Patent classifications
Y10T29/53174
Electric conductor insertion apparatus
An insertion apparatus includes a conductor guide member that guides a prescribed region of an electric conductor to a slot of a stator core, and a support body that supports the conductor guide member. In this configuration, the conductor guide member can float in an axial direction of the stator core.
Support pin arrangement determination assisting apparatus
A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.
Article management apparatus and article management method
An article management apparatus allocates articles necessary for a board working machine out of the articles stored in a storage based on a production plan of the board working machine that performs a predetermined board work on the board to produce the board product. The article management apparatus includes a first setting section, a second setting section, and a selecting section. The first setting section allows a user of the board working machine to set a restriction condition for each production plan of the board product. The second setting section allows the user to set a priority among multiple priority elements when allocating the articles for the articles needed in a case of producing the board product under the restriction condition set by the first setting section. The selecting section allocates the articles based on the priority of the priority element set by the second setting section.
Component mounting device
A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.
Repair or refurbishment of limited use medical devices
A powered medical device includes electronic components on a circuit board embedded within the body of a plug for connecting the device with a control apparatus. The medical device may be repaired or refurbished without the need to access the embedded circuit board through the use of a supplemental circuit board installed into the open end of the plug adjacent the plug pins. The supplemental circuit board may include a variety of electronic components, including fuses or non-volatile memory.
Apparatus to control transfer parameters during transfer of semiconductor devices
An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.
ENHANCED SEMICONDUCTOR STRUCTURES
A system in package comprising: one or more component(s); one or more heat spreader(s); and one or more substrate(s) having cavity(ies), wherein said cavity(ies) including a first cavity and a second cavity; said one or more component(s) is/are disposed within said first cavity and exposed to said second cavity; said one or more component(s) is/are coupled to said one or more substrate(s); and said one or more component(s) and said one or more substrate(s) are attached to said one or more heat spreader(s).
Semiconductor structure and method for making thereof
An integrated circuit package comprising one or more electronic component(s); and one or more substrate(s), including a first substrate and a second substrate, wherein said first substrate including a first cavity on a first surface of said first substrate and a second cavity on a second surface of said first substrate, said second substrate includes a third cavity on a first surface of said second substrate and a fourth cavity on a second surface of said second substrate, said first substrate and said second substrate are stacked and coupled, and said one or more electronic component(s) is/are disposed inside said first cavity of first substrate and said fourth cavity of second substrate.
Method for assembling a camera for a vision system of a vehicle
A method for assembling a camera suitable for use for a vision system of a vehicle includes providing a circuit board having first and second sides separated by a thickness dimension of the circuit board. An imager is disposed at the first side of the circuit board and solder pads are disposed at the second side of the circuit board. The solder pads are in electrical connection with circuitry of the circuit board. A coaxial connector is aligned at the solder pads at the second side of the circuit board. The coaxial connector is soldered at the second side of the circuit board via melting the solder paste at the solder pads.
Electrical element transfer apparatus
According to various embodiments, provided is an electrical element transfer apparatus comprising: a fixing jig in which each of a plurality of electrical elements is arranged at a predetermined interval; a movement jig movably arranged at an upper part of the fixing jig, and including a plurality of first accommodating grooves for accommodating at least a part of each of the plurality of electrical elements; and an attraction device arranged around the movable jig and attaching each of the plurality of electrical elements through the movable jig to the first accommodating groove of the movable jig through magnetic force. Additional various embodiments are possible.