Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

A structural panel for a satellite comprising an elongate pipe mounted thereto. The heat pipe is bonded to the panel intermediate its remote ends with a thermally conductive adhesive. The adhesive is omitted proximate at least one distal end of the heat pipe. The at least one distal end of the heat pipe without adhesive is mechanically secured to the panel by at least one bolt received in a cooperating threaded receiving element. A method of manufacturing such a panel is also provided.

An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

A sandwich panel heat pipe with a three-dimensional ordered open-cellular micro-truss core and a method creating the same. In one embodiment, the sandwich panel heat pipe includes a first face sheet, a second face sheet, the three-dimensional ordered open-cellular micro-truss core between the first face sheet and the second face sheet, and a working fluid in the ordered open-cellular micro-truss core. Here, the three-dimensional ordered open-cellular micro-truss core includes a vapor region and a liquid region, the vapor region is for transporting a vapor phase portion of the working fluid to the liquid region, and the liquid region is for transporting a liquid phase portion of the working fluid to the vapor region.

A preparation process of a copper powder metal plating layer, a metal substrate having the copper powder metal plating layer, an energy-saving anti-burst heat dissipation device and a preparation process thereof; the process of preparing the copper powder metal plating layer comprises the step of attaching the metal layer; the temperature of the liquid in the work tank is kept within a range of 1-15 C.; the attachment process of the metal layer comprises at least the steps of: attaching the bottom layer, attaching the snowflake-shaped layer and attaching the fastening layer.

An example memory cooler may include a vapor chamber device and a number of heat pipes connected to the vapor chamber device. The vapor chamber device may include walls that bound a vapor chamber, the heat pipes may include vapor channels, and the heat pipes may be connected to a first wall of the vapor chamber device such that their respective vapor channels are communicably connected to the vapor chamber. The example memory cooler may also include fins extending from a second wall of the vapor chamber device, the second wall bounding the vapor chamber. The fins and the second wall may be part of the same continuous body.

Disclosed is a method for producing a cylindrical membrane wall including a plurality of tubes having a coolant passing through an inner part thereof. The method includes producing a plurality of sub-bundles by welding a plurality of tubes to each other after longitudinally arranging the tubes to be adjacent to each other in parallel, producing a plurality of panel-type bundles by welding the sub-bundles to each other, forming a plurality of curved bundles having a curved surface of a predetermined curvature by pressing the panel-type bundles, and welding the curved bundles to each other using a jig.

Provided is an automatic secondary degassing fixed-length mechanism for an ultrathin heat pipe. The automatic secondary degassing fixed-length mechanism comprises an automatic lifting device A installed on a length adjustment sliding table, an automatic clamping device B, a length positioning and extension device C and a PLC. The present invention, having the advantages of simple structure, high efficiency and stability, is suitable for the secondary degassing fixed-length processing of heat pipes of different lengths, and particularly suitable for processing ultrathin heat pipes made of a thin-walled heat pipe by a flattening process, having advanced structural design and stable and high-efficiency production. In this mechanism, size positioning and automatic clamping in the secondary degassing fixed-length process for the heat pipes are correspondingly achieved through the automatic lifting device A and the automatic clamping device B. Downward component force applied to the thin-walled heat pipes in the die-opening-sealing process is released through the length positioning and extension device C, so that deformation of bending or partial sinking of pipe bodies of the thin-walled heat pipes in the secondary degassing fixed-length process is avoided. In this way, the qualification rate of the products and the economic benefit of the enterprise are greatly improved, and the problems with the existing secondary degassing fixed-length processing of the ultrathin heat pipe are solved.

A capillary device (102) for use in a heat pipe in which heat is transferred from at least one evaporation region to at least one condensation region by means of evaporated working fluid is disclosed. The capillary device comprises a body portion defining chambers (108) containing powdered material (110) therein, wherein at least part of the periphery of at least one said chamber is porous to allow flow of condensed working fluid, by means of capillary action, through said powdered material in said chamber when flowing from a condensation region to an evaporation region.