A non-contact power reception apparatus is provided, in which a power reception coil for a charging system and a loop antenna for an electronic settlement system are mounted on a battery pack and a cover case of a portable terminal such that the power reception coil is arranged in the center thereof and the loop antenna is disposed outside the power reception coil, so that a mode of receiving a wireless power signal and a mode of transmitting and receiving data are selectively performed, thereby preventing interference from harmonic components and enabling non-contact charging and electronic settlement using a single portable terminal. A jig for fabricating a core to be mounted to the non-contact power reception apparatus is provided.

A wire clamp includes a base and first and second jaws. The first jaw is pivotally mounted to a first upright portion of the base via a first pivot axle, and the second jaw is pivotally mounted to a second upright portion of the base via a second pivot axle. The first and second jaws crisscross each other at an overlap area, and are spring-biased to pivot relative to the base towards a closed position. Respective hook members of the first and second jaws define a mouth above the overlap area that is configured to receive a wire. A size of the mouth adjusts automatically to a size of the wire within the mouth as the first and second jaws pivot towards the closed position. The wire may be held within the mouth in an in-line orientation with a corresponding terminal to which the wire will be crimped.

A system for applying materials to components generally includes a tool operable for transferring a portion of a material from a supply of the material to a component. The tool may include a resilient material configured for tamping the portion of the material onto the component and imprinting the portion of the material for release and transfer from the supply.

Provided are a jig and a press-fitting device that are capable of suppressing buckling during the press-fitting process. The jig has a jig unit in which a plurality of metal plate-shaped bodies for installing a press-fit terminal onto a substrate are combined. The jig unit includes a movable guide member having a guide groove through which a terminal main body can pass; an insertion punch having a punch groove corresponding to the guide groove, and having a pressing section formed therein; and a rear surface plate body. The movable guide member and the rear surface plate body are attached so as to be vertically movable relative to the insertion punch and, while the press-fit section is being press-fitted into the substrate by the insertion punch, the movable guide member and the rear surface plate body move upward relative to the insertion punch after the lower sides thereof abut to the substrate.

A method for assembling and installing a wire bundle assembly group (WBAG) is disclosed. The method includes placing a first grouping of components of a first WBAG on a first assembly panel of a fabrication table. The method also includes assembling the first WBAG from the first grouping of components and attaching the first WBAG to the first assembly panel. The method also includes actuating a pivot of an assembly frame supporting the first assembly panel to rotate the first assembly panel about a longitudinal axis. The method further includes placing a WBAG receiving panel of a transport tool adjacent the first WBAG and the first assembly panel. The method also includes releasing the first WBAG from the first assembly panel and dropping the WBAG onto the WBAG receiving panel. Finally, the method includes attaching the first WBAG to the WBAG receiving panel.

Disclosed are exemplary embodiments of systems and methods of applying materials to components. The materials may be applied to a wide range of substrates and components, such as lids or integrated heat spreaders of integrated circuit (IC) packages, board level shields, heat sources (e.g., a central processing unit (CPU), etc.), heat removal/dissipation structures or components (e.g., a heat spreader, a heat sink, a heat pipe, a vapor chamber, a device exterior case or housing, etc.), etc.

Systems to manufacture an electronic circuit assembly are disclosed. In one embodiment, the system includes a flexible substrate with a substrate registration feature and a carrier with a carrier registration feature. A removable fastener removably fixes the flexible substrate to the carrier by being received into the substrate registration feature and the carrier registration feature. Once the flexible substrate is removably affixed to the carrier, the carrier provides the flexible substrate with rigidity to receive at least one electronic device of the electronic circuit assembly.

A system for assembling and installing a wire bundle assembly group (WBAG) may include a fabrication table having first and second assembly panels, each configured to receive a WBAG, and an assembly frame having an adjustable pivot connected to the first and to the second assembly panels to hold the assembly panels in a spaced orientation relative to each other, and to pivot about an axis; and a transport tool having a WBAG receiving panel configured to receive and support an assembled WBAG from the fabrication table, and a transport frame having an adjustable support connected to the WBAG receiving panel, and the transport frame is positionable adjacent the fabrication table such that the WBAG receiving panel is located beneath the first assembly panel and the second assembly panel, whereby an assembled WBAG drops downwardly onto the WBAG receiving panel.

A mask assembly fabrication apparatus includes a first vibration proof apparatus formed on a base surface, a first surface plate formed on the first vibration proof apparatus, stages formed on the first surface plate, a mask frame placed on the stages, a second vibration proof apparatus formed on the base surface to be separate from the first vibration proof apparatus, a second surface plate formed on the second vibration proof apparatus to be separate from the first surface plate, and a driving unit formed on the second surface plate and configured to move a mask.

A method for aligning a first article relative to a second article. The second article is provided with at least one flexible structure fixed to the second article at one point while the first article includes at least one surface relief marking. A detector measures the interaction between the flexible structure and surface relief marking and generates detector signals relative to that interaction to achieve alignment between the first and second articles.