A base plate for cooling a power electronics device is provided, the base plate comprising cooling fins, the base plate configured to receive the power electronics device directly above the cooling fins, the cooling fins integral to the base plate, the base plate configured to conduct a liquid coolant past the cooling fins

A collapsible heat exchanger comprising a first sheet; a second sheet on an opposing side of the collapsible heat exchanger from the first sheet; a first expansion element coupled to and extending between the first and second sheets; a second expansion element coupled to and extending between the first and second sheets; a manifold including a plurality of channels defined by at least one of a plurality of internal sidewalls; and a heat exchanger cavity defined at least by the plurality of channels and a first and second fluid conduit.

The invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof. It comprises the steps of rolling a first heat conductive material and a substrate to adhere the first heat conductive material to the substrate for fixation; adhering a second heat conductive material to the substrate for combination; and rolling the second heat conductive material and the substrate for firmly combination and fixation to complete the manufacturing of a composite material.

A membrane heat exchanger comprising a first planar sheet and a second planar sheet coupled to the first planar sheet to form at least one fluid chamber defined by the first and second sheets and a first and second end that respectively communicate with a first and second port defined by at least one of the first and second sheet.

The present invention relates to an intermediate product for joining and coating by brazing comprising a base metal and a blend of boron and silicon, said base metal having a solidus temperature above 1040 C., and the intermediate product has at least partly a surface layer of the blend on the base metal, wherein the boron in the blend is selected from a boron source, and the silicon in the blend is selected from a silicon source, and wherein the blend comprises boron and silicon in a ratio of boron to silicon within a range from about 3:100 wt/wt to about 100:3 wt/wt. The present invention relates also to a stacked intermediate product, to an assembled intermediate product, to a method of brazing, to a brazed product, to a use of an intermediate product, to a pre-brazed product, to a blend and to paint.

A fitting assembly containing a fitting, a first plate and a second plate are provided. The first plate has a first plate wall and a first-plate aperture, the first-plate wall being positioned along an edge of the first plate defining the first-plate aperture. The second plate has a second-plate wall and a second-plate aperture, the second-plate wall being positioned along an edge of the second plate defining the second-plate aperture. The fitting assembly having the fitting being sandwiched between the first plate wall and the second plate wall. Also disclosed is a heat exchanger having the fitting assembly as described herein, and a method of forming the fitting assembly.

The present invention relates to composition comprising a blend of at least one boron source and at least one silicon source, and the composition further comprises particles selected from particles having wear resistance properties, particles having surface enhancing properties, particles having catalytic properties or combinations thereof, wherein the blend comprises boron and silicon in a weight ratio boron to silicon within a range from about 3:100 wt:wt to about 100:3 wt:wt, wherein silicon and boron are present in the blend in at least 25 wt %, and wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the blend is a mechanical blend of particles in and the particles have an average particle size less than 250 m. The present invention relates further to a method for providing a coated product and a coated product obtained by the method.

A method for producing a plate heat exchanger with at least two heat exchanger blocks which are produced separately from one another in a soldering furnace Each heat exchanger block has multiple separating sheets arranged parallel to one another and which form a plurality of beat exchanger passages for fluids involved in a heat exchange process. At least one support provided with solder is heated in order to melt the solder, the support is arranged between opposing outer surfaces of the heat exchanger blocks to be connected which are placed one on top of the other or adjacently, the support(s) thus being fixed between the opposing outer surfaces. After the solder is hardened, a bonded and heat-conductive connection is produced between the heat exchanger blocks. Sheets or wire arrangement can be used as the supports.

A semiconductor module radiator plate fabrication method includes soldering a plurality of insulating substrates of different shapes to a flat radiator plate, and forming a convex curve on an insulating substrate side of the radiator plate; obtaining a first concave curve by reversing the convex curve; setting a second concave curve on an insulating substrate side of a radiator plate after soldering, a bottom of the second concave curve being positioned under clearance between the plurality of insulating substrates; adding the first curve and the second curve to calculate a third concave curve on the insulating substrate side; and forming the third curve on a flat plate to form a radiator plate before soldering.

A method of making a package for a fuel unit, a fuel unit including the package, and a hydrogen generator including one or more of the fuel units are disclosed. The package includes a package strip made by forming apertures in a nonconductive substrate strip, forming conductor sections in a conductor strip, aligning the substrate and conductor strips, bonding the conductor sections to the substrate strip to cover the apertures, and removing non-bonded portions of the conductor strip. A package enclosing a hydrogen generating reactant is formed by securing a segment of the package strip to itself, to one or more other segments and/or to one or more other package components. One or more conductor sections in the package strip are in thermal contact with one or more quantities of reactant composition so heat can be transferred thermally decompose the reactant composition and generate hydrogen gas.