A cage with a fastening system (1) in a magnetic resonance device (MRD) is disclosed, said cage in an MRD comprising (a) M pole pieces (45) (M≥2); (b) N side magnets (20) (N≥2), said side magnets substantially enclosing said pole pieces and thereby defining a magnetic envelope and enclosed volume therein; (c) N side walls (10), said side walls substantially enclosing said side magnets; (d) P face walls (30) (P≥2); and (e) a plurality of fastening rods (100); wherein each of said fastening rods physically interconnects at least one pair of side walls, passing through at least one of said side magnets and at least one of said pole pieces.

A method of fabricating an inductor includes (a) forming a ferromagnetic core on a semiconductor substrate, the ferromagnetic core lying in a core plane and (b) fabricating an inductor coil that winds around the ferromagnetic core, the inductor coil configured to generate an inductor magnetic field that passes through the ferromagnetic core in a first direction parallel to the core plane. While forming the ferromagnetic core, the method further includes (1) generating a bias magnetic field that passes through the ferromagnetic core in a second direction that is orthogonal to the first direction, and (2) inducing a magnetic anisotropy in the ferromagnetic core with the bias magnetic field.

A method for manufacturing an electronic component is provided. The method includes: placing an air-core coil in a mold; placing a mixture of an Fe—Si—Cr alloy, a thermosetting resin, and a solvent into the mold so as to embed the air-core coil in the mixture; after placing the mixture, applying pressure to the placed mixture so that a shape of the placed mixture conforms to the air-core coil and the mold; and after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.

An electronic lighting device and a method for manufacturing the same are disclosed. The electronic lighting device includes an outer shell with a first opening at a top surface and a core contained within the outer shell. The core includes a left semicircular structure and a right semicircular structure arranged to form a circular shape that is aligned with the first opening at the top surface of the outer shell. The device includes a flame component positioned partially in the internal cavity. The device also includes a light emitting element disposed at least partially in a lighting element installation cradle on a sidewall of the core to hold the light emitting element at a non-zero angle with respect to a longitudinal axis of the electronic lighting device to allow illumination of the flame component. The device further includes a control circuit to control an operation of the lighting emitting element.

A resonant member of a MEMS resonator oscillates in a mechanical resonance mode that produces non-uniform regional stresses such that a first level of mechanical stress in a first region of the resonant member is higher than a second level of mechanical stress in a second region of the resonant member. A plurality of openings within a surface of the resonant member are disposed more densely within the first region than the second region and at least partly filled with a compensating material that reduces temperature dependence of the resonant frequency corresponding to the mechanical resonance mode.

Aspects relate to methods of building Z-graded radiation shielding and covers. In one aspect, the method includes: providing a substrate surface having about medium Z-grade; plasma spraying a first metal having higher Z-grade than the substrate surface; and infusing a polymer layer to form a laminate. In another aspect, the method includes electro/electroless plating a first metal having higher Z-grade than the substrate surface. In other aspects, the invention provides methods of improving an existing electronics enclosure to build a Z-graded radiation shield by applying a temperature controller to at least part of the enclosure and affixing at least one layer of a first metal having higher Z-grade than the enclosure.

A power transformer includes at least two first windings, at least two second windings interleaved with the at least two first windings, and a magnetic core. The at least two first windings and the at least two second windings are positioned adjacent the magnetic core. Each first winding includes a wire and a plurality of turns. One or more windings of the at least two first windings include a bonding material and at least two adjacent turns of said plurality of turns adhered to each other via the bonding material. Other example power transformers, methods of manufacturing power transformers, and methods of manufacturing windings are also disclosed.

A method of making an inductor includes forming a plurality of first metal layers on a substrate and an ILD. The method includes patterning a plurality of trenches in the ILD, depositing a magnetic material, and depositing another layer of ILD. The method further includes patterning a plurality of vias adjacent to the trenches filled with the magnetic material, and patterning trenches in the another layer of ILD. The trenches in the another layer of ILD include first portions arranged over, adjacent to and substantially parallel the plurality of first metal layers, and the second portions arranged substantially perpendicular to the first portions, extending from both ends of the first portions, and oriented in opposite directions such that the second portions are continuous with the plurality of vias. The method includes depositing a metal in the plurality of vias and the trenches in the another layer of ILD.

A mother substrate that enables winding cores to be obtained in a manner in which the mother substrate is divided along x-direction division lines and y-direction division lines is prepared. Subsequently, x-direction division grooves are formed along the x-direction division lines on a first main surface of the mother substrate, y-direction division grooves are formed along the y-direction division lines on the first main surface, and shallow bottom surface exposure grooves, for exposing surfaces that are to be core portion bottom surfaces, are formed on the first main surface. The mother substrate is divided by performing a flattening process on a second main surface of the mother substrate that is opposite the first main surface until the second main surface reaches the x-direction division grooves and the y-direction division grooves to obtain the winding cores that are separated from each other.