Compositions for use in labels and receiving print thereon are described. The compositions anchor and retain the adhesive and enable labels or facestock using such compositions to be used in container reclamation and reuse programs.

The present invention provides a support for temporary bonding a workpiece such as a thick device wafer. The support comprises a carrier having a supporting surface and an isolation film. A first side of the isolation film is bonded to the supporting surface with a peeling strength of from 0.01 to 50.0 g/cm. The invention also provides a method of using the support to e.g. grind the workpiece in making thinned products such as thin silicon wafer, optical lens, thin LCD glass, and thin rock crystal wafer, among others.

The present invention relates to a method for transferring two-dimensional nanomaterials. The method comprises the following steps: S1, providing a first substrate and a two-dimensional nanomaterial layer on a surface of the first substrate; S2, covering the two-dimensional nanomaterial layer with a carbon nanotube film structure; S3, obtaining a composite structure comprising the two-dimensional nanomaterial layer and the carbon nanotube film structure by removing the first substrate with a corrosion solution; S4, cleaning the composite structure by placing the composite structure on a surface of a cleaning solution; S5, picking up the composite structure from the cleaning solution with a target substrate, by contacting the target substrate with the two-dimensional nanomaterial layer of the composite structure; and S6, removing the carbon nanotube film structure from the composite structure.

A facility 300 for separation of layers in a multilayer system 310. The facility 300 comprises one or more baths 320a, 320b for accepting the multilayer system 310 and a dispenser 330 for providing a separation fluid 340. The separation fluid 340 comprises a nanoscale dispersion for washing the multilayer system in the baths 320a, 320b and is described in more details below. The facility 300 also includes a filtration device 350 for filtering separated undissolved components of the multilayer system 310.

The present invention provides a method of promoting separation of polymer bonded to a substrate of different material, which collectively form at least part of a polymer composite structure, the method comprising: (1) contacting the polymer composite structure with a composition comprising organic solvent which is absorbed within one or both of the polymer and substrate, wherein the composition comprising organic solvent does not dissolve either the polymer or the substrate, and (2) contacting the polymer composite structure provided in step (1) with liquid (i) having a temperature higher than the boiling point of the composition comprising organic solvent used in step (1), and (ii) that does not dissolve either the polymer or the substrate, the action of which promotes separation between the polymer and the substrate.

A separating fluid, method and use for separating multilayer systems, especially photovoltaic modules, for the purpose of recycling, which allow the separation of multilayer systems. Especially photovoltaic modules, in comparatively simple manner in terms of the processes used, in as environmentally friendly a manner as possible, at high recycling rates. For this purpose, the separating fluid is a nanoscale dispersion or a precursor thereof.

A method of recovering structural members from a used absorbent article comprising a front sheet, a back sheet and an absorbent body between the front sheet and the back sheet, wherein at least one of the front sheet and the back sheet includes a film, and wherein the absorbent body includes an absorbent body material, may include swelling the used absorbent article with water, applying a physical shock to and disintegrating the swelled used absorbent article into at least the film and the absorbent body material, and separating the film and the absorbent body material.

The present disclosure provides a method for separation of an organic film from a solar cell module, the separation method including the following steps: treating the solar cell module by a heat treatment in combination with a ultrasonic treatment; and performing separation of the treated solar cell module by buoyancy, thereby achieving the separation of the organic film from the module. The present disclosure uses the heat treatment in combination with the ultrasonic treatment to separate the organic film of the solar cell module, so that a stripping rate of the solar cell module reaches 97% or more, and the organic film after detachment does not adhere to the active material, the active material layer remains intact, the surface is clean and has no gelatin spots, and a loss rate is 1% or less, and thus the method is efficient, convenient, and easy to industrialize.

A method for recycling of packaging material is disclosed. The packaging material comprises a multilayer material (10) comprising a metal layer (30) and at least one polymer layer (20, 40). The method comprises placing the packaging material in a vat (310) comprising a separation fluid (330) to produce a mixture of metal shreds from the metal layer (30), plastic shreds from the polymer layer (20, 40) and residual components. The separation fluid comprises a mixture comprising a mixture of water, a short-chained carboxylic acid, phosphoric acid and an alkali metal hydroxide solution.

Methods for separating a plurality of diamagnetic directed self-assembled diamagnetic components are provided. One method includes, for instance: contacting a release substrate to the plurality of diamagnetic components, the plurality of diamagnetic components including a non-diamagnetic component affixed to a diamagnetic portion by a first adhesive, and removing the release substrate, the non-diamagnetic component being affixed to a final substrate by a second adhesive and the release substrate being affixed to the diamagnetic portion by a third adhesive, and wherein the removing removes the diamagnetic portion and at least a portion of the first adhesive from the non-diamagnetic component.