Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

A method for fabricating a display device is provided. A laser having a power density is provided to a substrate coupling body. The substrate coupling body includes a first substrate and a second substrate coupled to the first substrate. The second substrate is separated from the first substrate. An optical property of the first substrate separated from the second substrate is measured. The power density of the laser is adjusted based on the optical property of the first substrate.

Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation

Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.

A separation device for a backlight source is provided. The separation device includes a machine table, at least one separation platform, where each separation platform is located above the machine table and secured at a fixed position relative to the machine table and is configured to support a display module and secure a backlight source of the display module thereon; a plurality of guide columns arranged perpendicular to the machine table, at least one adsorption mechanism arranged in a one-to-one correspondence with the at least one separation platform, where each adsorption mechanism is arranged at a side of the corresponding separation platform away from the machine table and configured to adsorb a display screen of the display module on the corresponding separation platform, and a driving unit configured to drive each adsorption mechanism to move in the lengthwise direction of the plurality of guide columns.

A flexible display comprises a flexible substrate made of plastic material, a display element on a first surface of the flexible substrate, and a surface residual film containing at least one of a metal material or a metal oxide material. The surface residual film is bonded to at least a part of a second surface of the flexible substrate. The second surface is opposed to the first surface. A method for manufacturing a flexible display comprises preparing a glass substrate, forming adhesive material film on the glass substrate, the adhesive material film being made of at least one of a metal material or a metal oxide material, and forming a flexible substrate from plastic material on the adhesive material film.

A supporting member separation method for separating a laminate which is formed by laminating a substrate and a support plate through an adhesive layer and in which a release layer is provided on at least a part of the peripheral portion on the surface of the side of the substrate facing the support plate or the peripheral portion on the surface of the side of the support plate facing the substrate, the method including reducing the adhesive force of at least a part of the release layer which is provided on the peripheral portion of the substrate or the support, and fixing a part in the substrate and the support plate and separating the support plate from the substrate by applying a force to another part, after the preliminary treatment.

Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.

The present invention is a method for peeling an adherend from a pressure-sensitive adhesive layer by irradiating a laminate in which the pressure-sensitive adhesive layer and the adherend are laminated with light, the peeling method includes a step of irradiating the pressure-sensitive adhesive layer with the light having a pulse width of 1 second or less and a light irradiation amount of 1,000 mJ/cm.sup.2 or more, and the pressure-sensitive adhesive layer satisfies predetermined conditions in terms of a minimum transmittance in a near-infrared region of a wavelength of 800 nm to 2,500 nm and a maximum transmittance in a visible light region of a wavelength of 380 nm to 780 nm.

A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.