Patent classifications
Y10T428/12438
Surface-treated copper foil
The present disclosure relates to an improved, surface-treated copper foil that is resistant to rusting and discoloration. More specifically, the surface-treated copper foil is chromium-free and includes: (a) a copper foil; optionally, (b) a barrier layer on one or both sides of the copper foil, the barrier layer comprising Ni, Zn, Co, Mn, Sn or a mixture thereof; and (c) an organic layer coupled to the one or both sides of the copper foil or one or both barrier layer(s), wherein the sum total of the N, S, and Si elements of the organic layer is more than 5 normalized atomic %.
Surface-treated steel sheet for battery containers, battery container, and battery
A surface-treated steel sheet for battery containers is provided. The surface-treated sheet is used to form a battery container for a battery. The battery uses a nonaqueous electrolytic solution as an electrolytic solution. The surface-treated steel sheet includes a base material made of steel and an iron-nickel diffusion layer formed by performing thermal diffusion treatment after forming a nickel plating layer at least on a surface of the base material to be located at the inner surface side of the battery container. The iron-nickel diffusion layer has an outermost layer of which a ratio of Ni and Fe is 7.5 or less as a molar ratio of Ni/Fe. The iron-nickel diffusion layer has a thickness of 0.6 m or more.
Electrolytic copper foil, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same
An electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite to the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first protective layer includes chromium (Cr) and the first surface of the electrolytic copper foil has an adhesion factor of 1.5 to 16.3.
Electrolytic copper foil for graphene and method for producing the copper foil
The present disclosure relates to an electrolytic copper foil for graphene and a method for producing the copper foil, in which, in the manufacture of the electrolytic copper foil for graphene, addition of nickel facilitates the synthesis of the graphene. The addition of nickel which serves as a seed in the synthesis of graphene on electrolytic copper foil reduces the electrical conductivity after graphene synthesis. As a result, graphene is uniformly formed on the surface of the copper foil. Further, the present disclosure may provide the electrolytic copper foil for graphene and the method for producing the copper foil in which an electrolytic copper foil having a resistance value of less than 300 ohm/square after the synthesis of the graphene on the electrolytic copper foil is produced, thereby, facilitate the formation of graphene on the electrolytic copper foil.
Electrodeposited copper foil
Electrodeposited copper foils having properties suitable for use as current collectors in lithium-ion secondary batteries are disclosed. The electrodeposited copper foils include a drum side and a deposited side. At least one of the deposited side or the drum side has a root mean square slope (Rq) in the range of about 0.03 to about 0.23. In this manner, the copper foil has good durability and workability, as well as good performance as current collectors in lithium-ion secondary batteries.
Method for producing a foil arrangement and corresponding foil arrangement
A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.
Aluminum member and method of manufacturing the same
An aluminum member includes: a base material made of aluminum or an aluminum alloy; and an anodized coating including a barrier layer on a surface of the base material and a porous layer on the barrier layer, wherein the anodized coating contains phosphorus (P) and sulfur (S), and has a thickness of 100 ?m or less, and, in a depth direction heading from a surface of the anodized coating toward the base material, a depth providing a maximum content of S in a region situated at a depth of 500 nm or more from the surface of the anodized coating is larger than a depth providing a maximum content of P, and an inequality (the maximum content of S)>(the maximum content of P) holds.
Sheet steel having a deterministic surface structure
The invention relates to a sheet steel (1) coated with a zinc-based coating and skin-pass rolled with a deterministic surface structure (2), and to a method for producing it.
SHEET STEEL HAVING A DETERMINISTIC SURFACE STRUCTURE
The invention relates to a sheet steel (1) coated with a zinc-based coating and skin-pass rolled with a deterministic surface structure (2), and to a method for producing it.
Copper-titanium alloy foil having plated layer
The present invention provides a titanium copper foil having improved adhesion to solder and higher resistance to discoloration due to a high temperature and high humidity environment, an acid solution or an alkaline solution, and as well as having improved etching processability. The present invention provides a titanium copper foil comprising a base metal, the base metal having a composition containing Ti of from 1.5 to 5.0% by mass, the balance being copper and inevitable impurities, and having a thickness of from 0.018 to 0.1 mm, wherein the titanium copper foil has an Sn plated layer on a surface of the base metal, and has an adhesive strength of 0.5 N or more as measured by a solder adhesive strength test according to the definition in the specification.