A component placing device has a configuration where a plurality of nozzle shafts are moved in turn to a plurality of stations including a component holding and placing station and a component detecting station by rotating a rotating object having the plurality of nozzle shafts, in which nozzles are installed, about a rotation axis. A configuration where a flow path switcher, which selectively connects a suction path of each of the nozzles to a positive pressure source and to a negative pressure source by movement of a spool, is disposed on an inside of a corresponding one of the nozzle shafts, and air for power to drive the spool is supplied to the rotating object via a manifold, in which a communication plug for power air that comes into contact with an exterior surface of the rotating object is provided, is adopted.

A chip-transferring system and a chip-transferring method are provided. The chip-transferring system includes a substrate-carrying module for carrying a chip-carrying structure, a chip-transferring module, and a system control module. The chip-carrying structure includes a circuit substrate for carrying a plurality of conductive materials, a plurality of micro heaters, and a micro heater control chip. The chip-transferring module is configured for transferring a chip onto two corresponding ones of the conductive materials, and the chip-transferring module includes a motion sensing chip. When chip movement information of the chip that is provided by the motion sensing chip is transmitted to the system control module, the micro heater control chip is configured to control a corresponding one of the micro heaters to start or stop heating the two corresponding conductive materials by control of the system control module according to the chip movement information of the chip.

A component mounting machine includes multiple component supply devices which respectively include multiple component supply units and are exchangeably equipped; a component transfer device in which a reference height as a reference of a lifting and lowering operation of a mounting nozzle is set; a height memory section which memorizes a height unique value that is unique for each component supply device and that is a height unique value based on unit heights of each component supply unit when the component supply device is equipped; and a height correction control section which corrects a lowering operation stroke amount of the mounting nozzle based on the height unique value of the equipped component supply device. Accordingly, an error in a height direction can be comprehensively absorbed and the component can be stably picked up by controlling a component pick-up operation of the mounting nozzle based on the height unique value.

A printed board working apparatus includes a transport device which transports a printed board in a horizontal direction, and a moving member which moves in a horizontal direction above the transport device. The printed board working apparatus includes a plurality of component attaching portions which are aligned in the installation direction and move together with the moving member. The printed board working apparatus also includes at least one working head which performs work on the printed board held by the transport device. The working head is attached to at least one component attaching portion out of the plurality of component attaching portions, and can change a position relative to the moving member in the installation direction. A region where the working head cannot perform work as the number of working heads increases is reduced.

In a rotary head type component mounter, among a specified quantity of suction nozzles held by a rotary head, multiple suction nozzles are lowered simultaneously. When the rotary head is moved by a head moving mechanism to a nozzle exchange area and exchange of suction nozzles is performed, two station reference marks of the nozzle station are imaged by a mark imaging camera, image recognition is performed of the positions of the two station reference marks, and the position and angle of the nozzle station is calculated. Then, the position and angle of the rotary head is corrected to be aligned with the position and angle of the nozzle station, multiple of the suction nozzles held on the rotary head are lowered simultaneously by Z-axis driving mechanisms and simultaneously exchanged with multiple of the suction nozzles in the nozzle station.

In a component mounter, a gap between adjacent circular plate sections of nozzles is large enough such that a pressing roller is able to pass through in a vertical direction. Therefore, the size of a circular plate section can be made relatively small, and a rotary head can be made small. A horizontal protrusion overlaps with one or both of adjacent ring-shaped protrusions of the nozzle when viewed from above in a case in which the pressing roller is positioned between adjacent circular plate sections of nozzles. In a state with the pressing roller positioned above the gap between adjacent circular plate sections of nozzles, even if power to a Z-axis linear actuator is cut such that the raising and lowering member suddenly loses support and falls, the horizontal protrusion of the raising and lowering member engages with and stops the ring-shaped protrusion of the nozzle.

A bulk component supply device which is moved together with a mounting head which mounts electronic circuit components on a circuit substrate and of a component mounter device equipped with that bulk component supply device is disclosed. A bulk component driving device of the bulk component supply device is non-detachably provided on head main body of the mounting head, and a passage-equipped component case in which a component case and a component passage are fixed is detachably attached to head main body by a passage-equipped component case attachment device. When the holding by passage-equipped component case attachment device is in a released state, the passage-equipped component case can be removed while the bulk component driving device is held as in on head main body, and exchanged with a different passage-equipped component case. This exchange can be performed automatically by a passage-equipped component case exchange unit.

A dispensing head is disclosed including a control system located in the dispensing head, an encoder read head located in the dispensing head, and a light-capture sensor located in the dispensing head configured to detect a light flash of a stationary camera when the light flash illuminates a component on the dispensing head or an element of the dispensing head. The control system is configured to determine a precise encoder position with the encoder read head at a moment of the light flash. The dispensing head is configured to at least partially assemble an unfinished product. An assembly machine having the dispensing head and a method of at least partially assembling an unfinished product with the dispensing head is further disclosed.

A revolving nozzle station and a revolving drive device that revolves the revolving nozzle station are housed inside a cassette case of a cassette-type nozzle exchanging unit. In an outer circumferential portion of the revolving nozzle station, multiple nozzles for exchange with a nozzle of component mounter are arranged radially along a revolution path, and the nozzles are held in a detachable manner. A nozzle exchange port is formed in a top end surface of cassette case, and nozzle exchange is performed between the revolving nozzle station and a mounting head of the component mounter through the nozzle exchange port. A shutter mechanism which opens and closes the nozzle exchange port is provided in the cassette case.

A transfer head for transferring micro elements includes a cavity with a plurality of vacuum paths; a suite having a plurality of suction nozzles and vacuum path components. The suction nozzles are connected to the vacuum path components respectively, and the vacuum path components are formed to connect to vacuum paths in the cavity respectively. The suction nozzles absorb or release the micro elements through vacuum pressure, which is transmitted by vacuum path components and vacuum paths of each path. When the suite is mounted in the cavity, the upper surface of the suite is arranged with optical switching components for controlling the switch of the vacuum path components and vacuum paths of each path so that the suction nozzles can absorb or release required micro element through vacuum pressure.