A system for laser ashing of polyimide for a semiconductor manufacturing process is provided. The system includes: a semiconductor chip, a top chip attached to the semiconductor chip by a connection layer, a supporting material, a polyimide glue layer disposed between the supporting material and semiconductor chip, a plasma asher, and an ashing laser configured to ash the polyimide glue on the semiconductor chip.

A method includes positioning a discrete component assembly on a support fixture of a component transfer system, the discrete component assembly including a dynamic release tape including a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.

Methods and tools for de-bonding and cleaning substrates are disclosed. A method includes de-bonding a surface of a first substrate from a second substrate, and after de-bonding, cleaning the surface of the first substrate. The cleaning comprises physically contacting a cleaning mechanism to the surface of the first substrate. A tool includes a de-bonding module and a cleaning module. The de-bonding module comprises a first chuck, a radiation source configured to emit radiation toward the first chuck, and a first robot arm having a vacuum system. The vacuum system is configured to secure and remove a substrate from the first chuck. The cleaning module comprises a second chuck, a spray nozzle configured to spray a fluid toward the second chuck, and a second robot arm having a cleaning device configured to physically contact the cleaning device to a substrate on the second chuck.

Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.

Cured flexible sealant may be removed from a substrate if the cured flexible sealant includes within its volume a susceptor such as metal susceptor particles. Removal proceeds by exposing the sealant with the susceptor to radio-frequency radiation sufficient to cause dielectric heating in the susceptor. The consequent heating in the cured sealant reduces the bond strength of the cured sealant. The reduced bond-strength sealant may be removed by physical methods, such as scraping etc., much more easily than the original (unexposed) cured sealant. Also disclosed are sealant compositions with susceptor, susceptor tools to introduce susceptor into cured sealant, and handheld radio-frequency heaters to apply radio-frequency radiation to cured sealant.

An evaporation device includes a carrier stage, a base and a light source. The carrier stage is placed on the base; the base provides with a vacuum pin; the vacuum pin can move with respect to the base; the carrier stage provides with a pin hole; the vacuum pin can pass through the pin hole to absorb a substrate. A side of the carrier stage away from the base is coated with a photosensitive adhesive, the light source is used to irradiate the photosensitive adhesive between carrier stage and the substrate in order to decrease the adhesiveness of the photosensitive adhesive so that the substrate and the carrier stage can be separated smoothly in order to achieve a small deformation and improve the product yield rate. The evaporation method can achieve a small deformation and improve the product yield rate when separating the substrate and the spacing pad.

An evaporation device includes a carrier stage, a base and a light source. The carrier stage is placed on the base; the base provides with a vacuum pin; the vacuum pin can move with respect to the base; the carrier stage provides with a pin hole; the vacuum pin can pass through the pin hole to absorb a substrate. A side of the carrier stage away from the base is coated with a photosensitive adhesive, the light source is used to irradiate the photosensitive adhesive between carrier stage and the substrate in order to decrease the adhesiveness of the photosensitive adhesive so that the substrate and the carrier stage can be separated smoothly in order to achieve a small deformation and improve the product yield rate. The evaporation method can achieve a small deformation and improve the product yield rate when separating the substrate and the spacing pad.

The present invention relates to a process for detaching a component from an electronic assembly. In particular, the present invention relates to a process for detaching a component bonded with a liquid optically clear adhesive (LOCA) in a display module by using electromagnetic radiation (EMR).

A first substrate, bonded to a second substrate by a material, is provided. The first substrate is transparent to at least some wavelengths of electromagnetic radiation. The first substrate is irradiated with the electromagnetic radiation to which the first substrate is transparent, such that the electromagnetic radiation impinges on the material causing a decomposition thereof at a location at an interface between the first substrate and the material. The decomposition results in, at the location, an interface of the first substrate and an atmosphere of the decomposition. The atmosphere of the decomposition has an optical property resulting in ceasing the decomposition of the material.

Laser lift off systems and methods overlap irradiation zones to provide multiple pulses of laser irradiation per location at the interface between layers of material to be separated. To overlap irradiation zones, the laser lift off systems and methods provide stepwise relative movement between a pulsed laser beam and a workpiece. The laser irradiation may be provided by a non-homogeneous laser beam with a smooth spatial distribution of energy across the beam profile. The pulses of laser irradiation from the non-homogenous beam may irradiate the overlapping irradiation zones such that each of the locations at the interface is exposed to different portions of the non-homogeneous beam for each of the multiple pulses of the laser irradiation, thereby resulting in self-homogenization. Thus, the number of the multiple pulses of laser irradiation per location is generally sufficient to provide the self-homogenization and to separate the layers of material.