With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter.

An electronic device manufacturing system includes a mainframe that includes a first transfer chamber and facets defining first side walls of the first transfer chamber. The facets include a first facet that has a first number of substrate access ports, a second facet that has a second number of substrate access ports, and a third facet that has the second number of substrate access ports. The second number of substrate access ports is different than the first number of substrate access ports.

An electronic component mounting method for mounting a first board and a second board including, mounting a first set of electronic components on the first board allocated to first mounting heads; and mounting a second set of electronic components on the second board allocated to the second mounting heads and to the first mounting heads and the second mounting heads of the second lane dedicated mounters. By this, the mounting load is spread evenly across all the mounting heads, thus the idle time of mounting heads is reduced, improving the operating rate, meaning that panels are produced efficiently by the electronic component mounting method.

When a workpiece holder holding a workpiece is rocked around a lateral rocking axis by a work stage of a mounter and the workpiece is positioned so that one mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the one mounting surface by a mounting head of the mounter. When a posture of the workpiece in the workpiece holder is changed by a posture changing head of a posture changer and thereafter the workpiece holder in which the posture of the workpiece is changed is rocked around the lateral rocking axis by the work stage of the mounter and the workpiece is positioned so that the other mounting surface of the workpiece faces a predetermined direction to be worked, a component is mounted on the other mounting surface by the mounting head of the mounter.

An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects.

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

A component mounting system comprising a feeder stocking area in which feeders to be exchanged with feeders for which exchanging is necessary from among multiple feeders which are set in the feeder setting area of each of the component mounting machines are caused to wait; and an exchanging robot which removes the feeders for which exchanging is necessary from the feeder setting area of each of the component mounting machines, removes the feeders to be exchanged with the feeders for which exchanging is necessary from among the multiple feeders which wait in the feeder stocking area, and sets the feeders in the feeder setting area of the component mounting machine.

An automatic manufacturing station (3) and a manufacturing process for workpieces (2), in particular for vehicle body parts, has a manufacturing area (4) with a plurality of program-controlled manufacturing robots (9). The workpieces (2) are externally fed to the manufacturing station (3) on production load carriers (8). The manufacturing station (3) also has a plurality of work stations (10, 11, 12, 13). A station-bound transport device (15) transports the production load carriers (8) within the manufacturing station (3).

Provided is a method for manufacturing a gas sensor which suppresses a defective product caused by a defective posture of a sensor element therein. The method includes a step of obtaining an assembled body constituting the gas sensor, including steps of: causing one end of the sensor element to come to abut to a positioning member for positioning the sensor element; and applying a first force to the annularly-mounted members including a powder compact annularly mounted to the sensor element under a state that the sensor element is positioned and thereby compressing the powder compact so as to fix the sensor element inside of the tubular body, and the compression is performed while constraining the sensor element in a predetermined constraining region in the other end side of the sensor element.

A device for the production of cable sensors that each have at least one sensor and a cable trimmed to a variably pre-definable length includes at least two processing units, and at least one conveying unit. The processing units are configured to load and cut a cable blank, and are further configured to sequentially convey the cable blank along a pre-defined motion track. At least one deflection unit is positioned between adjacent processing units. Each deflection unit includes at least one deflection element that is in contact with or is configured to contact the cable blank. A displacement unit is assigned to and is configured to modify a position of the deflection element in order to influence a length of the motion track of the cable blank so as to obtain variable lengths of cable.