimensional magnetic map; processing the map to obtain an accurate map of the head sensitivity of the head under test from which the key performance characteristics of the head can be obtained.

A temperature emulator may include a stack assembly having a pair of end plates positioned at an uppermost and lowermost location of the stack assembly, a plurality of heat sink plates disposed between the pair of end plates, each of the heat sink plates having a plurality of heat sink cutouts, a plurality of shim plates separating adjacent pairs of the end plates and the heat sink plates, each of the shim plates having a shim cutout, an open cavity formed by a plurality of adjacent heat sink cutouts and shim cutouts, thermal insulation disposed within the cavity, and at least one temperature sensor coupled to at least one of the plurality of heat sink plates.

Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.

A method of manufacturing a battery proposed herein includes the following steps A to D. Step A is the step of preparing a battery case in which an electrode assembly is enclosed. Step B is the step of depressurizing an interior of the battery case prepared in step A. Step C is the step of filling an electrolyte solution and a leakage testing gas into the battery case depressurized in step B. Step D is the step of sealing the battery case containing the electrolyte solution and the leakage testing gas filled in step C.

An assembling method of an electric vehicle comprises the steps of: assembling a vehicle body including a frame, wheels and an electric motor; conducting a vehicle body test including confirmation of a state of driving power transmission from the electric motor to the wheels by connecting an electric power supply unit installed in a vehicle body test place to the electric motor of the vehicle body and supplying electric power from the electric power supply unit to the electric motor; detaching the electric power supply unit from the electric motor and transporting the vehicle body which has passed the vehicle body test from the vehicle body test place to a mounting place, in a state in which a battery is not mounted to the vehicle body; and mounting the battery to the transported vehicle body in the mounting place.

A transaction card includes a monolithic ceramic card body having one or more pockets, and at least one of a magnetic stripe, a barcode, and a laser signature portion. The one or more pockets may be configured to receive at least one of the magnetic stripe, the barcode, a contact chip module, a contactless chip module, a dual interface chip module, a booster antenna, a hologram or commercial indicia. A transaction card may also include a substrate layer having a first side and a second side. A first ceramic layer is connected to the first side of the substrate layer.