A joint structure includes: a first same-type metal member; a second same-type metal member that can be mutually welded with the first same-type metal member; and a different-type member that has a penetrating portion, is interposed between the first same-type metal member and the second same-type metal member. In the plate thickness direction of an emission region in which a laser beam is emitted toward the penetrating portion, the plate thickness at the emission region of the first same-type metal member positioned on the side on which the laser beam is emitted is a predetermined thickness corresponding to a first gap. The first same-type metal member and the second same-type metal member are fused and bonded together via the penetrating portion, and the different-type member is compressed and fixed, such that the different-type member is fixed to the first same-type metal member and the second same-type metal member.

An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.

A soldering method in which abrasive particles, in particular cubic boron nitride, are applied in a matrix composed of a solder material and are intended to have better adhesion in the matrix material. The particle which includes an abrasive particle, in particular of cubic boron nitride, is coated with a metal. A method for producing a layer on a substrate, wherein a solder material is applied as metallic matrix material such with particles, in particular solder material in the form of a soldering paste, a soldering tape, a solder powder, by an application method, in particular by a welding process or a thermal spraying process.

A multi-layered board includes: a middle conductive layer; a first dielectric layer that is disposed directly on a first surface of the middle conductive layer; a second dielectric layer that is disposed directly on a second surface of the middle conductive layer; a first outer surface conductive layer that is disposed directly on an outer side of the first dielectric layer; and a second outer surface conductive layer that is disposed directly on an outer side of the second dielectric layer. The first outer surface conductive layer serves as a first outer surface of the multi-layered board, and the second outer surface conductive layer serves as a second outer surface of the multi-layered board. The middle conductive layer is solidly formed over an entire planar direction of the multi-layered board. The first dielectric layer and the second dielectric layer each independently have a thickness variation of 15% or less.

An article includes a substrate and a barrier layer on the substrate. The barrier layer includes a matrix, diffusive particles dispersed in the matrix, and gettering particles dispersed in the matrix. The gettering particles include at least one alloyed metal silicide. A composite material and a method of fabricating an article are also disclosed.

Light weight composites with high flexural strength comprise epoxy foam sandwiched between two layers of facing material have high strength and low weight and can be used to replace steel structures. The facing layer may be fibrous material especially glass or carbon fibres, the facing material is preferably embedded into the epoxy matrix. Alternatively they may be matching box structures or concentric metal tubes. The sandwich structures may be prepared by laying up the fibre; coating and/or impregnating the layer with epoxy resin, laying a layer of heat activatable foamable epoxy material, providing a further layer of the fibrous material optionally coated and/or impregnated with epoxy resin on the foamable material and healing to foam and cure the epoxy materials. Alternatively they may be formed by extrusion of the foamable material between the surface layers.

A surface piece of crossing threads (12, 14) comprising plastic filaments, which as a woven fabric web (10) is equipped with two mutually opposing surfaces and with openings (16) formed therein. The fabric web comprises a metallisation applied on one side as a surface layer and between 15 and 80%, in particular between 20 and 70% of the fabric web is configured in the form of network intermediate spaces (16).

Light weight composites with high flexural strength comprise epoxy foam sandwiched between two layers of facing material have high strength and low weight and can be used to replace steel structures. The facing layer may be fibrous material especially glass or carbon fibres, the facing material is preferably embedded into the epoxy matrix. Alternatively they may be matching box structures or concentric metal tubes. The sandwich structures may be prepared by laying up the fibre; coating and/or impregnating the layer with epoxy resin, laying a layer of heat activatable foamable epoxy material, providing a further layer of the fibrous material optionally coated and/or impregnated with epoxy resin on the foamable material ad heating to foam and cure the epoxy materials. Alternatively they may be formed by extrusion of the foamable material between the surface layers.

A metal-ceramic substrate (1) comprising an insulating layer (11) comprising a ceramic and having a first thickness (D1), and a metallization layer (12) bonded to the insulation layer (11) and having a second thickness (D2),
wherein the first thickness (D1) is less than 250 μm and the second thickness (D2) is greater than 200 μm and wherein the first thickness (D1) and the second thickness (D2) are dimensioned such that a ratio of an amount of the difference between a thermal expansion coefficient of the metallization layer (12) and a thermal expansion coefficient of the metal-ceramic substrate (1) to a thermal expansion coefficient of the metal-ceramic substrate (1)
has a value less than 0.25, preferably less than 0.2 and more preferably less than 0.15 or even less than 0.1.

An insulated circuit board which is obtained by bonding a circuit layer onto one side of a ceramic substrate, and bonding a metal layer made of copper or copper alloy onto the other side of the ceramic substrate; and a heat sink which is bonded to the metal layer are included; the heat sink has a first metal layer made of aluminum or aluminum alloy joined to the metal layer, a ceramic board material joined to the first metal layer at an opposite side to the metal layer, and a second metal layer made of aluminum or aluminum alloy joined to the ceramic board material at an opposite side to the first metal layer; a thickness T1 of the first metal layer and a thickness T2 of the second metal layer are 0.8 mm to 3.0 mm inclusive; and a thickness ratio T1/T2 is 1.0 or more.