A wireless control system, a touch-sensitive pad structure, a touch-sensitive module and a method for manufacturing the touch-sensitive module are provided. The wireless control system includes a controlled device and a remote controller which includes the touch-sensitive module. The touch-sensitive module includes a plurality of sensor pads. The controlled device is controlled by detecting changes of physical properties of the sensor pads without touching the sensor pads.

A waterproof button assembly. The waterproof button assembly may include a housing including an opening and a button. The button may be positioned at least partially within the housing via the opening. The assembly may also include a plurality of engagement components positioned on opposite-distal ends of the button. The plurality of engagement components may be configured to retain the button within the housing. The engagement components may extend distally from the button, such that a portion of the engagement components may be positioned within apertures formed in the sidewall of the housing. The assembly may also include a plurality of supports, a tactile dome in contact with the button and at least one of the plurality of supports. A sensing component of the assembly may be positioned adjacent the housing and in alignment with the button and/or tactile dome for sensing actuation of the button within the assembly.

A method for making a touch panel, the method includes the following steps. Two touch panel units are made. The two touch panel units are spaced apart from each other. Making each of the two touch panel units includes the following steps. A carbon nanotube material and a substrate are provided. A carbon nanotube floccule structure is made by flocculating the carbon nanotube material. A conductive layer on the substrate is obtained by applying the carbon nanotube floccule structure on the substrate. Two electrodes on opposite ends of the substrate formed to obtain an electrode plate.

A method of adjusting a switch of a device, wherein the method comprises using a biasing force-adjusting element to adjust a magnitude of a biasing force that is imparted to a switching element of the switch by a biasing element that is disposed about the switching element. The biasing force places the switching element in one of a first position and a second position, wherein the first position corresponds to a first electrical state and the second position corresponds to a second electrical state.

There is provided an information processing apparatus, including: a display unit including a display area, the display area being configured to display an image; and a touchscreen unit including a facing area and an outer area, the facing area facing the display area, the outer area being outside of the facing area. An area of the touchscreen unit is attached to the display unit, the area including the facing area and the outer area.

A method of adjusting a switch of a device, which comprises using a biasing force-adjusting element, adjusting a magnitude of a biasing force imparted to a switching element of the switch by a biasing element disposed about the switching element, wherein the switching element is movably disposed within an interior cavity of a hollow body of the switch and the biasing force places the switching element in one of a first position and a second position. The first position corresponds to a first electrical state and the second position corresponds to a second electrical state.

An embodiment modular light-emitting diode (LED) display panel includes attachment points for use in attachment as part of a multi-panel modular LED display, a printed circuit board including a first side and an opposite second side, and a plastic casing attached to the opposite second side of the printed circuit board. A perimeter of the plastic casing is substantially rectangular and has a height and a width. The modular LED display panel further includes a display surface including a plurality of LEDs arranged as pixels and attached to the first side of the printed circuit board. The pixels are arranged in a rectangular array including at least fifty pixels. Each of the pixels of the rectangular array is spaced from each respective adjacent pixel of the rectangular array by a pitch. The pitch is a predetermined constant number. The pitch does not depend on the height and the width.

A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

The invention relates to a device for temperature control in potentially explosive areas, comprising a temperature controller (10) and a housing (11) in which the temperature controller (10) is arranged, the housing (11) having a sealed opening (12) through which electrical lines (13, 14) of the temperature controller (10) are passed. It is characterized in that the temperature controller (10) has a measuring surface (15) which lies directly against an inner wall (16) of the housing (11) at least in certain areas and is electrically connected to an earthing tab (17), said earthing tab (17) being electrically connected to another line (18) which is guided through the opening (12).

A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.