An apparatus for manufacturing a display device and a method for manufacturing a display device includes a stage; a first guide unit positioned on one side of the stage in a first direction and extending in a second direction crossing the first direction; and a first peeling unit disposed on the first guide unit, wherein the first peeling unit includes a first moving part configured to move along the first guide unit, a first rotating part coupled to the other side of the first moving part in the first direction and configured to rotate about an axis extending in the first direction, and a first gripping part coupled to the other side of the first rotating part in the first direction and disposed to overlap the stage.

A combination printer and cutting device for printing upon and cutting a web of media or tag stock into individual units. The device may cut vinyl, plastic, or RFID stock material as it moves through the printer in both back and forth directions. The device comprises a printer and a cutting apparatus that is further comprised of a carriage assembly and a movable cutter assembly. The cutter assembly is easily interchangeable and comprises a cutting element such as a wheel blade, and a pressure adjusting element for adjusting the amount of pressure applied by the cutting element to the stock material. Alternatively, the cutter assembly may be manufactured with a predetermined pressure load, but still permit an operator to adjust the depth of cut. The cutting apparatus is adaptable for use with both new and existing printers.

A unit for automatically removing labels from a pharmacy container operates by heating the labels to soften the pressure sensitive adhesive thereon. After the adhesive is softened, the containers are rotated and brought into contact with a scrapper which peels off the label. The removed label falls into a container or directly into a shredding mechanism that is integral with the label remover. One embodiment of the device uses a chilled mandril inserted into the container to keep the container from softening when heat is applied to facilitate label removal.

A method for manufacturing a display device includes a stage; a first guide unit positioned on one side of the stage in a first direction and extending in a second direction crossing the first direction; and a first peeling unit disposed on the first guide unit, wherein the first peeling unit includes a first moving part configured to move along the first guide unit, a first rotating part coupled to the other side of the first moving part in the first direction and configured to rotate about an axis extending in the first direction, and a first gripping part coupled to the other side of the first rotating part in the first direction and disposed to overlap the stage.

Provided is a method for producing a GaN layered substrate, comprising the steps of: subjecting a C-plane sapphire substrate 11 having an off-angle of 0.5? to 5? to a high-temperature nitriding treatment at 800? C. to 1,000? C. to carry out a surface treatment of the C-plane sapphire substrate; carrying out epitaxial growth of GaN on the surface of the surface-treated C-plane sapphire substrate 11 to produce a GaN film carrier having a surface of an N polar face; forming an ion implantation region 13.sub.ion by carrying out ion implantation on the GaN film 13; laminating and joining a support substrate 12 with the GaN film-side surface of the ion-implanted GaN film carrier; and separating at the ion-implanted region 13.sub.ion in the GaN film 13 to transfer a GaN thin film 13a onto the support substrate 12, to produce a GaN layered substrate 10 having, on the support substrate 12, a GaN thin film 13a having a surface of a Ga polar face. A GaN layered substrate having a good crystallinity and a surface of a Ga face is obtained by a single transfer process.

Provided is a method for manufacturing an EL device (2), the method including peeling a mother substrate (50) from a layered body (7) including a light-emitting element layer (5) with irradiation with a laser (62). The mother substrate (50) and the layered body (7) are in contact with each other with a resin layer (12) of the layered body (7) interposed therebetween, and in a case that the peeling is performed by irradiating the resin layer (12) with the laser (60), the irradiation is performed on at least a part of an end portion of the resin layer (12) under a condition different from that in a central portion of the resin layer (12).

A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.

A label applicator with a label peeling function includes a frame supported by a support machine, a suction unit that is supported by the frame and has a suction pad, a claw member having a sharp tip that is disposed under the suction pad, a moving mechanism that is supported by the frame, and supports the claw member so as to be movable in an up-down direction relative to the suction pad, and a lock device that locks movement of the claw member in the up-down direction relative to the suction pad, in a state where the suction pad is placed on top of and in contact with an end of a label lying on the tip of the claw member.

Disclosed is a thin subject assisted debonding method for separating temporarily bonded workpiece-carrier pair. The thin subject can be a thin wire, or thin filament, or thin blade. The thin subject can be applied between the workpiece and carrier pair in association with laser debonding or mechanical debonding to provide well controlled and targeted wedging function to the delaminating temporary adhesive and its adjacent substrate to which it is separating from. The workpiece can be a semiconductor wafer that has been thinned and processed, and the carrier can be a semiconductor non-device wafer or any other rigid substrate such as a glass wafer or panel. The application of a thin subject between the workpiece and carrier during debonding provides the advantage of high throughput and low defect rate.

A method and apparatus for replacement of damages display shield (typically glass) covering a display screen on a device, typically a mobile phone. Mobile phones have an electronic display protected by a glass shield. Between the glass and the display is often a plastic polarizing or other intermediary sheet. Removal of a damage glass can be accomplished by cutting thru the polarizer with a moving wire or blade. This separates the glass from the sensitive display and allows replacement of the glass without damaging the more expensive display.