A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.

Apparatus and methods for impinging a heated fluid onto the surface of a substrate and then locally removing the impinged fluid. The apparatus and methods may be used to heat a surface of a substrate e.g. so that the substrate can be melt-bonded to another substrate.

An automated method and system for a conveyor holding system for holding vials of a multi-vial order in a holding pattern until all vials of the order have been filled by an automatic pill counter. The system uses RFID information to divert vials off the conveyor into the conveyor holding loop if all vials of the multi-vial order have not been filled. The system is adapted to divert the vials of the multi-vial order out of the holding loop when all vials of the multi-vial order have been filled.

Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

A method of manufacturing a display device includes mounting a cover window including a curved portion on a first jig including a curved portion, mounting a panel member on a second jig that conforms to a surface of the first jig, and laminating the cover window to the panel member by moving a first one of the first jig or the second jig to a first other one of the first jig or the second jig. An apparatus for manufacturing a display device includes a first jig including a mount surface that is partially curved to conform to a surface of a cover window, a second jig including a surface conforming to the mount surface and configured to contact a panel member, and a driving unit.

A method for providing a laminate film with adhesive as a step in the preparatory process for manufacturing a laminate mold part using a support part, a method for applying a hot melt to a laminate film, a method for manufacturing a laminate mold part, using a method, a system for laminating a support part as well as a method for such a system produces especially high quality lamination and even if the support part, where the laminate film should be laminated, is not porous by applying the adhesive to the support part for bonding the macroscopically structured laminate film, so that there is a duct system. The air can flow through the duct system between the laminate film and the support part during the lamination process.

An apparatus and method for labelling packs including an advancement device for transporting a pack in a transporting direction, a dispensing device for dispensing a label into a dispensing position, and an application device for applying the dispensed label to the pack. A punch including a punch shank and punch foot moves the dispensed label from a receiving position, where the punch foot receives the label, to a discharging position, where the label is applied to the pack by the punch foot. The punch shank is pivotally mounted about a first pivot axis transverse to the transporting direction, and is movable axially in a guide element. The punch shank is connected to a lifting element of a lifting device via an articulation. The lifting element is movable parallel to a direction angled relative to the transporting direction. A first drive with a motor drives the lifting element.

A process for preparing a membrane stack comprising the steps of: (i) interposing a curable adhesive between alternate anion exchange membranes and cation exchange; and (ii) curing the adhesive; CHARACTERIZED IN THAT said adhesive, when cured, has a Shore A hardness of less than 70 and an elongation at break of at least 50%.

Apparatus and methods for fulfillment of patient prescription orders by adapting a standard or stock container pre-filled with medication or the like for use as a patient-specific container through precise application of patient-specific information to the pre-filled container. Precise placement of the patient-specific information to the pre-filled container enables pharmacy management to fully utilize valuable information provided with the pre-filled container, thereby improving the quality of service to the patient while making the process of prescription order fulfillment more efficient. In general, preferred embodiments comprise control apparatus and information-application apparatus. In embodiments, the information-application apparatus is adapted to place a patient-specific label on the container. Preferred forms of the information-application apparatus include a label printer and a positioner. The preferred printer applies patient-specific information on a label. The preferred positioner orients the pre-filled container to receive the label from the printer such that information provided with the container is available for use.

A post-moulding station is described which is used in the manufacturing of a wind turbine blade. A blade shell forming part of a wind turbine blade is initially moulded in a blade mould, the blade shell subsequently transferred to a post-moulding station which allows for various post-moulding operations to be carried out on the blade shell away from the mould, thereby increasing the productivity of the blade mould in the manufacturing process. The post-moulding station may be operable to perform the closing of first and second blade shells to form a wind turbine blade, and may be formed from an adjustable structure which can provide relatively easy access to the contained blade shell for working thereon. Accordingly, the manufacturing equipment may be of reduced cost, combined with an increase in the overall productivity of the manufacturing system.