A microfluidic refill includes a reservoir having a hollow body and an opening; a transport member in fluid communication with the reservoir; and a lid enclosing the opening of the reservoir. The lid is in fluid communication with the transport member. The lid comprises a rigid microfluidic delivery member. The rigid microfluidic delivery member includes a die and electrical traces that are in electrical communication with the die, wherein the electrical traces terminate at electrical contacts, wherein the electrical traces are disposed on only one plane. The die has a fluid chamber in fluid communication with the transport member at an inlet of the fluid chamber and with an orifice at an outlet of the fluid chamber and.

A system for generating a repair patch for a damaged area of a composite structure may include a scanning module, a repair patch model generator and a cutting tool. The scanning module may be deployed at the location of the damaged composite structure. The scanning module may be configured to scan the damaged area to generate scanned data indicative of a shape, size and/or contours of the damaged area. The repair patch model generator may include processing circuitry configured to obtain the scanned data, obtain parent ply information of the damaged composite structure, and generating a patch model of a repair patch including size and shape definition for each of a plurality of plies based on the scanned data and the parent ply information. The cutting tool may be configured to receive cutting files based on the patch model to generate a plurality of cut plies that combine to form the repair patch.