A heatsink with an internal cavity for liquid cooling includes: a first part having a first group of fins extending into the internal cavity; a second part attached to the first part so that the internal cavity is formed, the second part having a second group of fins that extend into the internal cavity and that are configured to fit among the first group of fins; an inlet into the internal cavity on at least one of the first and second parts; and an outlet from the internal cavity on at least one of the first and second parts.

A modular plate and shell heat exchanger in which welded pairs of heat transfer plates are placed in the shell in order to transfer heat from a secondary fluid to a primary fluid. The heat transfer plates are removably connected using gaskets to header pipes which are connected to a primary fluid inlet and a primary fluid outlet nozzle. The header pipes are supported by a structure which rests on an internal track which is attached to the shell and facilitates removal of the heat transfer plates. The modular plate and shell heat exchanger has a removable head integral to the shell for removal of the heat transfer plates for inspection and replacement.

A backside initiated uniform heat sink loading system includes a system board assembly, a heat sink assembly, a loading plate, and a fastener. The system board assembly includes at least one processing unit. The heat sink assembly is mounted upon the processing unit from a topside of the system board assembly and includes a plurality of tension members that extend through the system board assembly. The loading plate is mounted to the plurality of tension members from a backside of the system board assembly. The fastener engages with the loading plate from the backside and forces the loading plate away from the system board assembly. As a result, the tension members uniformly force the heat sink assembly upon the processing unit to seat the processing unit with the system board assembly and to thermally contact the heat sink assembly with the processing unit.

Technologies for a micro-concentrator modular array. The micro-concentrator modular array may include two or more micro-concentrator solar modules. One or more of the micro-concentrator solar modules may be removable from the micro-concentrator modular array. Micro-concentrator solar modules may be added to a micro-concentrator modular array. One or more of the micro-concentrator solar modules may be electrically and/or mechanically connected to other micro-concentrator solar modules. To facilitate an electrical connection, a conductive connector may be used to connect an electrical output of one micro-concentrator solar module with an electrical input of another micro-concentrator solar module.

A component according to an exemplary aspect of the present disclosure includes, among other things, a wall and a vascular engineered lattice structure formed inside of the wall. The vascular engineered lattice structure includes at least one of a hollow vascular structure and a solid vascular structure configured to communicate fluid through the vascular engineered lattice structure.

A component according to an exemplary aspect of the present disclosure includes, among other things a wall and a vascular engineered lattice structure formed inside of the wall. The vascular engineered lattice structure defines a hollow vascular structure configured to communicate a fluid through the vascular engineered lattice structure. The vascular engineered lattice structure has at least one inlet hole and at least one outlet hole that communicates the fluid into and out of the hollow vascular structure. A method for producing a component is also disclosed.

An improved, energy-efficient HVAC system and method of use employing a solution that is run parallel to refrigerant lines in a chiller unit. The solution is directed through the chiller unit through its proximity to chilled refrigerant wherein the chilled solution, rather than refrigerant, enters an air handler or an air pump and used to adjust the air temperature to a desired level. The system and method permits the place of a refrigerant based system external an enclosed building and a non refrigerant based system position internal the enclosed building.

A repair kit and associated method for repairing an automotive coolant pipe for fluid-conducting within an engine block of an engine includes at least a repair stent, sealant and instructions for performing the method. The repair stent may be a whole tube, or a hollow semi-cylinder defining a gap. The method includes draining coolant from the engine, removing the water pump from the engine without removing the timing chain cover of the engine, inserting the repair stent including a sealant through the coolant passage, wherein the coolant passage extends through the timing chain cover into the engine, re-assembling the water pump to the engine and adding coolant to the engine.

A helically coiled heat exchanger with a plurality of inlets each connected to at least one assigned tube defining a heating surface of the heat exchanger and having at least one changeover means to switch the inlet between a first operating state and a second operating state. In the first operating state, a stream of a first medium and, in the second operating state, a stream of a second medium is introduced via the inlet into the assigned tube. In the first operating state more heating surface is available to the stream of the first medium and correspondingly less heating surface is available to the stream of the second medium. In the second operating state more heating surface is available to the stream of the second medium and correspondingly less heating surface is available to the stream of the first medium.

A thermal management system that provides cooling to an electronic device is disclosed. The thermal management system includes a surface having a plurality of extended elements thermally coupled to the surface, a plurality of vibrator assemblies configured to generate a cooling flow across the surface, and a mounting structure disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angel, such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle.