Patent classifications
Y10T29/49993
Scaffolds having a radiopaque marker and methods for attaching a marker to a scaffold
A scaffold includes a radiopaque marker connected to a strut. The marker is retained within the strut by a head at one or both ends. The marker is attached to the strut by a process that includes forming a rivet from a radiopaque bead and attaching the rivet to the marker including deforming the rivet to enhance resistance to dislodgement during crimping or balloon expansion. The strut has a thickness of about 100 microns.
High aspect ratio vias filled with liquid metal fill
A substrate includes a substrate body made of a material such as glass, and at least one electrical via that extends at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.
SCAFFOLDS HAVING A RADIOPAQUE MARKER AND METHODS FOR ATTACHING A MARKER TO A SCAFFOLD
A scaffold includes a radiopaque marker connected to a strut. The marker is retained within the strut by a head at one or both ends. The marker is attached to the strut by a process that includes forming a rivet from a radiopaque bead and attaching the rivet to the marker including deforming the rivet to enhance resistance to dislodgement during crimping or balloon expansion. The strut has a thickness of about 100 microns.
HIGH ASPECT RATIO VIAS FILLED WITH LIQUID METAL FILL
A substrate is provided that includes a substrate body made of a material such as glass, and at least one electrical via that can extend at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.
Drive shaft assembly for driven accessory devices
A drive shaft assembly includes an outer shaft, an inner shaft, and an interface medium. The outer shaft defines a central channel. The inner shaft extends into the central channel and defines a clearance gap between an interior surface of the outer shaft and an exterior surface of the inner shaft. The interface medium is disposed in the clearance gap and rotationally couples the outer shaft and the inner shaft in an operational state of the drive shaft assembly. In response to a temperature of the drive shaft assembly exceeding a threshold temperature, the interface medium at least partially melts and rotationally uncouples the outer shaft and the inner shaft in a fault state of the drive shaft assembly.