An elastic body and an electronic device are provided. The electronic device includes a casing, an electronic component, and a conductive base. The electronic component and the conductive base are installed in the casing. The conductive base includes a base body and the elastic body. The base body has a first opening. The elastic body includes a bottom plate and an elastic part. The bottom plate is installed on the base body and has a second opening. The first opening is communicated with the second opening. The elastic part is connected to the bottom plate and has a contacting portion. The contacting portion is installed corresponding to the second opening, and the contacting portion contacts the electronic component.

A beaded composite panel is fabricated using composite plies. An opening is formed in each of plies, and each ply is laid up on a bead feature and drawn down over the bead feature in the area of the opening so as to widen the opening into a gap allowing the ply to conform to the contour of the bead feature. Patches are fabricated and placed on the plies overlying over the openings. The laid-up plies are compacted and cured.

A patterned apertured web is disclosed. The patterned apertured web includes a plurality of land areas in the patterned apertured web and a plurality of apertures defined in the patterned apertured web. At least some land areas of the plurality of land areas surround at least some apertures of the plurality of apertures. The patterned apertured web has an Effective Open Area in the range of about 3% to about 30%, according to the Aperture Test herein. The patterned apertured web has a plurality of Interaperture Distances, according to the Aperture Test herein. The Interaperture Distances have a distribution having a median and a mean. The plurality of apertures include a first set of apertures defining a first shape and a second set of apertures defining a second shape.

A cover glass for an electronic display comprises a plurality of layers of sapphire material, each of the layers having a substantially single crystal plane orientation, with adjacent layers having different substantially single crystal plane orientations. One or more interface layers are defined between adjacent layers of the sapphire material, with the adjacent layers of sapphire material bonded together at the one or more interface layers. A display window is defined in the cover glass, and configured for viewing a viewable area of the electronic display through the plurality of layers of the sapphire material bonded together at the one or more interface layers.

Aspects herein relate to apparel items and apparel systems that utilize applied or printed foam nodes to provide, among other things, stand-off between an apparel item and a wearer's skin surface. One or more of the foam nodes, or areas of the textile surrounding the foam nodes, may be perforated to provide a fluid communication path between an inner-facing surface and an outer-facing surface of the apparel item. The communication path may be used to facilitate air exchange between the external environment and the wearer's body and/or to provide an exit path for moisture vapor generated by the wearer.

A laminate substrate for receiving a semiconductor chip. Included are laminate layers stacked to form the laminate substrate, each laminate layer includes a core that includes particle-filled epoxy and a metallic layer on the core. At least one laminate layer has a radial cut through the metallic layer, the radial cut extending from a periphery of the at least one laminate layer towards a center of the at least one laminate layer. The radial cut cuts only through the metallic layer and does not cut through the core.

A ceramic matrix composite article, method for forming the article, and perforated ply which may be incorporated therein are disclosed. The article includes at least one shell ply forming an exterior wall having first and second portions and defining a plenum. An annular brace formed of at least one structural support ply is disposed within the plenum, including a first integral portion integral with and part of the first portion of the exterior wall, a first curved portion extending from the first integral portion and curving across the article plenum to the second portion of the exterior wall, a second integral portion integral with and part of the second portion of the exterior wall, a second curved portion extending from the second integral portion and curving across the article plenum to the first curved portion, and an overlap in which the first and second curved portions are integral.

A lighted assembly includes a perforated member having a plurality of relatively small openings therethrough. The openings are arranged to provide areas forming letters, designs, or the like. A light source may be positioned adjacent the perforated member whereby light from the light source travels through the openings to form illuminated letters, designs or the like. The perforations may be filled with a light-transmitting polymer material. The light source may comprise an LED and a light guide that distributes light along a lower side of the perforated member. The light source may be positioned in a waterproof housing that is sealed to the perforated member.

Each lamination of the lamination stack comprises at least one assembly of coupling elements, said assembly comprising one insertion clamp, one receiving clamp and at least one receiving window, said coupling elements maintaining the same relative positioning from one another, the insertion clamp and the receiving clamp being defined by respective portions of the lamination axially projecting to the same side of the latter, each insertion clamp of a lamination being fitted, by interference, in the interior of a receiving clamp of an adjacent lamination, and each receiving clamp of a lamination being housed in the receiving window of at least one lamination of the stack.

Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.