A transfer head for transferring micro elements includes a cavity with a plurality of vacuum paths; a suite having a plurality of suction nozzles and vacuum path components. The suction nozzles are connected to the vacuum path components respectively, and the vacuum path components are formed to connect to vacuum paths in the cavity respectively. The suction nozzles absorb or release the micro elements through vacuum pressure, which is transmitted by vacuum path components and vacuum paths of each path. When the suite is mounted in the cavity, the upper surface of the suite is arranged with optical switching components for controlling the switch of the vacuum path components and vacuum paths of each path so that the suction nozzles can absorb or release required micro element through vacuum pressure.

This application relates to a substrate pick-and-place equipment and method. The equipment includes: a bearer platform, configured to bear a substrate; a retractable apparatus, including: a foldable bracket, disposed above the bearer platform and foldable along a horizontal direction; a plurality of suction structures, disposed on a bottom of the foldable bracket, where the suction structures are evenly distributed in a coverage area of the foldable bracket, and are configured to suck the substrate; a first drive unit, configured to drive the foldable bracket to extend and retract along the horizontal direction; and a second drive unit, configured to drive the retractable apparatus to rise and descend along a vertical direction; and a conveying apparatus, operating between the bearer platform and the foldable bracket. In the substrate pick-and-place method, a substrate is picked and placed from an upward side by using a suction structure.

An apparatus for combining PCBs may include a pick-up mechanism, a gripping mechanism and a combining mechanism. The pick-up mechanism may pick-up the PCBs connected with each other by a flexible connection member. The gripping mechanism may grip a frame. The combining mechanism may press the flexible connection member using the frame to combine the PCBs with the frame. The process for combining the PCBs with the frame may be automatically performed so that a time for combining the PCBs with the frame is reduced and errors related to the combining process are decreased.

A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging unit capable of imaging the mounting position from a plurality of fields of view, imaging directions of which are different from each other, and a controller that selects a success or failure determination field of view used for success or failure determination of whether or not the component has been mounted at the mounting position from the plurality of fields of view according to a state of a shield around the mounting position.

A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

A feeder device including a tape feeding mechanism which feeds out a carrier tape which stores components in corresponding multiple component storage sections and a cover tape which is adhered to the bottom tape and covers the component storage sections, and a tape peeling mechanism which includes a tape peeling blade which proceeds between the bottom tape and the cover tape as the carrier tape is fed out to perform peeling, the feeder device supplying the components from the component storage sections at a component supply position, and the feeder device further including a feed speed determination section which determines the feed speed at a peeling start time at which a leading end of the carrier tape comes into contact with the tape peeling blade according to at least one of properties of multiple types of carrier tape and characteristics of the components which are stored.

In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

A component mounting machine includes multiple component supply devices which respectively include multiple component supply units and are exchangeably equipped; a component transfer device in which a reference height as a reference of a lifting and lowering operation of a mounting nozzle is set; a height memory section which memorizes a height unique value that is unique for each component supply device and that is a height unique value based on unit heights of each component supply unit when the component supply device is equipped; and a height correction control section which corrects a lowering operation stroke amount of the mounting nozzle based on the height unique value of the equipped component supply device. Accordingly, an error in a height direction can be comprehensively absorbed and the component can be stably picked up by controlling a component pick-up operation of the mounting nozzle based on the height unique value.

In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.