A wedge-shaped jig (6) is inserted into a gap between a first substrate (21) and a second substrate (22) at a corner (221) of the second substrate (22) and separation of the attached first substrate (21) and second substrate (22) starts to proceed; then, a second suction pad (53) of a second suction portion (51), which is the closest to the corner (221), moves upward. Then, first suction pads (43) of first suction portions (41a), (41b), and (41c) sequentially move upward such that one side of the second substrate (22) separates from the stacked body. Although the second substrate (22) warps as the separation of the second substrate (22) proceeds, each of the plurality of first suction pads (43) elastically deforms. Therefore, the first suction pads (43) can be prevented from being detached from the second substrate (22), and the substrate (22) can be securely separated from the stacked body.

A peeling method is provided. In a first step, a resin layer is formed over a support substrate, openings are formed along two opposite sides of a periphery of the resin layer in a top view, an element layer is formed over the resin layer and positioned on an inner side than the openings in the top view, and the support substrate and a counter substrate are bonded to each other so that an adhesive layer is in contact with the support substrate in the openings, thereby forming a process member. In a second step, an entire surface of the process member is irradiated with light from the support substrate side. In a third step, a blade is inserted into an end portion of the process member from an interface between the support substrate and the resin layer or from the resin layer, and is made to pass through the openings.

A film peeling apparatus that peels off a film from a peeling object having the film and a substrate, the film peeling apparatus including a base; a conveying unit to hold a first side of the peeling object and to turn the peeling object from a parallel orientation with respect to the base to a perpendicular orientation with respect to the base; a first peeling unit to receive the peeling object from the conveying unit and to hold a second side of the peeling object in the perpendicular orientation; a second peeling unit to hold the first side of the peeling object, the second peeling unit facing the first peeling unit; and a knife unit that is reciprocably movable toward and away from an edge of the peeling object and movable along an edge of the peeling object.

An apparatus for separating a wafer from a carrier includes a platform having an upper surface, a tape feeding unit, a first robot arm, and a controller coupled to the platform. The controller is configured to mount a wafer frame, by using the tape feeding unit, on a wafer of a wafer assembly on the upper surface of the platform. The wafer assembly includes the wafer, a carrier, and a layer of wax between the wafer and the carrier. The controller is also configured to heat the upper surface of the platform to a predetermined temperature and separate, by the first robot arm, the wafer and the wafer frame mounted thereon from the carrier.

A substrate peeling apparatus includes a support member and absorption pads. The support member, having a quadrangular shape, includes first and second vertexes diagonally facing each other in a first direction, and third and fourth vertexes diagonally facing each other in a second direction crossing the first direction. The absorption pads is disposed on the support member. The absorption pads are arranged in rows in a direction parallel to the first direction and at least one absorption pad of each row is arranged in a direction parallel to the second direction. An absorption pad of each row includes a hole having an increasing internal diameter as a distance in the first direction between the each row and the first vertex increases. An internal diameter of an absorption pad in a row positioned halfway between the first and second vertexes has a maximum internal diameter.

A delamination method for delaminating a laminated substrate which includes a first and a second substrates bonded to each other, includes: adjusting a position of the laminated substrate at a holding unit by a position adjusting unit and disposing the holding unit at a predetermined height position; disposing a sharp member of a delamination inducing unit at a predetermined height position; detecting a contact of the sharp member by bringing the sharp member into contact with a side surface of one end portion of the laminated substrate; inserting the sharp member into the side surface of the one end portion of the laminated substrate; and delaminating the second substrate from the first substrate by a plurality of suction movement units which sucks the second substrate of the laminated substrate to move the second substrate away from the first substrate.

A thin ribbon spirally wound polymer conduit and method of forming, wherein a helical reinforcing bead is interposed adjacent overlapping layers of ribbon. Further, a method of continuously forming spirally wound conduit wherein a sacrificial layer, preferably having a different base polymer to that of the conduit, is first applied to the former before the conduit is formed overtop.

A processing apparatus includes a chuck table mechanism including a chuck table configured to hold the wafer and a table base configured to support the chuck table in a detachable manner. The chuck table includes a porous plate having a suction surface that sucks the wafer, a frame body surrounding surfaces of the porous plate other than the suction surface of the porous plate, a wafer suction hole formed in the frame body and configured to transmit a suction force to the suction surface of the porous plate, and a bolt hole formed in the frame body and configured to fix the frame body to the table base.

An apparatus for supporting a process of debonding a carrier glass sheet and an ultrathin glass sheet. A suction plate includes a plurality of suction hole portions defining suction holes for suction-holding a glass laminate seated thereon and at least one recess portion defining at least one recess accommodating at least one device layer protruding from one surface of an ultrathin glass sheet of the glass laminate. A plurality of suction cups are fitted to the plurality of suction hole portions, respectively, such that the plurality of suction cups are elastically compressible, in response to contact pressure of the ultrathin glass sheet and the device layer. A vacuum pump is connected to the plurality of suction hole portions to apply negative pressure to the plurality of suction hole portions. A controller controls the vacuum pump to adjust the negative pressure applied to the plurality of suction hole portions.

A transfer device is disposed in a vacuum transfer chamber. The transfer device includes a structure body having an inner space isolated from the vacuum transfer chamber, an arm that rotates with respect to the structure body, and a vacuum seal structure configured to airtightly seal a sliding portion between the structure body and the arm. Further, the vacuum seal structure includes one or more seal members disposed at the sliding portion; a sealing portion formed by the structure body, the arm, and the seal members, lubricant being sealed in the sealing portion; and a pressure adjusting unit configured to adjust a pressure in the sealing portion.