A sensor utilizing a non-leachable or diffusible redox mediator is described. The sensor includes a sample chamber to hold a sample in electrolytic contact with a working electrode, and in at least some instances, the sensor also contains a non-leachable or a diffusible second electron transfer agent. The sensor and/or the methods used produce a sensor signal in response to the analyte that can be distinguished from a background signal caused by the mediator. The invention can be used to determine the concentration of a biomolecule, such as glucose or lactate, in a biological fluid, such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. An enzyme capable of catalyzing the electrooxidation or electroreduction of the biomolecule is typically provided as a second electron transfer agent.

Provided are a method of manufacturing, and a working tool for, a member having a closed-bottom hole portion that can achieve a good yield of the material, can improve the durability of the cutting blade, and can reduce the force required for the work, by forming a hollowed-out bottom portion using a cutting wire having a two-point support. A method of manufacturing a member having a closed-bottom hole portion by inside-removing-working a raw material made of a carbonaceous material, the closed-bottom hole portion having a hollowed-out side portion and a hollowed-out bottom portion formed by hollowing out an inner portion of the raw material, including: a step of forming a cylindrical trench by digging the raw material frontward from a near-side end face of raw material while rotating the raw material, to form the hollowed-out side portion; and a step of forming the hollowed-out bottom portion by supporting a cutting wire inserted into a bottom portion of the cylindrical trench at two points while rotating the raw material, and pressing the cutting wire being supported at the two points in a direction approaching an axis line of the raw material.

A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.