Soft-imprint alignment processes for patterning liquid crystal polymer layers via contact with a reusable alignment template are described herein. An example soft-imprint alignment process includes contacting a liquid crystal polymer layer with a reusable alignment template that has a desired surface alignment pattern such that the liquid crystal molecules of the liquid crystal polymer are aligned to the surface alignment pattern via chemical, steric, or other intermolecular interaction. The patterned liquid crystal polymer layer may then be polymerized and separated from the reusable alignment template. The process can be repeated many times. The reusable alignment template may include a photo-alignment layer that does not comprise surface relief structures that correspond to the surface alignment pattern and a release layer above this photo-alignment layer. A reusable alignment template and methods of fabricating the same are also disclosed.

A pick-up device 10 for picking up a semiconductor chip 100 attached to a front surface of a sheet material 110 is provided with: a stage 12 that includes a material a part or the entirety of which is capable of transmitting a destaticizing electromagnetic wave having an ionization effect and that attracts and holds a rear surface of the sheet material 110; a jacking-up pin 26 for jacking up the semiconductor chip 100 from the rear side of the stage 12; and a destaticizing mechanism 20 that destaticizes charge generated between the semiconductor chip 100 and the sheet material 110 by irradiating the rear surface of the semiconductor chip 100 with the destaticizing electromagnetic wave that is made to pass through the sheet material 110 from the rear side of the stage 12.

The present invention pertains to a method for producing and recycling an object consisting of a panel durably provided with a surface covering, comprising bringing the panel and the surface covering in a spatially aligned relationship, providing a layer of hot melt adhesive between the panel and the surface covering, heating the hot melt adhesive to a temperature above its melting temperature, pressing the surface covering against the panel with the molten hot melt adhesive in between the panel and surface covering, cooling down the hot melt adhesive to a temperature below its melting temperature to form the object, and after an end-of-life of the object, heating the hot melt adhesive to a temperature above its melting temperature, and separating the panel from the surface covering. The invention also pertains to a method of producing such an object and a panel for use in this method.

A method for separating different types of material layers of a composite component that has at least one material layer that is transparent for visible light and at least one further material layer, is provided, wherein the light from an external source falls through the at least one transparent material layer into the at least one further material layer and there is at least partially absorbed. With the help of at least one gas discharge lamp, the light-absorbing material layer is heated in less than one second to separate material layers of the composite component. A device that can be used for this method comprises at least one separation chamber and therein at least one gas discharge lamp suitable for irradiation.

Soft-imprint alignment processes for patterning liquid crystal polymer layers via contact with a reusable alignment template are described herein. An example soft-imprint alignment process includes contacting a liquid crystal polymer layer with a reusable alignment template that has a desired surface alignment pattern such that the liquid crystal molecules of the liquid crystal polymer are aligned to the surface alignment pattern via chemical, steric, or other intermolecular interaction. The patterned liquid crystal polymer layer may then be polymerized and separated from the reusable alignment template. The process can be repeated many times. The reusable alignment template may include a photo-alignment layer that does not comprise surface relief structures that correspond to the surface alignment pattern and a release layer above this photo-alignment layer. A reusable alignment template and methods of fabricating the same are also disclosed.

Various implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; forming an organic material over the first side of the semiconductor substrate and the plurality of notches; thinning a second side of the semiconductor substrate opposite the first side one of to or into the plurality of notches; stress relief etching the second side of the semiconductor substrate; applying a backmetal over the second side of the semiconductor substrate; removing one or more portions of the backmetal through jet ablating the second side of the semiconductor substrate; and singulating the semiconductor substrate through the permanent coating material into a plurality of semiconductor packages.

In a method of manufacturing an element array, prepared is an adhesive sheet in which elements are arranged in a predetermined array on an adhesive layer. A specific element among the arrayed elements is removed from the adhesive sheet by radiating a laser to the specific element. The arrayed elements are directly or indirectly transferred onto a mounting substrate.

An apparatus for manufacturing an element array includes a substrate hold means, a laser radiation device, and a collection mechanism. The substrate hold means holds a substrate including an adhesive layer on which elements are attached in a predetermined array while a surface of the adhesive layer is inclined relative to a horizontal surface at a predetermined angle. The laser radiation device radiates a laser to a specific element among the elements attached on the adhesive layer. The collection mechanism is disposed below the substrate and configured to receive the specific element falling by the laser radiation.

Provided is a method for manufacturing an EL device, the method including peeling a mother substrate from a layered body including a light-emitting element layer with irradiation with a laser. The mother substrate and the layered body are in contact with each other with a resin layer of the layered body interposed therebetween, and in a case that the peeling is performed by irradiating the resin layer with the laser, the irradiation is performed on at least a part of an end portion of the resin layer under a condition different from that in a central portion of the resin layer.

After an intermediate region and a flexible substrate region of a plastic film of a multilayer stack are divided, the interface between the flexible substrate region and a glass base is irradiated with laser light. The multilayer stack is separated into the first portion and the second portion while the multilayer stack is kept in contact with the stage. The first portion includes a plurality of OLED devices in contact with the stage. The OLED devices include a plurality of functional layer regions and the flexible substrate region. The second portion includes the glass base and the intermediate region. The step of irradiating with the laser light includes forming the laser light from a plurality of arranged laser light sources and temporally and spatially modulating a power of the plurality of laser light sources according to a shape of the flexible substrate region of the synthetic resin film.