A method for creating a sandwich panel heat pipe is disclosed. A three-dimensional ordered micro-truss core comprising a plurality of periodically disposed unit cells comprising an open-cellular microstructure and a free space defined by the open-cellular microstructure wherein the core comprises a vapor region and a liquid region separated by a mesh structure. A first face sheet and a second face sheet are stacked with the three-dimensional ordered micro-truss core to form a heat pipe assembly with the mesh structure in the three-dimensional ordered micro-truss core being planar and substantially parallel to the first face sheet and the second face sheet. The first and second face sheets are bonded to enclose the three-dimensional ordered micro-truss core wherein the free space of the three-dimensional ordered micro-truss core between the first and second face sheets is filled with a working fluid through an inlet and the inlet is sealed.

The invention relates to a method which is suited for manufacturing a 3D-vapor chamber in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber having an evaporator and a condenser made from a first part and a second part, wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber.

A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

[Purpose] To provide is a method capable of producing a heat-dissipating unit easily and at low cost. [Solution] The method of producing a heat-dissipating unit 12 includes: inserting pins 17 punched out of a second plate member 22 for pins into a plurality of through-holes 16 formed in a first plate member 20 for a substrate. In the first plate member 20, a plurality of substrate forming portions 25 is provided side by side in the longitudinal direction of the first plate member 20. In the second plate member 22, a plurality of pin punch-out portions 26 is provided side by side in the longitudinal direction of the second plate member 22. The method includes: a step A of forming the through-holes 16 in the substrate forming portion 25 of the first plate member 20; a step B of subjecting the pin punch-out portion 26 of the second plate member 22 to a half-punch out process to form half-punched-out pin forming portions 27 protruding from one surface side of the second plate member 22; a step C of forming the pins 17 by punching out the pin forming portions 27 from the second plate member 22 and simultaneously inserting the pins 17 into the through-holes 16 in the first plate member 20; and a step D of forming a substrate by cutting the substrate forming portion 25 with the pins 17 inserted in the through-holes 16 from the first plate member 20.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.

A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.

A method includes providing a first metal sheet and a second metal sheet, printing a channel pattern on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, forming a plurality of channels by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, sealing the first metal sheet and the second metal sheet, and forming a plurality of through holes in locations where the first metal sheet and the second metal sheet are bonded to each other. The plurality of through holes are arranged in a plurality of rows, each row including at least two through holes, and each location where the first metal sheet and the second metal sheet are bonded to each other includes a single through hole of the plurality of through holes.

A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.