Y10T428/12438

ULTRA-THIN METALLIC FOIL FOR LIGHTNING STRIKE PROTECTION

A metallic foil for lightning strike protection in a composite aerospace structure having a length, a width, and a thickness of not more than 30 microns. There are a plurality of pores of a predefined geometric shape extending through the thickness of the metallic foil and being distributed across a surface area defined by the length and the width of the metallic foil. The plurality of pores in the aggregate define an open area of not more than 40% of the surface area and the metallic foil has a weight of not more than 115 g/m.sup.2. The metallic foil has a weight to conductivity ratio of not more than 0.40 gram-ohms per square.

Surface-treated copper foil and method for manufacturing same
11952675 · 2024-04-09 · ·

Provided is a surface-treated copper foil in which in order to avoid failures of electronic parts by corrosion, a high bond strength between an electrolytic copper foil and a resin base material can be maintained even when the surface-treated copper foil is exposed to corrosive gases and microparticles, and a method for manufacturing the same. The surface-treated copper foil of the present invention comprises an electrolytic copper foil, a roughened layer covering at least one surface side of the electrolytic copper foil, and a rust preventive layer further covering the roughened layer, wherein the rust preventive layer is at least one surface of the surface-treated copper foil; the rust preventive layer comprises at least a nickel layer; and the thickness of the nickel layer is 0.8 to 4.4 g/m.sup.2 in terms of mass per unit area of nickel; and the noncontact roughness Spd of the rust preventive layer is 1.4 to 2.6 peaks/?m.sup.2 and the surface roughness RzJIS of the rust preventive layer is 1.0 to 2.5 ?m. The method for manufacturing the surface-treated copper foil forms the roughened layer having higher roughnesses than the noncontact roughness Spd and surface roughness RzJIS on one surface of the electrolytic copper foil, and thereafter forming the rust preventive layer meeting the predetermined condition.

Rectangular rolled copper foil, flexible flat cable, rotary connector, and method of manufacturing rectangular rolled copper foil

A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5 from a Cube orientation is greater than or equal to 8%.

COPPER-COATED MAGNESIUM WIRE AND METHOD FOR MANUFACTURING THE SAME
20190283097 · 2019-09-19 · ·

To provide a copper-coated magnesium wire which meets the demand for a lightweight coil wire material, and a method for manufacturing the same. The above-described problem is solved by a copper-coated magnesium wire (10) comprising a core material (1) made of magnesium, and a copper coating layer (2) made of copper or a copper alloy provided on a surface of the core material (1). In the copper-coated magnesium wire (10), a wire drawing mark is present on a surface of the copper coating layer (2), and the diameter is preferably within a range of 0.03 to 0.08 mm, inclusive. Further, a thickness of the copper coating layer (2) is preferably within a range of 5 to 30%, inclusive, as a ratio of the overall cross-sectional area. An insulating coating layer (3) may be provided on an outer circumferential side of the copper coating layer (2).

Steel Sheet Coated with a Metallic Coating based on Aluminum

A steel sheet with a metallic coating is provided. A composition of the metallic coating includes from 2.0 to 24.0% by weight of zinc, from 7.1 to 12.0% by weight of silicon, optionally from 1.1 to 8.0% by weight of magnesium, and optionally additional elements chosen from Pb, Ni, Zr, or Hf. The content by weight of each additional element is less than 0.3%. A balance of the composition is aluminum, unavoidable impurities and residual elements. A ratio Al/Zn is from 4.0 to 6.0.

HIGH-FREQUENCY AND HIGH-TRANSMISSION SPEED FPC WITH FRCC AND PREPARATION METHOD THEREOF

A high-frequency and high-transmission speed FPC with FRCC. The FPC includes FRCC and a double-sided board laminated again each other. The FRCC includes a third copper foil layer, a second ultra-low dielectric adhesive layer and a second insulating layer located between the third copper foil layer and the second ultra-low dielectric adhesive layer. One surface of the third copper foil layer is an inner surface. The double-sided board includes a first copper foil layer, a second copper foil layer and a first insulating layer located between the first copper foil layer and the second copper foil layer. An inner surface of the first copper foil layer has an Rz value of 0.05-0.5 m. An inner surface of the second copper foil layer has an Rz value of 0.1-1.10 m. The FPC has a good electrical property, a simple structure, a cost advantage, a brief preparation process, and a low thermal expansion coefficient.

LAMINATED MEMBER, METHOD FOR MANUFACTURING SAME, LAMINATED BODY, AND MOTOR
20190202175 · 2019-07-04 ·

A laminated member as a laminate of a plurality of alloy ribbons is used. The laminated member has a side surface with a fracture surface. A laminated body as a laminate of the laminated member is used. A motor that includes a core using the laminated body is used. A method for manufacturing a laminated member is used that includes: fixing a plurality of amorphous ribbons to one another in a part of layers of the amorphous ribbons after laminating the amorphous ribbons; and punching a laminated member by cutting the laminate of the amorphous ribbons at a location that excludes the portion fixing the amorphous ribbons in the laminate.

Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device

A carrier-attached copper foil having good circuit formability is provided. The carrier-attached copper foil has a carrier, an intermediate layer and an ultra-thin copper layer in this order, the average grain size of crystal grains that form the ultra-thin copper layer is 1.05 to 6.5 m, and a ten point average roughness Rz of a surface on a side of the ultra-thin copper layer is 0.1 to 2.0 m.

ELECTRODEPOSITION IN IONIC LIQUID ELECTROLYTES

An article comprising an electrodeposited aluminum alloy is described herein. The electrodeposited aluminum alloy comprises an average grain size less than approximately 1 micrometer. The electrodeposited aluminum alloy thickness is greater than approximately 40 micrometers. A ductility of the electrodeposited aluminum alloy is greater than approximately 2%.

Electrical shielding material composed of metallized stainless steel monofilament yarn

A yarn or multi-fiber formed of a plurality of micron diameter stainless steel monofilaments which have been rendered more conductive by one or more coatings of electrolytically-deposited metal or metal alloy materials. The metallized yarn provided by the invention has a very low electrical resistance, with consequent benefit in electrical performance, and is particularly useful as an RFI/EMI shielding material.