A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f.sub.3t.sub.3)/(f.sub.2t.sub.2)=>1 wherein t.sub.2 (mm) is a thickness of the copper foil, f.sub.2 (MPa) is a stress of the copper foil under tensile strain of 4%, t.sub.3 (mm) is a thickness of the resin layer, f.sub.3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2: 1<=33f.sub.1/(FT) wherein f.sub.1 (N/mm) is 180 peeling strength between the copper foil and the resin layer, F(MPa) is strength of the copper foil composite under tensile strain of 30%, and T (mm) is a thickness of the copper foil composite, wherein a Cr oxide layer is formed at an coating amount of 5 to 100 g/dm.sup.2. is formed on a surface of the copper foil on which the resin layer is not laminated.

The invention relates to a metallized multilayer sheet material for packaging having a water vapour transmission rate of below 5 g/m.sup.2/day at 38 C. RH:90% comprising: a water vapour permeable sheet substrate, and at least two metallized layers, each covered directly by a solvent based polymeric coating layer,
wherein the cumulated metallized layers have an optical density of at least 2.5 and/or a thickness of at least 15 nm.

A substrate for flexible device, including a stainless steel sheet, an oxide layer formed on a surface of the stainless steel sheet, and a glass layer of electrically-insulating bismuth-based glass formed in a form of layer on the surface of the oxide layer. Also disclosed is a sheet for flexible device, including a stainless steel sheet, and an oxide layer on a surface of the stainless steel sheet, the oxide layer having a thickness of not less than 30 nm.

Provided is an ultrathin copper foil which has improved thickness accuracy of an ultrathin copper layer on a supporting copper foil. An ultrathin copper foil which is provided with a supporting copper foil, a releasing layer that is laminated on the supporting copper foil, and an ultrathin copper layer that is laminated on the releasing layer. The thickness accuracy of the ultrathin copper layer as determined by a weight thickness method is 3.0% or less.

There is provided a surface-treated steel sheet for battery containers. The surface-treated sheet is used to form a battery container for a battery. The battery uses a nonaqueous electrolytic solution as an electrolytic solution. The surface-treated steel sheet is characterized by the features as below. The surface-treated steel sheet includes a base material made of steel and an iron-nickel diffusion layer formed by performing thermal diffusion treatment after forming a nickel plating layer at least on a surface of the base material to be located at the inner surface side of the battery container. The iron-nickel diffusion layer has an outermost layer of which a ratio of Ni and Fe is 7.5 or less as a molar ratio of Ni/Fe. The iron-nickel diffusion layer has a thickness of 0.6 m or more.

An electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite to the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first protective layer includes chromium (Cr) and the first surface of the electrolytic copper foil has an adhesion factor of 1.5 to 16.3.

A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.

A rectangular rolled copper foil includes copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa. In a cross section perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5 from a Cube orientation is greater than or equal to 8%.

A method for producing a foil arrangement includes structuring a conductive foil to be applied or applied onto a support foil upper side of a support foil and coating a conductive foil upper side of the structured conductive foil with a protective layer. A cover foil is laminated onto the support foil upper side and onto a protective layer upper side of the protective layer after the coating step.

A compound superconducting wire 10 includes a reinforcement portion 12 and a compound superconductor 11. In the reinforcement portion 12, an assembly of plural reinforcement elements 4 are disposed. The reinforcement elements 4 each include plural reinforcement filaments 1 disposed in a stabilizer 2, and a stabilizing layer 3 at the outer periphery thereof. The reinforcement filaments 1 each mainly contain one or more metals selected from the group consisting of Nb, Ta, V, W, Mo, Fe, and Hf, an alloy consisting of two or more metals selected from the aforementioned group, or an alloy consisting of copper and one or more metals selected from the aforementioned group.