A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

An alloy ribbon that is an alloy ribbon containing a metal as a main component, and has a recess on at least one principal surface, in which a depth of the recess is 5% or more and 75% or less of an average thickness.

A composite panel having a plurality of carbon plies, a perforated metallic foil comprising several apertures and being secured to the plurality of carbon plies, and a protective layer made from resin secured to the metallic foil. The perforated metallic foil is embedded in the protective layer through its apertures. A free surface of the protective layer forms a top side of the composite panel. The thickness of the protective layer between the top side of the composite panel and the perforated metallic foil is at least 15 micrometers and the perforated metallic foil has a thickness of not more than 30 micrometers. The plurality of apertures in the aggregate defines an open area of not more than 40% of the surface area and a maximum distance between two opposed points in a perimeter of an aperture is equal to or less than 3 mm

Surface-treated copper foils including a copper foil having a first side and an opposite-facing second side and two treatment layers disposed on the first side and the second side respectively are described. Each treatment layer provides a treated surface which exhibit a ten-point average roughness Rz in a range of 1.2 m to 4.6 m and a peak density (Spd) in a range of 490,000 to 1,080,000 mm.sup.2. Additionally, the Cr content in each of the treatment layers is a range of 25 to 70 g/dm.sup.2. The surface-treated copper foils have excellent electrode active material coating properties, such as good adhesion and uniformity.

To provide a copper-coated magnesium wire which meets the demand for a lightweight coil wire material, and a method for manufacturing the same. The above-described problem is solved by a copper-coated magnesium wire (10) comprising a core material (1) made of magnesium, and a copper coating layer (2) made of copper or a copper alloy provided on a surface of the core material (1). In the copper-coated magnesium wire (10), a wire drawing mark is present on a surface of the copper coating layer (2), and the diameter is preferably within a range of 0.03 to 0.08 mm, inclusive. Further, a thickness of the copper coating layer (2) is preferably within a range of 5 to 30%, inclusive, as a ratio of the overall cross-sectional area. An insulating coating layer (3) may be provided on an outer circumferential side of the copper coating layer (2).

A steel sheet with a metallic coating is provided. A composition of the metallic coating includes from 2.0 to 24.0% by weight of zinc, from 7.1 to 12.0% by weight of silicon, optionally from 1.1 to 8.0% by weight of magnesium, and optionally additional elements chosen from Pb, Ni, Zr, or Hf. The content by weight of each additional element is less than 0.3%. A balance of the composition is aluminum, unavoidable impurities and residual elements. A ratio Al/Zn is from 4.0 to 6.0.

An aluminum member includes: a base material made of aluminum or an aluminum alloy; and an anodized coating including a barrier layer on a surface of the base material and a porous layer on the barrier layer, wherein the anodized coating contains phosphorus (P) and sulfur (S), and has a thickness of 100 m or less, and, in a depth direction heading from a surface of the anodized coating toward the base material, a depth providing a maximum content of S in a region situated at a depth of 500 nm or more from the surface of the anodized coating is larger than a depth providing a maximum content of P, and an inequality (the maximum content of S)>(the maximum content of P) holds.

There is provided a copper foil provided with a carrier providing excellent chemical resistance against the copper flash etching solution during the formation of the wiring layer on the surface of the coreless support and excellent visibility of the wiring layer due to high contrast to the antireflective layer in image inspection after copper flash etching. The copper foil provided with a carrier comprises a carrier; a release layer provided on the carrier; an antireflective layer provided on the release layer and composed of at least one metal selected from the group consisting of Cr, W, Ta, Ti, Ni and Mo; and an extremely-thin copper layer provided on the antireflective layer; wherein at least the surface adjacent to the extremely-thin copper layer of the antireflective layer comprises an aggregate of metal particles.

The present invention is intended to provide a roll-bonded laminate, in which an ultrathin metal layer is laminated on another metal without generation of wrinkles, cracks and the like.

A roll-bonded laminate formed by lamination of at least three layers, which comprises a peelable carrier layer 10, an ultrathin metal layer 20 and a metallic foil 30, wherein the thickness of the ultrathin metal layer 20 is 0.5 m or more and 20 m or less.

A metal foil for electromagnetic shielding, comprising: a metal foil base having a thickness of exceeding 4 m, an alloy layer having an A element configured of Sn or In and a B element group selected from the group consisting of one or more of Ag, Ni, Fe and Co formed on one or both surfaces of the base, and an underlayer having the B element group formed between the alloy layer and the base, wherein an adhesion amount of the A element is 10 to 300 mol/dm.sup.2, and a total adhesion amount of the B element group is 40 to 900 mol/dm.sup.2.