Disclosed is an apparatus for manufacturing a display module. An apparatus for manufacturing a display module according to an exemplary embodiment of the present invention, which attaches a polarizing plate, from which a release film is peeled, onto a display panel, includes: a separator configured to peel a release film from a polarizing plate, and formed with a flow path, through which foreign substances dropped from the release film when the release film is peeled are dischargeable; and a suction unit coupled to the separator to suck the foreign substances.

A system and method for separating a layer from a layer assembly when the layer assembly includes a backing layer and a material layer. The system includes an automated machine having a controller and an end effector. A separating tool is attached to the end effector of the automated machine. The separating tool includes a displacing member, with an outer face, configured to establish a void between the backing layer and the material layer by displacing a portion of the backing layer. The separating layer also includes a securing member configured to establish a mechanical connection with a displaced portion of the backing layer.

A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

A substrate separation system configured to remove a substrate from a carrier is provided. The substrate separation system includes a stage, an upper fixing portion, a suction portion, a cutting portion and a blowing portion. The stage is configured to carry the carrier. The upper fixing portion is disposed above the stage so as to be movable up and down. The suction portion is disposed above the stage so as to be movable up and down, and has a hollow portion to accommodate the upper fixing portion. The cutting portion is disposed on one side of the stage. The blowing portion is disposed on another side of the stage, and is configured to provide a blowing force to a position between the substrate and the carrier.

A reception device for moving components along a first axis, a second axis and a third axis and that is designed to rotate in a controlled manner relative to a deposit point, at least partly about the third axis containing the deposit point, by means of a rotary drive and/or to be propelled in a controlled manner by means of at least one linear drive at least partly along one of the first, second or third axes, and/or to propel, in a controlled manner, a carrier guided by the reception device, along one of the first and/or second axes.

The present disclosure relates to a technical field of solar cells, and more particularly to an independently-driven film separation mechanism. The separation mechanism includes a mounting platform. A plurality of first suction components for sucking the bottom surfaces of wafers respectively are provided on one side of the mounting platform. Each of the first suction components is corresponding to one of the wafers. The mounting platform is provided with a plurality of second suction components for sucking films respectively, each of the films is provided on a top surface of the corresponding wafer. The first suction components and the second suction components are provided in a one to one correspondence, and a suction direction of each of the plurality of first suction components and a suction direction of each of the plurality of second suction components are opposite.

The present application provides a separation apparatus for a flexible display panel, includes a support post, a power unit and a vacuum suction block; wherein the supporting post is used to support the separation apparatus on the relatively upper side of the rigid substrate to be separated; the vacuum suction block is in communication with the support post, and is used to suck and connect the rigid substrate to be separated; and one end of the power unit is connected to the support post, the other end is rotatably connected with the vacuum suction block, and is used for controlling the vacuum suction block and the rigid substrate to be separated together to be separated from the flexible display panel. The present application also provides a method for separating a flexible display panel.

An apparatus of separating a flexible panel from a glass substrate is provided. The apparatus of separating a flexible panel from a glass substrate includes a console, a movable object fixing table, a position catcher, a lifting platform, and a suction separator. The console respectively drives the movable object fixing table and the lifting platform to move to a first position and a second position according to a real-time position of a fixed object fixed on the movable object fixing table captured by the position catcher, and a adhesive element of the suction separator tightly attaches to the flexible panel of the fixed object fixed on the movable object fixing table, drives the lifting platform to move to a direction away from the movable object fixing table, and drives the movable object fixing table to move to a direction away from the suction separator to separate the flexible panel from the glass substrate of the fixed object and fix the flexible panel on the adhesive element. By practice of the disclosure, the flexible panel could be completely separated from the glass substrate, and the flexible panel and the glass substrate will not be damaged.

A semiconductor manufacturing apparatus includes: a sheet separation jig having contact with a rear surface of a sheet which is a surface of the sheet on a side opposite to a front surface of the sheet, wherein the sheet separation jig includes therein a plurality of support blocks each having a first suction hole formed for sucking the rear surface of the sheet and a single driving plate connected to the plurality of support blocks so that the plurality of support blocks can move in a first direction as a direction away from the sheet with a time difference, and the plurality of support blocks are disposed in the sheet separation jig along a second direction, as a direction of a separation of the semiconductor device from the sheet, intersecting the first direction.

A bonding apparatus includes a first holder, a second holder, an attracting pressure generator and a lift pin. The first holder is configured to hold a first substrate. The second holder, disposed at a position facing the first holder, has an attraction surface configured to attract a second substrate to be bonded to the first substrate. The attracting pressure generator is configured to generate an attracting pressure in the attraction surface. The lift pin is configured to space the second substrate on the attraction surface apart from the second holder. The second holder is provided with a space including an opening through which the lift pin passes, and the space is controlled to have a pressure lower than an atmospheric pressure.