A surface cleaning apparatus, which in one embodiment is a hand held vacuum cleaner, comprises a cyclone and a suction motor wherein the cyclone air outlet and the suction motor inlet are positioned towards the same end of the surface cleaning apparatus whereby air exiting the cyclone travels laterally and then axially to the suction motor inlet. A surface cleaning apparatus comprises a cyclone and a suction motor wherein the suction motor is positioned rearward of the cyclone and the cyclone air outlet is positioned at a lower end of the cyclone whereby air exiting the cyclone travels laterally and then axially towards the suction motor inlet.

A wafer de-bonding device comprises a stage (1) for holding a device wafer and a carrier wafer bonded together, and a tool (2) with a gas outlet (2.2) disposed in proximity to the stage (1) through an adjustment device for control the tool (2) to move towards or away from the stage (1), the tool (2) being provided with a bit (2.1) to cut a notch into a film or an adhesive layer at a junction of the bonded wafers, the gas outlet (2.2) being provided on the tool bit (2.1), the tool (2) being further provided with a gas inlet (2.3) in communication with the gas outlet (2.2), the gas inlet (2.3) being connected to a gas jet generator so as to direct a gas jet towards the junction of the bonded wafers on the stage (2). The wafer de-bonding device has a high degree of automation and simple operations.

A micro-LED manufacturing device includes: a wafer stage on which a wafer is positioned; a substrate stage on which a substrate is positioned; a lower base formed below the substrate stage; a first driving member formed on the substrate stage so as to move the wafer stage; and a second driving member formed on the lower base SO as to move the substrate stage. The micro-LED manufacturing device is formed such that the wafer stage moves over the substrate stage, and thus the substrate stage and the wafer stage can move synchronously with respect to the lower base.

A method for fabricating a display device is provided. A laser having a power density is provided to a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The second substrate is separated from the first substrate. An optical property of the first substrate separated from the second substrate is measured. The power density of the laser is adjusted based on the optical property of the first substrate.

An apparatus for removing a ring-shaped reinforcement, edge from a ground semiconductor wafer, which is cohesively connected to an elastic carrier film and is fixed to a circumferential wafer frame via the carrier film, includes a holding device, which has a support having suction openings for holding the semiconductor wafer on the support surface of the support, and a separating device, which includes a device for integrally detaching the reinforcement edge from the carrier film. In order to be able to detach the reinforcement edge from the carrier film without damage, the holder device has a clamping device encompassing the support and serving for clamping the wafer frame and/or the carrier film, wherein the clamping device interacts with the support to stretch the carrier film, and the separating device has a tool guide with a dividing tool for moving the dividing tool between carrier film and reinforcement edge in order to detach the reinforcement edge in one piece from the carrier film stretched by interaction of clamping device and support.

Methods of processing a glass substrate comprise the step of obtaining a glass substrate and a tab removably attached to a portion of the glass substrate. The position of the glass substrate is manipulated with the engagement portion and the tab is removed from the portion of the glass substrate by releasing a mounting portion of the tab from the portion of the glass substrate without damaging the glass substrate. In further examples, methods include the steps of removably attaching first and second tabs to respective first and second surfaces of a glass substrate and coiling the glass substrate on a storage roll wherein the first tab adheres to the second tab. In further examples, a glass apparatus comprises a glass substrate and a removable tab including a mounting portion attached to a portion of the glass substrate with a first peel force of less than about 10 N/cm.

Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

Provided are an initiator and a method for debonding a wafer supporting system. The initiator for debonding a wafer supporting system includes a rotation chuck having an upper surface on which a wafer supporting system (WSS), which includes a carrier wafer, a device wafer, and a glue layer for bonding the carrier wafer and the device wafer to each other, is seated to rotate the wafer supporting system, a detecting module detecting a height and a thickness of the glue layer and a laser module generating a fracture portion on the glue layer through irradiating a side surface of the glue layer with a laser on the basis of the height and the thickness of the glue layer.

Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an on-demand de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.

The present invention provides a substrate collecting device that includes a first stage on which a sheet is placed with a plurality of substrates facing downward, an sampler which carries out a predetermined operation on some of the substrates, which are disposed at predetermined positions, from above the first stage thereby to cause the substrates to come off from the sheet and fall, an optical system and a collector disposed below the first stage, and a second stage, which integrally moves the optical system and the collector in a horizontal direction. The second stage is capable of positioning the optical system and the collector at two positions at which the optical system or the collector is disposed substantially vertically below a predetermined position.