Patent classifications
Y10T29/4902
Methods for forming chip-scale electrical components
A method of forming a planar, low loss electrical component such as an inductor or transmission line is provided. A channel can be formed on a top surface of a substrate. A threading plate can be positioned on an upper surface of the channel. A wire or fiber can be introduced through the substrate, the channel, and the threading plate. The wire or fiber can then be guided into the channel using the threading plate. The substrate and the threading plate can then be removed.
Micromechanically assembly, method for manufacturing a micromechanical assembly and method for operating a micromechanical assembly
A micromechanical assembly having a holder, a drive frame which has at least one energizable coil device disposed at least one of on and in the drive frame and which is joined to the holder via at least one frame spring, a mirror element that is at least partially framed by the drive frame and is suspended from the drive frame by a first mirror spring and a second mirror spring, the mirror element being disposed between the two mirror springs and being adjustable about a mirror axis of rotation in relation to the drive frame, and the mirror element being suspended from the drive frame asymmetrically relative to the mirror axis of rotation. A method for manufacturing a micromechanical assembly is also described. A method for operating a micromechanical assembly is also described.
Integrated antenna and proximity sensor element
An example electronic device may include an antenna module comprising an active element and a ground plane. The electronic device may include a proximity sensor element integrated within the antenna module, wherein the proximity sensor element is to detect proximity of a user.
Power inductor and manufacturing method thereof
Disclosed herein are a power inductor in which aspect ratios of the innermost pattern and the outermost pattern are similar with those of the intermediate pattern and a manufacturing method thereof. The power inductor includes coil patterns formed on one surface or both surfaces of a core insulating layer; insulating patterns bonded to at least one of an innermost pattern and an outermost pattern of the coil patterns; metal layers plated on surfaces of the coil patterns; and an insulator covering the coil patterns including the metal layers.
External LTE multi-frequency band antenna
An antenna is provided. The antenna includes a substrate having a first end and a second end opposite to the first end, wherein a direction from the first end to the second end is an extending direction of the antenna; a radiating portion; a feed-in conductor; and a ground portion electrically connected to the radiating portion, coupled to the feed-in conductor, disposed on the substrate from the first end along the extending direction, and including a main ground conductor; and a high frequency band bandwidth adjusting conductor extended from the main ground conductor along the extending direction.
Reconfigurable multi-stack inductor
A reconfigurable multi-stack inductor formed within a semiconductor structure may include a first inductor structure located within a first metal layer of the semiconductor structure, a first ground shielding structure located within the first metal layer that is electrically isolated from and circumferentially bounds the first inductor structure, and a second inductor structure located within a second metal layer of the semiconductor structure, whereby the second inductor structure is electrically coupled to the first inductor structure. A second ground shielding structure located within the second metal layer is electrically isolated from and circumferentially bounds the second inductor structure, whereby the first and second inductor generate a first inductance value based on the first ground shielding structure and second ground shielding structure being coupled to ground, and the first and second inductor generate a second inductance value based on the first ground shielding structure and second ground shielding structure electrically floating.
System and method to avoid magnetic power loss while providing alternating current through a ferromagnetic material
This disclosure provides systems, methods and apparatus for avoiding magnetic power loss while providing alternating current through a ferromagnetic material. In one aspect, the ferromagnetic material includes at least one orifice. At least one electrical conduit extends through the at least one orifice from a first region on a first side of the ferromagnetic material to a second region on a second side of the ferromagnetic material, the second side opposite to the first side. The at least one electrical conduit is configured to have at least one alternating current flowing along the at least one electrical conduit between the first region and the second region. The ferromagnetic material and the at least one electrical conduit are configured to reduce power loss caused by a circumferential magnetic flux generated within the ferromagnetic material by the at least one alternating current.
HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION
An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.
System for transmitting control signals over twisted pair cabling using common mode of transformer
A system for transmitting control systems over twisted pair cabling. The system includes a first microcontroller transmitting a first single ended signal and receiving a second single ended signal. It also includes a first differential transmitter coupled to the first microcontroller for receiving the first single ended signal from the first microcontroller and converting it to a differential signal over a first differential line and a second differential line; and, a first differential receiver coupled to the first microcontroller for receiving a third differential line and a fourth differential line and converting it to a differential receiver signal, the differential receiver signal coupled to the second single ended signal. The system has a first transformer having first, second, third, and fourth center-tapped coils, the first differential line coupled to the center tap of the first coil, the second differential line coupled to the center tap of the fourth coil, the third differential line coupled to the center tap of the second coil, and the fourth differential line coupled to the center tap of the third coil, whereby the common mode of the first transformer is used to transmit a first control signal and to receive control signal responses over the twisted pair at the first processor.
Method of manufacturing spin torque oscillator
According to one embodiment, there is provided a spin torque oscillator including an oscillation layer formed of a magnetic material, a spin injection layer formed of a magnetic material and configured to inject a spin into the oscillation layer, and a current confinement layer including an insulating portion formed of an oxide or a nitride and a conductive portion formed of a nonmagnetic metal and penetrating the insulating portion in a direction of stacking. The conductive portion of the current confinement layer is positioned near a central portion of a plane of a device region including the oscillation layer and the spin injection layer.