A component mounting device includes a control device configured to execute a recognition data creation process and a pickup process. In the recognition data creation process, the control device creates the recognition data by obtaining the angle information of the component, causing the imaging device to operate so as to image the component, and rotating the captured image so obtained to the reference angle based on the angle information. In the pickup process, the control device causes the head to operate so as to pick up the component after the supply state of the component is determined based on the captured image obtained by causing the imaging device to operate so as to image the component, the recognition data created in the recognition data creation process, and the angle information.

An electronic package comprising a first substrate that includes a first plurality of substrate vias and one or more cavities, a second substrate that includes a second plurality of substrate vias and one or more cavities, and a standoff substrate(s). The standoff substrate(s)positioned between the first and second substrate, the standoff substrate(s) is affixed to each of the first and second substrate, standoff substrate(s) forms a clearance between the first and second substrate, the standoff substrate(s) comprises an intervening plurality of substrate vias passing through the entire thickness of the standoff substrate(s), and a portion of the second plurality of substrate vias are configured to be or capable of being electrically connected to a portion of the first plurality of substrate vias by way of a portion of the intervening plurality of substrate vias.

Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

A powered medical device includes electronic components on a circuit board embedded within the body of a plug for connecting the device with a control apparatus. The medical device may be repaired or refurbished without the need to access the embedded circuit board through the use of a supplemental circuit board installed into the open end of the plug adjacent the plug pins. The supplemental circuit board may include a variety of electronic components, including fuses or non-volatile memory.

A component mounting system includes a component mounting apparatus, a data creating apparatus and a component arranging operation supporting apparatus. The component mounting apparatus mounts components on a substrate. The data creating apparatus creates component data for each component. The component arranging operation supporting apparatus includes an identification information acquiring unit that acquires component identification information given to the component supplying member, and a control unit which checks a component to be disposed in a position based on the component identification information. The control unit of the component arranging operation supporting apparatus performs a request for a creation of component data regarding an alternative component, and the data creating apparatus receives the request and creates the component data regarding the alternative component.

In mounter, work using multiple suction nozzles is executed by executing an exchange of suction nozzles between nozzle station and mounting head. In addition, placement positions of suction nozzles at nozzle station are set so that the distance between accommodation section at the nozzle station and part camera is shorter for the suction nozzle to be exchanged more times at the nozzle station. Then, for exchange of suction nozzles during mounting work, the suction nozzle attached to the mounting head is returned to a placement section corresponding to a set placement position. As a result, placement positions at the nozzle station are rearranged into the set placement positions, so that the distance that the mounting head moves for nozzle exchange can be made shorter, which makes it possible to reduce the time required for nozzle exchange.

Provided is a method for operating an electronic component mounting system including component storages including a dry box. The method includes maintaining a material management table including a whereabouts information field for indicating whether an electronic component is stored in the dry box, a target indicator field for indicating whether an electronic component is a moisture management target component, and an exposure time field for indicating an exposure time during the moisture management target component has been in an atmospheric exposure state. The method also includes pausing counting the exposure time when the moisture management target component is stored in the dry box, identifying a moisture management target component of which the exposure time has met or exceeded an exposure limit time based on the whereabouts information table, and notifying the identified moisture management target component to an apparatus.

During mounting of an upper component on a lower component, after mounting the lower component on a board, the Z-axis position of a suction nozzle tip is detected during mounting of the lower component on the board and memorized as a lower component height, and when mounting the upper component PU, the suction nozzle is lowered at relatively high speed until reaching a specified position that is a distance above the lower component height, and the suction nozzle is lowered at a speed that is slower than the speed after arriving at the specified position until contact with the lower component.

An assembly system that includes a robot adapted to grip an electronic device to be mounted on a circuit board, a first vision system that identifies a position and a posture of the electronic device gripped by the robot, a fixing device that fixe a plurality of circuit boards thereon, and a second vision system that identifies a position and a posture of the circuit board fixed on the fixing device. The robot mounts the gripped electronic device on a circuit board under the visual guidance of the first vision system and the second vision system. The view field of the second vision system is not capable of completely covering a surface region of all circuit boards fixed on the fixing device. The assembly system further includes a moving mechanism that moves the second vision system in a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction, so that the second vision system completes identification of all circuit boards on the fixing device step by step. With this assembly system, the robot complete the assembly work of all circuit boards at an assembly station. Also, a method of assembling a circuit board that mounts a gripped electronic device on a circuit board.

Provided is a method for operating an electronic component mounting system including component storages including a keeping rack, a dry box and a dryer. The method includes, after a reel of a moisture sensitive device is dispatched from a component keeping area and setup to a tape feeder is performed in an external setup area, measuring a exposure time for which the moisture sensitive device is in an atmospheric exposure state is in a reel unit, and comparing the exposure time with an exposure limit time set for the moisture sensitive device and stored in a storage. The method includes stopping using the reel of the moisture sensitive device whose exposure time exceeds the exposure limit time.