A laser-based coating removal method debonds a film from a substrate rather than ablating the film. A laser light is transmitted through a transparent film to an underlying bonding layer for bonding the film to one or more additional films and/or a substrate. The laser light is absorbed at the bonding layer and the transparent film is released. In some embodiments, after the transparent film is released it is able to be physically removed.

[Object] An object of the present invention is to provide an easily peelable adhesive tape that has a good peel adhesive strength when attached to an adherend and that can be easily peeled after being irradiated with active energy rays.

[Solution] The present invention is directed to an easily peelable adhesive tape that has, on at least one surface of a base material, an active energy ray-curable layer having a storage modulus (G.sub.a25) of less than 1.010.sup.6 Pa as measured at a temperature of 25 C. and a frequency of 1.0 Hz and has an adhesive layer on the surface side of the active energy ray-curable layer.

A supporting member separation method of separating a laminate formed by laminating a substrate, an adhesive layer, a release layer which is changed in quality by absorbing light, and a support plate in this order, the method including an irradiation step in which irradiation of laser light which is pulse-oscillated with a pulse having a pulse width of 20 ns or greater is performed to the release layer.

A system and method for manufacturing a strip or label used to place a substantially invisible identifying mark is disclosed. A strip is treated by removing at least one area of a liner element, a film layer and an adhesive layer. Each one of the removed areas is substantially congruent with the other removed areas. A laser or other ablating device is used to remove the areas through vaporization. The strip element is peeled away from the liner element, exposing the adhesive layer. The adhesive layer is thereafter pressed against a substantially flat metal surface. The laminate top coat and the film layer are removed from the object, leaving the adhesive layer in place. The adhesive material is impregnated with a UV sensitive material, but is otherwise invisible.

A method is provided for decomposition of a polymeric article, wherein the polymeric article contains a polymer and one or more energy modulation agents, by applying an applied energy to the polymeric article, wherein the one or more energy modulation agents convert the applied energy into an emitted energy sufficient to cause bond destruction within the polymer.

In various embodiments, an assembly for handling a semiconductor die is provided. The assembly may include a carrier with a surface. The assembly may also include an adhesive tape fixed to the surface of the carrier. The adhesive tape may be configured to adhere to the semiconductor die. The adhesive tape may include adhesive, the adhesion of which can be reduced by means of electromagnetic waves. The assembly may further include an electromagnetic source configured to apply electromagnetic waves to the adhesive tape to reduce adhesion of the adhesive tape to the semiconductor die. The assembly may additionally include a die pick-up component configured to pick up the semiconductor die from the adhesive tape.

A laser-based coating removal method debonds a film from a substrate rather than ablating the film. A laser light is transmitted through a transparent film to an underlying bonding layer for bonding the film to one or more additional films and/or a substrate. The laser light is absorbed at the bonding layer and the transparent film is released. In some embodiments, after the transparent film is released it is able to be physically removed.

A label winding device is for receiving a medium including a label liner and a label member that is removably attached to the label liner and has at least one label portion and a waste portion, separating the waste portion from the label liner at a waste separation portion, and winding the at least one label portion with the label liner. The label winding device includes: a waste winder for winding the separated waste portion; a label winder for winding the at least one label portion with the label liner without the separated waste portion; a waste guide for guiding the separated waste portion to the waste winder; a support for rotatably supporting the waste guide; a sensor for detecting a rotational speed of the waste guide; and a waste break detector for detecting break of the waste portion on a basis of the detection by the sensor.

In an embodiment a method includes providing a growth substrate with a plurality of semiconductor bodies for the semiconductor devices, wherein each semiconductor body comprises electrical contact structures and a separation layer arranged towards the growth substrate, arranging a rigid first auxiliary carrier on a side of the semiconductor bodies facing away from the growth substrate, wherein the first auxiliary carrier comprises a first detachment layer, detaching the growth substrate by laser radiation, wherein the laser radiation is absorbed in the separation layer, arranging a rigid second auxiliary carrier on a side of the semiconductor bodies facing away from the first auxiliary carrier, wherein the second auxiliary carrier comprise a second detachment layer, detaching the first auxiliary carrier by laser radiation, wherein the laser radiation is absorbed in the first detachment layer and the separation layer still extending continuously over the growth substrate while detaching and mechanically and electrically arranging the semiconductor bodies on at least one permanent carrier.

A method of preparing a laminate, in which the laminate has a substrate and a support plate, and is provided with a release layer capable of being altered by irradiation with infrared ray, the method including forming the release layer on only a periphery of one of the substrate and the support plate; and laminating the substrate and the support plate through the release layer and a first adhesive layer.