A system for applying labels to cable or conduit including at least one label and a label applicator. The label applicator including at least one guide roller, at least one tamping device comprising at least one tamping pad for applying at least one label onto the moving cable or conduit, and a guide shoe assembly. The guide shoe assembly comprises a guide shoe, the guide shoe comprises a rounding member, a plurality of springs for providing flexibility to the rounding member when the moving cable or conduit passes the at least one guide shoe, a support mount for supporting the at least one guide shoe, a plurality of pivots disposed between the rounding member and the rounding member support for adjusting the set of springs, and a fitted member for providing an anchor for the at least one guide shoe to connect with the support mount.

The invention relates to labeling and/or printing devices, methods and systems for applying coding and/or labeling to containers that are stacked or otherwise organized in a group (e.g., containers stacked on a pallet). In embodiments of the invention, labeling and/or printing devices are mounted on carriages that are capable of moving in a vertical direction to apply labels as they move. Horizontal movement is imparted either by moving such carriages in a horizontal direction adjacent to the containers, or by moving the containers themselves (or the pallet holding them) in a horizontal direction adjacent to such carriages. Multiple carriages with labeling devices may be provided to provide simultaneous labeling to more than one side of a group of stacked containers. Embodiments of the invention are capable of providing labeling of containers that are uniformly or non-uniformly grouped or stacked.

An apparatus for bonding semiconductor chips may comprise transfer rails configured to transfer substrates, loading members configured to load the substrates onto the transfer rails, unloading members configured to unload the substrates from the transfer rails, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates. An apparatus for bonding semiconductor chips may comprise a transfer rail configured to transfer substrates, loading members configured to load the substrates onto the transfer rail, unloading members configured to unload the substrates from the transfer rail, a buffer member at a side of the transfer rail configured to temporarily receive the substrates loaded by the loading members, a first wafer supply unit configured to supply a first wafer including semiconductor chips, and/or a bonding unit configured to bond the semiconductor chips to the substrates.

An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.

A method for attaching a fingerprint module which includes providing an adhesive tape which includes a base film, a protective film which is oppositely arranged to the base film, and a number of adhesive layers positioned between the base film and the protective film and are arranged at intervals, and each of the base film and the protective film is an integral piece of film which is continuous in an entire layer. The method further includes partially peeling off the protective film to expose a first adhesive surface of one of the plurality of adhesive layers; attaching the fingerprint module to the exposed first adhesive surface of the adhesive layer; and peeling off the attached fingerprint module and adhesive layer together from the base film to expose a second adhesive surface of the adhesive layer.

A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

The machine (1) for welding profiled elements comprises: a base frame (2); two retaining members (3, 4) of respective profiled elements (5) made at least partly of plastic and an area to be welded (6), the retaining members (3, 4) being mounted on the base frame (2) and defining a first retaining axis (A) and a second retaining axis (B) forming an angle of welding (7), and along which the profiled elements (5) can be fastened; removal means (8) of material from the profiled elements (5) to make a machining on the area to be welded (6) of the profiled elements (5); heat sealing means (9) mounted on the base frame (2) and adapted to weld the areas to be welded (6) of the profiled elements (5); adjusting means (10) of the angle of welding (7) adapted to move at least one of the retaining members (3, 4) to incline at least one of the first retaining axis (A) and the second retaining axis (B) to change the angle of welding (7); sliding means (11) of the retaining members (3, 4), mounted on the base frame (2) and adapted to move the retaining members (3, 4) in mutual approach or moving away without changing the angle of welding (7).

Apparatus and methods for fulfillment of patient prescription orders by adapting a standard or stock container pre-filled with medication or the like for use as a patient-specific container through precise application of patient-specific information to the pre-filled container. Precise placement of the patient-specific information to the pre-filled container enables pharmacy management to fully utilize valuable information provided with the pre-filled container, thereby improving the quality of service to the patient while making the process of prescription order fulfillment more efficient. In general, preferred embodiments comprise control apparatus and information-application apparatus. In embodiments, the information-application apparatus is adapted to place a patient-specific label on the container. Preferred forms of the information-application apparatus include a label printer and a positioner. The preferred printer applies patient-specific information on a label. The preferred positioner orients the pre-filled container to receive the label from the printer such that information provided with the container is available for use.

Self-guiding cutting tool (100) for cutting an adhesive film (20) applied to the roof panel (30) of a car, wherein the roof panel is connected to a side panel (31) of the car by a joint area (32) containing a welding ditch channel, said cutting tool (100) comprising a cutting device (6), at least one guiding means (2) guiding the cutting device (6) over the welding ditch channel of the joint area (32), and at least one transporting means (3) allowing the cutting device (6) to be moved over the welding ditch channel of the joint area (32). Also provided is a method of applying adhesive films to the roof panels of a car using the cutting tool.

Disclosed herein are a screen protector assembly, a screen protector applying assembly and a screen protector applicator. The screen protector assembly comprises a screen protector layer, a retention layer and a first matching member. The retention layer is bonded to the screen protector layer. The first matching member is fixedly connected to the retention layer, and the first matching member is used to be detachably connected to a protector applying assembly. With the above arrangement, a detachable connection between the retention layer of the screen protector assembly and the protector applying assembly is realized, allowing the retention layer to be detached from the protector applying assembly after a protector is applied to a screen, thereby allowing the protector applying assembly to be reused, and saving costs.