Cards may be populated with components and alignment cues. A fully populated card may then be laminated using either of a clear (e.g., transparent) laminate or an obscure (e.g., opaque) laminate. Visual and/or non-visual alignment cues within a card may be utilized to align a trimming and/or singulation device to the card. The card may be singulated and/or trimmed with the aligned singulation and/or trimming device to position one or more components of the card.

An electronic component includes a package substrate, an electronic component element mounted on the package substrate and includes an element substrate, a support layer, and a cover member, and a mold resin layer provided on the package substrate so as to seal the electronic component element. The cover member includes a first cover member provided on the package substrate and a second cover member provided on the first cover member. The glass transition temperature of a resin material of the first cover member is higher than that of a resin material of the second cover member.

A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired.

A composite structure comprises stacked sets of laminated fiber reinforced resin plies and metal sheets. Edges of the resin plies and metal sheets are interleaved to form a composite-to-metal joint connecting the resin plies with the metal sheets.

An object of the present invention is to provide a process for laminating works together that are capable of giving laminates a high bonding strength ensured therein. The process for laminating works together laminates a work composed of a resin to a work composed of a resin or glass, the process including a surface activation step of treating a laminating surface of at least the work composed of a resin with vacuum ultraviolet ray or with atmospheric pressure plasma, and a bonding step of bonding together the two works stacked on each other such that a laminating surface of one of the works abuts a laminating surface of the other work, wherein in the surface activation step, the treatment of the laminating surfaces with vacuum ultraviolet ray or with atmospheric pressure plasma is terminated when an accumulated treatment quantity of the vacuum ultraviolet ray or the atmospheric pressure plasma applied to the laminating surfaces is within an initial drop range shown in a variation curve of a water contact angle on the laminating surfaces with respect to the accumulated treatment quantity.

A semiconductor structure bonding apparatus is disclosed. The apparatus may include a leveling adjustment system configured to provide leveling adjustment of upper and lower block assemblies of the apparatus. In some cases, the leveling adjustment system may include a plurality of threaded posts, differentially threaded adjustment collars, and leveling sleeves. In some instances, the leveling adjustment system further may include a plurality of preload springs configured to provide a given preload capacity and range of adjustment. In some instances, the leveling adjustment system further may include a load cell through which one of the threaded posts may be inserted. In some embodiments, the upper block assembly further may include a reaction plate configured to reduce deformation of the upper block assembly. In some embodiments, the upper block assembly further may include a thermal isolation plate configured to provide compliance deflection and being of monolithic or polylithic construction, as desired.

Embodiments of method of manufacturing an implantable pump, including providing an upper layer comprising a dome structure for housing a drug chamber and a cannula in fluid communication with the drug chamber, providing a middle deflection layer adjacent the drug chamber, providing a bottom layer comprising electrolysis electrodes, and bonding the upper layer, middle deflection layer, and bottom layer to form the pump.

Disclosed is waterproofing sheeting that uses a polyester layer that provides high lateral stability and puncture resistance. The waterproof sheeting can be used in many applications including waterproof roof underlayments, waterproof sheeting for foundations, underlayment for tile and flooring and various other applications. The waterproof sheeting can be manufactured without many of the problems associated with the granular coatings of existing waterproof sheeting that create excessive wear and environmental hazards.

A fiber placement system for manufacturing composite components includes at least one material storage enclosure including a material spool assembly, a swiveling roller assembly, and a redirect roller assembly, for each tow to be produced per course, at least one material feeding/cutting station configured with a nip roller drive system, and a cutting mechanism, at least one material transfer station configured with an individual, moveable guide tray for each tow to be produced per course, the moveable guide trays respectively being configured with a vacuum system, and at least one layup station comprising a vacuum table/layup surface, and a pick-and-place device equipped with an end-effector.

Composite tape is laminated onto a substrate using a gantry to move a tape laminating head along the length of the substrate. The laminating head is mounted for movement along a beam on the gantry that extends across the width of the substrate. The direction of lamination may be altered by changing the angular orientation of the beam.