An integrated circuit package comprising one or more electronic component(s); and one or more substrate(s), including a first substrate and a second substrate, wherein said first substrate including a first cavity on a first surface of said first substrate and a second cavity on a second surface of said first substrate, said second substrate includes a third cavity on a first surface of said second substrate and a fourth cavity on a second surface of said second substrate, said first substrate and said second substrate are stacked and coupled, and said one or more electronic component(s) is/are disposed inside said first cavity of first substrate and said fourth cavity of second substrate.

A powered medical device includes electronic components on a circuit board embedded within the body of a plug for connecting the device with a control apparatus. The medical device may be repaired or refurbished without the need to access the embedded circuit board through the use of a supplemental circuit board installed into the open end of the plug adjacent the plug pins. The supplemental circuit board may include a variety of electronic components, including fuses or non-volatile memory.

A component mounting apparatus includes a nozzle that sucks a component supplied from a feeder, conveys the component to a predetermined position on a substrate, and mounts the component in the predetermined position. The component mounting apparatus controls an XY-robot to perform repeatedly the component mounting operation while performing a thermal correction from a start of the component mounting operation as a result of a power supply being turned on until an amount of positional deviation due to heat from the XY-robot reaches a steady state. After the steady state is achieved, the component mounting apparatus controls the XY-robot to perform repeatedly the component mounting operation while performing a steady state correction using a correction amount resulting immediately after the steady state is achieved without performing the thermal correction and controls the XY-robot to perform a dummy operation for maintaining the steady state during a standby period.

A component supply device, in which, a component storage tape is introduced to a first tape feed-out, unit through a tape introduction guiding unit, a first tape feed-out control unit controls the first tape feed-out unit to feed out the component storage tape. A first calculation unit calculates a standard tape length of the component storage tape. A second calculation unit calculates, based on the standard tape length, a target feed-out length of the component storage tape to be fed out by the second tape feed-out unit, so that a center of a leading component storage unit of the component storage tape coincides with a component extraction position. A second tape feed-out control unit controls the second tape feed-out unit so that the component storage tape is fed out based on the target feed-out length.

An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.

A frame structure of a work machine includes a left frame in which a first left rail of a first guide device is provided at a lower portion thereof; a right frame in which a second right rail of a second guide device is provided at a lower portion thereof; a center frame disposed between the left frame and the right frame and in which a first right rail of the first guide device and a second left rail of the second guide device are provided at a lower portion thereof; a front frame connecting a pair of front columns together and also connecting respective front ends of the left frame, the right frame, and the center frame; and a rear frame connecting a pair of rear columns together and also connecting respective rear ends of the left frame, the right frame, and the center frame.

A support pin arrangement determination assisting apparatus including a display unit which displays an image including a board image, the board image indicating a shape and an arrangement of a component on the board, a position input unit through which an arrangement position of the support pin is input, a display processing unit which causes the display unit to display a figure to be superimposed on the board image, the figure corresponding to the support pin of which the arrangement position is input, a storage unit which stores three-dimensional shape data of an electronic component and three-dimensional shape data of the support pin, an interference judging unit which judges whether or not one or some of the support pins of which arrangement positions input interfere an already mounted component, and an alarm unit which announces occurrence of interference if the interference judging unit judges the occurrence of interference.

A system comprising a plurality of electronic components, wherein said plurality of electronic components including a first component and a second component, and said first component is a security component configured to generate and/or store security key(s); a substrate; one or more standoff substrate(s) comprising of cavity(3ies), wherein said one or more standoff substrate(s) is/are coupled to said substrate, said one or more standoff substrate(s) completely encircles said substrate, said security component is disposed inside said cavity(ies), said security component is coupled to said substrate, said security component is obfuscated by said substrate and said one or more standoff substrate(s), and said security component and said second component are configured to communicate security key(s) for performing device identification, authentication, encryption, and/or device integrity verification.

A component supply device includes a plurality of kinds of tape feeders capable of mounting a first component storing tape by which supplying of components is performed precedingly, and a second component storing tape by which supplying of components is performed succeedingly; a component sensor configured to detect runout of the components in the first component storing tape; and a control unit configured to control a tape feeding operation. A specified discharge length by which the first component storing tape is discharged at the time of occurrence of the runout of the components is preliminarily set for each kind of the tape feeder. The control unit is configured to make the tape feeder perform a tape feeding operation for feeding the first component storing tape by the specified discharge length when the component sensor detects the runout of the components in the first component storing tape.

A method of determining disposition of a component reel, for determining component reel disposition in which the component reel obtained by winding a component accommodating tape is disposed in a holding unit, includes: acquiring component reel information including information for identifying the component reel, holding unit information including information related to a layout that is capable of being selected when the component reel is disposed in the holding unit, disposition information of the component supply device supplying the component accommodating tape drawn out from the component reel disposed in the holding unit, and constraint condition information related to the component supply device and the component accommodating tape to be supplied to the component supply device; and determining the component reel disposition in which one component reel firstly used by the component supply device among a plurality of the component reels and a next component reel used next by the component supply device among the plurality of component reels are disposed, based on the acquired component reel information, the acquired holding unit information, the acquired disposition information, and the acquired constraint condition information.